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The Tinker's Toolbox - Talking about IP Cores and Embedded Systems Development

July 7, 2011 6:05 am | Podcasts | Comments

In this episode, we talk to Simon Hambly and David Harold of Imagination Technologies, creators of communications semiconductor IP cores for highly complex System-on-Chip (SoC) devices.

Single Board Computer Supports LGA775 Intel Core 2 Quad SBC with VGA-Dual GbE

July 7, 2011 6:02 am | Product Releases | Comments

Advantech announces the new PICMG 1.0 full-sized single board computer—PCA-6011, designed with the Intel G41 and the ICH7R chipset for industrial applications. PCA-6011 is a high performance quad core SBC with strong I/O capability.

WaferSense Vibration Sensor Helps Identify Vibration Sources to Increase Wafer Yield

July 7, 2011 5:53 am | Product Releases | Comments

When a diffusion furnace team at a 200 mm fab experienced defect problems in specific stocker locations of its high volume semiconductor process, CyberOptics WaferSense Auto Vibration Sensors (AVS) helped test a theory that excessive vibrations created by stocker fans effected die yield.

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Return to Zero - Going Mad

July 7, 2011 5:41 am | Articles | Comments

Return to Zero is a funny comic strip for engineers, with lab humor, odd situations, and exploding circuits that of course makes a sport out of solving the trickiest of engineering problems.

Laser-Structured 2.4 GHz Antennas Suit a Variety of General Applications

July 7, 2011 5:35 am | Product Releases | Comments

Molex Incorporated has released a new standard antenna for applications using the 2.4 GHz ISM (industrial, scientific and medical) band and Wi-Fi.

ECG Cardiac Monitor Saves Lives and Cuts Costs

July 7, 2011 5:03 am | Product Releases | Comments

Ultra low power RF specialist Nordic Semiconductor announces that British medical services startup, Isansys Lifecare Limited, has announced the world's first commercially-available, clinical-grade, wireless cardiac monitor to support low cost continuous ECG heart monitoring.

Ramtron Samples 64-Kilobit Serial F-RAM

July 7, 2011 4:53 am | Product Releases | Comments

Ramtron International announced sampling of its newest ferroelectric random access memory (F-RAM) product built on the company’s manufacturing line at IBM.

Rapid-Ship Board Level Shields

July 7, 2011 4:48 am | Product Releases | Comments

To help alleviate some of this pressure, Leader Tech announces the introduction of a new SMS Surface Mount Shield series.

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Celebrating the Future of the Electronics Industry

July 7, 2011 4:43 am | by Jeff Jussel, senior director for global technology, element14 | Blogs | Comments

Since Newark’s  element14 community launched two years ago, we’re proud of the fact that hundreds of thousands of engineers have used our resources to connect and collaborate with industry experts and peers.

DC Connectors and Terminals Are IP67-sealed with Internal Locking Mechanism

July 6, 2011 2:11 pm | Product Releases | Comments

Molex is expanding its range of SolarSpec products with the development of pin (male) and socket (female) panel-mount DC connectors. The IP67-sealed, SolarSpec panel-mount DC connectors, with internal locking and touch-proof design for

Chip Resistors Offer 1 Percent Tolerance With Precision and Pulse Withstanding

July 6, 2011 1:04 pm | Product Releases | Comments

The RPC Series of film based chip resistors is available in a 1 percent tolerance with desirable pulse handling. This performance is achieved by using a robust film element with a limited laser trim. Trimming a chip resistor can

Sensors Deliver Enhanced Technology for Next Generation Smartphones

July 6, 2011 12:23 pm | Product Releases | Comments

Texas Advanced Optoelectronic Solutions, Inc. (TAOS; www.taosinc.com) today announced its 5th generation sensor family, the TSL2x72 Series, that delivers improved digital ambient light sensing (ALS) and proximity detection technology.

Auto-calibrating CMOS 3D Digital MEMS Compasses Offer Cost-Effective Performance

July 6, 2011 11:49 am | Product Releases | Comments

Until now, 3D Compasses have typically used non-standard technologies such as magneto-resistive materials or Hall-effect structures combined with magnetic field concentrators to detect the direction of the Earth’s magnetic field.

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Lightweight Composite BNC 75 ohm HDTV Connector

July 6, 2011 11:48 am | Product Releases | Comments

Radiall is proud to introduce the first to market lightweight and easy-to-use composite BNC 75 ohm HDTV connector to its offering of affordable HDTV BNC series for studio quality broadcast production to video conferencing equipment applications.

AdvancedMC Module Includes Freescale QorIQ P2020 Processor

July 6, 2011 11:02 am | Product Releases | Comments

Kontron introduced today its new universal single-width AdvancedMC™ processor module AM4120. This board is the first member of a new Kontron AdvancedMC™ product family with the Freescale™ QorIQ processors. The new AdvancedMC™ family is targeted to cost sensitive applications as well as powerful data plane and control plane applications. The universal Kontron AM4120 offers

500 MHz to 20 GHz High Gain Omnidirectional Antenna

July 6, 2011 10:43 am | Product Releases | Comments

SunCastle Microwave announces the availability of its new product: 500 MHz to 20 GHz High Gain Omnidirectional Antenna, patent pending.

Positronic’s Blue Connectors are Green

July 6, 2011 10:40 am | by Gino Nanninga, VP of Sales, Positronic Industries, Inc. | Blogs | Comments

Energy is essential to everyone. Often we do not give thought to where energy comes from or how much we consume until energy is not readily available. Energy has become an area of focus for governments, private industry, and citizens.

Probes Connect as geometries Shrink and Speeds Increase

July 6, 2011 9:45 am | by Chris Loberg, Tektronix, www.tek.com | Articles | Comments

Before you can capture and analyze signals using an oscilloscope, you first have to connect. With trends leaning toward shrinking IC geometries, finer pitch packages and higher data rates, the connect part of the test equation has become increasingly important...

Model 337C Magnetron Transmitter

July 6, 2011 9:24 am | Product Releases | Comments

The Model 337 Power MOSFET Modulator, Magnetron Transmitter from Applied Systems Engineering is designed to operate magnetrons up to 500 kW.

Extending the Reach of Free Boundary-scan Tools

July 6, 2011 9:20 am | Product Releases | Comments

JTAG Technologies is proud to announce the latest extension to its popular JTAGLive family of boundary-scan powered design and repair debug tools for PCBs. JTAGLive Buzz-plus is an extension to the acclaimed free-of-charge Buzz tool that was launched in 2009.

Thermal Management with Embedded Thin-Film Thermoelectrics

July 6, 2011 8:27 am | by Dave Koester, Nextreme Thermal Solutions, Inc., www.nextreme.com | Articles | Comments

As components, packages and systems continue to shrink in size, the heat generated in these dense electronic systems can be quite large and can lead to a significant rise in temperatures that in turn can cause device and system-level failures.

IC Socket Footprint – Why is it important?

July 6, 2011 8:01 am | by Ila Pal, Ironwood Electronics | Articles | Comments

An IC socket can be defined as an electromechanical device, which provides a removable interface between the IC package and the system circuit board with minimal effect on signal integrity. A removable interface is the major reason for using a socket...

Easing Boundary Scan Into In-circuit Testing

July 6, 2011 7:37 am | by Adrian Cheong, Agilent Technologies | Articles | Comments

IEEE Std. 1149.1, or more commonly known as Boundary Scan, is a specification for testing the inter connectivity of components on printed circuit boards. The standard was formed by a consortium of companies known as the Joint Test Access Group or JTAG in 1990.

Return to Zero - Good Morning Sunshine

July 6, 2011 7:21 am | Articles | Comments

Return to Zero is a funny comic strip for engineers, with lab humor, odd situations, and exploding circuits that of course makes a sport out of solving the trickiest of engineering problems.

Advantages to Managing Your Test and Measurement Environment Holistically

July 6, 2011 7:17 am | by Paul McNamara, CEO, The Sente Group | Articles | Comments

In the current competitive climate, organizations everywhere are under pressure to innovate, reduce total costs and accelerate products to market. Today, I’d like to call your attention to one area of your business that can support all three of these efforts...

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