Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry's broadest selection of electronic components available for immediate shipment, today announced it has stock on Molex's Mini-Fit H2O sealed connector system.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the new VIA VX900 media system processor, a full featured single chip solution that will be coupled with the latest VIA Nano-3000 Series processors to bring truly stunning video playback to the latest HD online video services.
Fort Sam Houston received 20 Neighborhood Electric Vehicles (NEVs) in January as part of a larger plan to replace petroleum-based DoD vehicles with more “energy-efficient” transportation. The Army plans on replacing up to 28,000 gas-powered ground support vehicles with electric vehicles at more than 155 Army installations worldwide.
In response to customers demanding more power in a smaller space, gearmotor and electric motor manufacturer, Bison Gear & Engineering Corp. has introduced its new 100mm AC motor line offering 1/8 hp (93w) in 30% less volume than previously available.
Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, today announced the expansion of its 16-bit dsPIC Digital Signal Controller (DSC) portfolio for digital power-conversion applications.
General Motors has developed a working next-generation heads-up display that turns an ordinary windshield into an augmented reality information dashboard.
Texas Instruments introduced the first in a family of fully integrated analog front ends (AFEs) for portable and high-end electrocardiogram (ECG) and electroencephalogram (EEG) equipment, as well as patient monitoring and consumer medical applications. The eight-channel, 24-bit ADS1298
IDEC now has a new 5.7” HG2G OI touchscreen model with 12V DC for applications limited to battery-power or using low-voltage solar energy. The panel depth is 36 mm for limited , and it is available as a monochrome (500 cd/m2) or 256-color (350cd/m2) display. An optional built-in Ethernet port (10/100 BaseT) allows
New EIA 0201 Multilayer Chip Varistors from Taiyo Yuden are designed to protect today’s slim and compact hand-held mobile devices against electrostatic discharge (ESD). Both the VR063 101A120 and the VR063 101A080 boast the same varistor voltage, ESD resistance and other electrical characteristics as Taiyo Yuden’s previous highly regarded EIA 0402 model.
A team at the University of Florida has discovered that functionalized fullerenes heat, ignite, glow and transform into other carbon nanostructures such as carbon nanotubes upon exposure to low-intensity laser light.
The French Special Forces Command is now equipped with an unspecified number of Skylark 1 and Wasp Unmanned Aerial Vehicles (UAVs). The French Armament Procurement Agency (Direction générale de l'armement, DGA) made the handoff on March 8th...
ORIENTAL MOTOR USA CORP. announces the release of the CRK Series of 5-Phase stepping motors and drivers with a built-in RS-485 compatible controller packages that offer motion that is smooth, quiet and accurate. The RS-485 based controller allows for up to 16 axes to be controlled from one RS-485 Master controller.
Although common in the data-communications industry, plugfests are less familiar to those of us who work in mobile communications.
Now here’s some news tailor-made for a Friday: the Indian Army is developing a “chili grenade.” Packed with bhut jolokia peppers (aka the world’s hottest chili pepper), these special grenades will be used as non-lethal munition. Check your calendars, folks. It isn’t April 1st yet.
Pulse introduced what it asserts is the first digital subscriber line (DSL) NanoFilter. The Z-321NF in-line DSL customer premises equipment (CPE) MicroFilter offers both voice and data protection by
Narda, an L-3 Communications company, introduced the Model MS-SMA-020 SPDT fail-safe RF mechanical switch that operates from DC to 3 GHz. It is appropriate for
Logic Supply introduced an ultra-slim, fanless Intel Atom system housed in a ruggedized, small-footprint enclosure. A flexible, efficient solution for seamless deployment in industrial environments, public access areas, or remote locations, the SolidLogic Atom JT01 is designed to
SiTel Semiconductor today announced how its successful collaboration with Target Compiler Technologies led to the creation of customized audio DSPs for its SC14452 Green VoIP processor.
Janus Remote Communications expanded its Terminus platform of GSM/GPRS, CDMA, and UMTS modem devices to include board-level, plug-in modules for use in wireless communication applications. Developed in cooperation with wireless module manufacturer Telit Wireless Solutions, these interchangeable modules are
As the semiconductor industry has grown dramatically over the last 30 years, so to has the counterfeiting of semiconductors.
CogniVue Corporation, an innovator in programmable Image Cognition Processors (ICPs) enabling real-time embedded image and video analytics applications, and Future Electronics today announced the CV220X series of ICPs.
The ARM Workbench is built on the standard Eclipse development environment providing outstanding windows management, project management, and C/C++ source code editing tools. Users can use DS-5 as a stand-alone Eclipse installation or as plug-ins to an existing Eclipse environment.
The Actel SmartFusion is the industry's first intelligent mixed signal FPGA and the only device to integrate a flash FPGA, hard ARM® Cortex™-M3-based microcontroller subsystem, and programmable analog. The Actel SmartFusion FPGA is based on Actel´s flash technology and offers full customization, IP protection, and ease-of-use.
There is no question the overwhelming majority of ‘mechanical’ energy utilized in this country has as its source the output of Heat Engines, i.e. devices that convert stored solar energy in fossil fuels to ‘mechanical work’.
Skyworks Solutions, Inc. has introduced a family of ultra-wideband fixed attenuator pads with a unique through-die via and split ground configuration that provide improved high frequency return loss, attenuation tolerance, flatness, and power handling performance.