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Next-generation motion sensing remotes integrate Texas Instruments’ ZigBee RF4CE solutions

September 8, 2011 9:20 am | Hillcrest Labs | Product Releases | Comments

Hillcrest Labs today announced an integrated motion sensing remote control solution – which includes radio frequency (RF) technology from Texas Instruments Incorporated (TI) – designed for manufacturers of motion sensing RF remote controls...

TFT-LCD features wide format and high resolution

September 8, 2011 7:57 am | Product Releases | Comments

Optrex America has introduced a family of TFT-LCDs called the Value Line. This product line includes three displays: 10.1-inch, 11.6-inch and 14.0-inch diagonal.

Higher Wireless Capacity Without Towers

September 8, 2011 6:53 am | Videos | Comments

A new technology that allows wireless devices to "talk" and "listen" on the same frequency could pave the way for 4.5G and 5G networks and could allow wireless phone companies to double throughput on their networks without adding a single cell tower.

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Return to Zero - Wiring Harness

September 8, 2011 6:36 am | Articles | Comments

Return to Zero is a funny comic strip for engineers, with lab humor, odd situations, and exploding circuits that of course makes a sport out of solving the trickiest of engineering problems. 

LIN Transceivers Offer Smaller Packaging, Wettable Flanks

September 7, 2011 2:15 pm | Atmel Corporation | Product Releases | Comments

Atmel Corporation announced the availability of two stand-alone LIN (local interconnect network) transceiver ICs in DFN packages. The DFN14 package for the ATA6670 measures 3 mm x 4.5 mm, while the DFN8 package for the ATA6663 measures 3 mm x 3 mm. The ICs are

Multi-Line ESD Protection Diode Array Meets IEC 61000-4-2 level 4 Immunity

September 7, 2011 1:46 pm | Product Releases | Comments

Comchip Technology has developed a 3.3-V unidirectional four-line electrostatic discharge (ESD) protection diode array that meets the immunity requirements of IEC 61000-4-2 level 4 (±20 kV air, ±15k V contact discharge)

12-V Switcher in a 3 x 5 U-Frame Package Delivers 400 W

September 7, 2011 1:00 pm | Product Releases | Comments

Tectrol introduced the TIP400, which increases the industry-standard 3.3 x 5” footprint up to 400 Watts. The supply features >90 percent efficiency with forced air cooling. The supply is designed for

EMI Shielding: Connector and Passive Component Technology Impacts

September 7, 2011 12:36 pm | by Ron Demcko, AVX Fellow | Articles | Comments

It is hard to recall of the time where EMI shield coatings and seal gaskets were not available, but those times existed not so long ago. EMI shielding has evolved in many respects through the years and will likely have an increased and expanding role in future of high performance electronics.

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Torque measurement system includes digital telemetry technology

September 7, 2011 8:36 am | Product Releases | Comments

Honeywell has introduced the new TMS 9250 Torque Measurement System. Utilizing non-contact digital telemetry technology, the system is built to deliver unprecedented precision and performance. The TMS 9250 is designed to meet evolving industry needs for wireless torque measurement systems...

Return to Zero - Memory Lapse

September 7, 2011 8:33 am | Articles | Comments

Return to Zero is a funny comic strip for engineers, with lab humor, odd situations, and exploding circuits that of course makes a sport out of solving the trickiest of engineering problems. 

Embedded Software - the Revolution Continues

September 7, 2011 8:30 am | by Peter Thorne, Managing Director, Cambashi (www.cambashi.com) | Blogs | Comments

I'll admit to having been a software engineer in the late 1970s and early 1980, coding for 4,8 and 16 bit processors respectively.Thirty years on, and the embedded software revolution has transformed design engineering.

The Tinker's Toolbox - Eric Siegel of TI on Haptics Feedback in Touch-Enabled Devices

September 7, 2011 7:35 am | Podcasts | Comments

In today's podcast we talk to Eric Siegel, product marketing engineer for touchscreen controllers and haptics at Texas Instruments about haptics feedback in touch-enabled consumer electronics devices.

Simulation Enhances Embedded Systems

September 7, 2011 7:20 am | by Jon Titus, Senior Technical Editor | Articles | Comments

You might wonder whether engineers who design embedded systems can benefit from using simulation software. "If you plan to control something like a nuclear reactor or a large piece of machinery, where you'd pay a high price for creating a bad controller...

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Pipeline FFT Cores on FPGA Acheive 52 Giga Samples per Second

September 7, 2011 6:55 am | Product Releases | Comments

The HyperSpeed Plus cores have been proven to process complex data streams in continuous real-time at data rates in excess of 52 Giga samples per second for a 2048 point FFT implemented on a Xilinx Virtex-6 FPGA device.

MEMS gyroscope provides shock and vibration immunity for automotive applications

September 6, 2011 7:31 am | Analog Devices, Inc. | Product Releases | Comments

For automotive electronic stability control, rollover detection, and pitch detection applications, Analog Devices, Inc (ADI) today introduced the ADXRS800 iMEMS gyroscope, featuring a patented differential quad-beam architecture designed to minimize the influence of linear shock and vibration.

Return to Zero - Whiteboard Wall

September 6, 2011 6:26 am | Articles | Comments

Return to Zero is a funny comic strip for engineers, with lab humor, odd situations, and exploding circuits that of course makes a sport out of solving the trickiest of engineering problems.

Tektronix MDO4000 Oscilloscope Review and Teardown

September 6, 2011 6:07 am | Videos | Comments

This video from Dave at the EEVBlog is the first review of the Tektronix's new Mixed Domain Oscilloscope, the MDO4000 series. Does it live up to the hype of changing the oscilloscope landscape and creating a new oscilloscope category?

Five performance metrics for wireless device networking

September 6, 2011 5:48 am | by Sourav Dey, Systems Engineer, On-Ramp Wireless | Articles | Comments

There are many positive use cases for enabling wireless device connectivity, including the smart grid, gas and water distribution systems, building energy management, shipping container tracking, and more. Only recently has technology been developed to address the particular needs of this segment.

Acoustic test fixture meets ANSI-ASA S12.42 standard

September 6, 2011 5:30 am | Product Releases | Comments

G.R.A.S. Sound & Vibration (G.R.A.S.) has announced the North American market introduction of the G.R.A.S. 45CB Acoustic Test Fixture According to ANSI S12.42. Offering high-reliability performance over a wide dynamic range...

100MHz OCXO with Exceptional Phase Noise Performance

September 6, 2011 5:12 am | Product Releases | Comments

Bliley Technologies’ NV45G1480 Series 100MHz OCXO offers superior performance in one of the industries smallest OCXO packages.

Vertical Micro USB Connectors Rival Right Angle Configurations in Many Applications

September 2, 2011 9:09 am | by Laurence Hill, Global Connector Technology, www.globalconnectortechnology.com | Blogs | Comments

Customers who choose to use Micro USB connectors are faced with a multitude of connector options in horizontal PCB orientation. Horizontal orientation is perfect for handheld applications where the PCB runs parallel to the device (such as a cell phone)...

Poly-Form Flexible Pre-shaped Adhesives for Bonding Diverse Materials

September 2, 2011 8:46 am | Product Releases | Comments

Multi-Seals has introduced an innovative alternative to liquid adhesives for component assembly. Multi-Seals F05 Poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, and glass.

Return to Zero - Surplus MRI

September 2, 2011 6:36 am | Articles | Comments

Return to Zero is a funny comic strip for engineers, with lab humor, odd situations, and exploding circuits that of course makes a sport out of solving the trickiest of engineering problems. 

Know Your Choices for Mounting Heat Sinks to Hot Components

September 1, 2011 2:02 pm | by Dr. Kaveh Azar, Advanced Thermal Solutions, Inc., www.qats.com Edited by Chris Warner | Articles | Comments

Because of the performance demands on ICs, the use of cooling heat sinks on top of ASICs, CPUs and other processors is a standard industry practice. As the available real estate on PCBs has become sparse, physically attaching heat sinks to such devices has become a challenge for most applications, specifically for high-density boards. Thus, an engineer starting the process of thermal management must

The Tinker's Toolbox - Andreas Koller of Energy Micro on Sensor Interfaces

September 1, 2011 12:11 pm | Podcasts | Comments

In today's podcast we talk to Andreas Koller, VP of WW Sales and Marketing at Energy Micro and their Low Energy Sensor Interface (LESENSE). 

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