Bill Hutchings of Microchip Technology discusses the company's latest offering of 16-bit PIC microcontrollers (MCUs) and dsPIC Digital Signal Controllers (DSCs) that bring advanced control to cost-sensitive general-purpose and motor-control designs.
Akros Silicon Inc. announced the Energy$ense family of multi-output, digital DC/DC power management unit (DPMU) ICs. Technology features include real-time power measurements and
After Atlantis’ two-week mission, NASA will retire the Space Shuttle. Between the Shuttle’s retirement and the completion of the International Space Station in 2020, the U.S. faces a nine-year gap during which we’ll lack the ability to independently ferry astronauts into space. The Space Shuttle fit the textbook definition of government mismanagement. Envisioned as “routine and economical”, the finished product was neither.
AR RF/Microwave Instrumentation has upgraded its line of laser-powered star probes with a new electric field probe, that replaces the previous model FL7018.
Omega’s new infrared sensor with wireless transmitter features remote IR sensor and radio wireless transmitter in a NEMA enclosure.
ITT Interconnect Solutions has developed a MIL-DTL 38999 Series III style connecter capable of desirable performance in low-pressure applications. The new KJAYA Series Connector uses lightweight aluminum shells that provide a
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduced the DB-1541-S3 Conductive Stringer Attach Adhesive for use in thin-film, organic and thinned silicon solar modules. This material formulation has
Allegro MicroSystems, Inc. announces a new unipolar two-phase constant-current mode motor driver IC which is manufactured and developed by Sanken Electric Co., Ltd. in Japan. The SI-7321M features an efficient unipolar driver design for full- and half-step operation, and 1/4 , 1/8 , and 1/16 microstepping.
Conexant Systems announced the CX20708, presented as the world’s first super wideband (SWB) voice input processor SoC, targeting home telepresence and speech recognition applications as well as next generation Smart TV and video game console applications.
Micron Technology announced that early engineering samples are available for its third-generation reduced latency DRAM (RLDRAM 3) high-bandwidth memory technology that enables a more efficient transfer of information across the network.
Murata Power Solutions today announced the UEE series of fully isolated, open frame DC/DC converters. Designed specifically for high volume cost sensitive telecom, networking, and instrumentation applications, these highly efficient modules, typically up to 90% efficient...
In this episode, we talk to Simon Hambly and David Harold of Imagination Technologies, creators of communications semiconductor IP cores for highly complex System-on-Chip (SoC) devices.
Advantech announces the new PICMG 1.0 full-sized single board computer—PCA-6011, designed with the Intel G41 and the ICH7R chipset for industrial applications. PCA-6011 is a high performance quad core SBC with strong I/O capability.
When a diffusion furnace team at a 200 mm fab experienced defect problems in specific stocker locations of its high volume semiconductor process, CyberOptics WaferSense Auto Vibration Sensors (AVS) helped test a theory that excessive vibrations created by stocker fans effected die yield.
Return to Zero is a funny comic strip for engineers, with lab humor, odd situations, and exploding circuits that of course makes a sport out of solving the trickiest of engineering problems.
Molex Incorporated has released a new standard antenna for applications using the 2.4 GHz ISM (industrial, scientific and medical) band and Wi-Fi.
Ultra low power RF specialist Nordic Semiconductor announces that British medical services startup, Isansys Lifecare Limited, has announced the world's first commercially-available, clinical-grade, wireless cardiac monitor to support low cost continuous ECG heart monitoring.
Ramtron International announced sampling of its newest ferroelectric random access memory (F-RAM) product built on the company’s manufacturing line at IBM.
To help alleviate some of this pressure, Leader Tech announces the introduction of a new SMS Surface Mount Shield series.
Since Newark’s element14 community launched two years ago, we’re proud of the fact that hundreds of thousands of engineers have used our resources to connect and collaborate with industry experts and peers.
Molex is expanding its range of SolarSpec products with the development of pin (male) and socket (female) panel-mount DC connectors. The IP67-sealed, SolarSpec panel-mount DC connectors, with internal locking and touch-proof design for
The RPC Series of film based chip resistors is available in a 1 percent tolerance with desirable pulse handling. This performance is achieved by using a robust film element with a limited laser trim. Trimming a chip resistor can
Texas Advanced Optoelectronic Solutions, Inc. (TAOS; www.taosinc.com) today announced its 5th generation sensor family, the TSL2x72 Series, that delivers improved digital ambient light sensing (ALS) and proximity detection technology.
Until now, 3D Compasses have typically used non-standard technologies such as magneto-resistive materials or Hall-effect structures combined with magnetic field concentrators to detect the direction of the Earth’s magnetic field.
Radiall is proud to introduce the first to market lightweight and easy-to-use composite BNC 75 ohm HDTV connector to its offering of affordable HDTV BNC series for studio quality broadcast production to video conferencing equipment applications.