Some of the avoidable stress factors effecting semiconductor reliability have led many fabricators to choose fused quartz as the material of choice for semiconductor wafer processing as well as laboratory and testing applications.
A handheld battery operated spirometry device, for example, must be able to be turned on and off quickly and instantly, while continuously recording data over a 20-second period with optimized use of available power, thus requiring a low-voltage pressure sensor which is able to use power only as needed.
Smaller tactile domes bring with them manufacturing challenges when it comes to aligning them with the keypad overlays.
This video provides an enlightening overview of the LIN Driver Configuration Tool for PIC Microcontrollers from Microchip.
Half-Watt (0.5 W) LEDs are gaining more attention from product designers because they fulfill the need for a device that falls between 0.25 W and 1 W LEDs. As more consumer products become smaller and more energy efficient, more designers are selecting 0.5 W LEDs for use in their designs.
Design engineers are looking at new, low-cost, small and innovative sensing designs for their systems. Sensing applications typically require several analog and digital blocks, such as excitation circuits, an analog front end consisting of signal-conditioning and filtering circuitry...
A lot has changed in the past 25 years. Technological feats thought to be impossible in the 1980s have been overcome, while other problems and challenges arose in their place. Changing design requirements, technology and applications are nothing new in the world of electronic components.
This article addresses the impact of material choice on heat sink performance. First, we evaluate different materials using mechanical samples and a research quality wind tunnel. This testing compares a constant heat sink geometry made from copper, aluminum, and graphite foam.
Are you a “Themimech” engineer? If not now, you might be soon! As the rising frequencies of many applications are now forcing engineers to be aware of and plan for issues related to rising frequencies in electronic devices and systems, they are now required to participate...
LCD displays are widely used in cell phones, personal media players, internet tablet PCs, laptops, and large-screen TV sets. These displays account for a major part of the power consumed by these devices. For example, a mobile phone screen may consume upwards of 40% of the system power, while in a large-screen TV, the display may consume 70% or more of the system power.
Electrocardiogram (ECG) system analog front-end (AFE) devices are typically designed with discrete off-the-shelf components from various semiconductor vendors. The primary components of a traditional discrete ECG AFE include instrumentation amplifiers, operational amplifiers that implement active filters, and analog-to-digital converters (ADCs).
Optocouplers are used in many industries to isolate an electrical signal between two elements of a circuit. There are many situations where signals and data need to be transferred from one system to another within a piece of electronic equipment without making a direct electrical connection.
The market for implantable medical devices is estimated at over $40 billion. The recent growth is spurred from significant contributions by the semiconductor industry where new chip technologies revolutionize health care treatments.
An Electronic Engineer builds a system out of components; resistors, ICs, MOSFETs and IGBTs. The Power Electronic Engineer has to go beyond the electrical parameters of components and start looking at thermal resistance and capacity, cooling and parasitic inductance.
Building It Up/Breaking It Down with iSuppli provides a quick look inside the latest products, highlighting some of the components used. Today we take a look inside the Apple iMac Desktop Computer.
Handheld electronic devices -- regardless of what they are used for or who manufactures them -- share one common denominator: a re-chargeable battery and, in most cases, a built-in charger circuit. When an external power source such as an AC adapter or a USB port is attached at the input terminal, the charger circuit will re-charge the battery.
A major challenge facing power engineers today is how to overcome a reduction in board space for the power circuitry in commercial electronic products. A quick walk through any electronics retail store will reveal that personal computers have become smaller and even miniaturized which is a trend for many other types of electronic devices.
Medical electronics applications require components that are smaller, more robust, and highly versatile, particularly as medical equipment becomes increasingly portable. Because medical systems often use discrete electronic components in their circuit designs, passive components are critical to optimizing performance and reliability.
Portable products increasingly rely on a single 3.7V Li-Ion battery for the energy source. For these and other low-voltage applications, lower gate voltage power MOSFETs improve the efficiency for extended battery life and reduce the heat dissipation involved in switching the loads. In addition, they simplify the design of numerous control functions by allowing direct control / drive.
As LEDs continue to penetrate the market and replace last generation light sources, new engineering challenges arise. These challenges come in the form of thermal, optical and electrical issues. For the electrical engineer, maximizing efficiency is usually at the top of the list. However, selecting the proper LED driver topology sometimes can be dictated by the application.
Design applications are getting increasingly dense for embedded system platforms. You name the application, and in most cases, space it at a premium. Packaging the boards, power supplies, fans, drives and other components into these smaller spaces can be challenging.
Selecting an optimal multicore chip or SoC architecture is considerably more complex than picking a lone processor chip or core. As with processor selection, benchmarks can help. A good multicore benchmark will identify bottlenecks in the multicore system design including memory and I/O bottlenecks, computational bottlenecks, and real-time bottlenecks.
Today’s high-performance processors for networking applications utilize a multi-core approach that benefits from packet and flow level parallelism inherent to network processing. Multicores optimized for networking applications typically augment general-purpose processor cores...
Designing a buck converter isn’t easy. Most users want a box that works—taking in one DC voltage and delivering another. This box can take various forms. It can be a step-down to generate a lower voltage or step-up to generate a higher voltage. There are also plenty of special options...
The new USB 3.0 – or “SuperSpeed USB” – protocol was developed to provide higher transfer rates, increased maximum bus power and device current draw, and new power management features, as well as new cables and connectors that are backward-compatible with USB 2.0 devices.