Amulet Technologies announced the availability of GEMstudio, a drag-and-drop GUI development environment for creating high-end, color touchscreen human-machine-interfaces (HMI), with smartphone-like graphics, for 8-, 16-, and 32-bit bit embedded systems. This GUI development environment can
Texas Instruments today announced its new TMS320C2000 Piccolo microcontroller (MCU) DC/DC LED Developer's Kit. The kit enables developers to incorporate Piccolo MCUs to differentiate LED designs with features such as dimming, color tone adjustment, power line communication and fault detection. Additionally, developers can
In 2007, SSG David Bellavia released the most poignant memoir of the Iraq War, “House to House.” The title is significant, because house-to-house fighting is among the most dangerous forms of urban warfare. Camero may have a solution with the Xaver 400, a compact through-wall radar.
Ensign Corporation announces flame retardant, compact, single and dual primary transformers for printed circuit board (PCB) mount, solder/quick connect terminals and lead wires. The Ener-G-Star transformers are designed for optimal efficiency and made of flame retardant materials (UL 94V0).
VIA Technologies announced additions to its VIA VIPRO range of fanless touch screen panel PCs with the 6.5-inch VIA VIPRO VP7806 and 15-inch VIA VIPRO VP7815. Created using the flexible and modular Em-ITX form factor, these VIA VIPRO panel PCs are suitable for
National Instruments offers board-level backplanes from all of its PXI/CompactPCI and PXI Express chassis for OEMs to use in applications ranging from aerospace/defense to industrial embedded control. Engineers and scientists can use the PXI/CompactPCI backplanes to create
Simply put, static print has seen its hay-day and the general population is hungry for ways to find and absorb information faster, and on-the-go.
According to the OECD, adding an extra ten mobile phones per 100 people in a typical developing country boosts growth in GDP per person by 0.8 percentage points. That is just staggering.
LCD backlight power specialist Endicott Research Group (ERG) has introduced a new LED driver that can simultaneously and efficiently power up to 8 strings of high brightness LEDs (HBLEDs). The new Smart Force SFD2C Series is a full-function LED driver board that features a dual output that provides a total maximum current of 1200 mA -- 600 mA per side...
Tech9 Corporation’s new 1 amp buck-boost DC to DC power converter accepts input ranging from 6V to 70V while output remains constant. The power converter can be ordered in 3V, 5V, 9V, 12V and 15V output models. Other outputs are available on request.
Sensortechnics’ HDI sensors measure absolute, differential or gage pressures in various ranges from 10 mbar up to 5 bar (4 inch H2O up to 150 psi). The HDI series features 3 V supply versions which are suitable for battery powered applications
Newport Corporation introduced the CONEX family of compact, photonics control instruments. The product family features three devices that connect via USB plug-and-play technology and allow simple, functional PC-computer control solutions. Multiple units can
APM HEXSEAL announces the expansion of its line of high-pressure, high-temperature pushbutton switch sealing boots designed to handle external pressures to 1,500 psi (103bar), and temperatures from -80°F to +400°F (-62°C to +204°C).
Numonyx B.V. introduced a set of products based on the new class of memory technology called phase change memory (PCM). The devices are asserted to deliver
Amulet Technologies announced the availability of six new plug & play LCD Evaluator Kits for popular displays from Hantronix, Tianma and Shelly. Amulet’s LCD Evaluator Program, also announced, is said to be the industry’s first program to provide
Around the world, Future Soldier Programs are focused primarily on development of technologies to reduce the soldiers fighting load and power requirements, improve the soldier’s protection, lethality, and environmental and situational awareness.
New generations of FPGAs present developers with a level of processing performance and potential I/O bandwidth that cannot easily be matched by conventional CPU configurations. While many COTS solutions enable developers to readily make use of FPGAs for processing, the real challenge to an application is often measured in terms of I/O bandwidth, latency and connectivity.
This article addresses the impact of material choice on heat sink performance. First, we evaluate different materials using mechanical samples and a research quality wind tunnel. This testing compares a constant heat sink geometry made from copper, aluminum, and graphite foam.
There is a lot of talk about going “green” lately, and while it is noble, timely and responsible to save the environment from excessive green house gases, in these tough economic times, it can be equally as responsible to lower energy and power costs.
As a result of the Comcast Corp. v. Federal Communications Commission (FCC) court decision, Internet service providers (ISPs) are no longer constrained from slowing or blocking different types of content or access to sites that offer content that conflicts with the providers’ interests.
Similar to the trackball found on many smart phones, this sensor is easily portable and can be used to replace a mouse in many applications. The Trackball Module comes with a built in center select switch and a red LED which can be programmed to light up the trackball when desired.
Vicor Corporation’s Westcor Division announced that elements of Westcor’s proven configurable power supplies have now joined the ranks of Vicor’s military COTS products as well. They include, specifically, PFC Mini MI and PFC Micro/MicroS MI power factor corrected AC-DC switchers...
Are you a “Themimech” engineer? If not now, you might be soon! As the rising frequencies of many applications are now forcing engineers to be aware of and plan for issues related to rising frequencies in electronic devices and systems, they are now required to participate...
With continued pressure for broader 3G coverage for smart phones, increased Internet connection for Wi-Fi and WiMAX, and the imminent introduction of 4G/LTE systems, design activity for digital communication RF components has never been greater.
Hardware virtualization, and the hypervisors that enable it, have become a hot topic in the embedded space. But while virtualization opens up new possibilities for system architects and designers, it also poses new challenges, especially when used with real-time applications.