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Robotic arm probes chemistry of 3-D objects by mass spectrometry

March 26, 2014 9:09 am | by EurekAlert! | News | Comments

When life on Earth first started, simple molecules bonded together into precursors of modern genetic material. One theory is that the catalytic minerals on a meteorite's surface jump-started life's first chemical reactions. But scientists need a way to directly analyze these rough, irregularly shaped surfaces....

Parallel programming may not be so daunting

March 24, 2014 4:22 pm | by EurekAlert! | News | Comments

'Lock-free' parallel algorithms may match performance of more complex 'wait-free' algorithms:...

Reference Circuits Address Practical Circuit Design Challenges

October 5, 2011 1:21 pm | Articles | Comments

With the industrial and instrumentation market becoming more competitive, circuit designers...

EMI Noise Checklist

September 13, 2011 2:55 pm | by Lee Stephens, Kollmorgen, | Articles | Comments

This document provides help for applications experiencing problems due to electromagnetic...

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Use Ingenuity to Ground and Shield Existing Electronic Equipment

September 13, 2011 2:43 pm | by Lee Stephens, Kollmorgen, | Articles | Comments

When building electronic equipment, it is imperative to understand the coupling mechanisms of electrical noise that creates Electro-Magnetic Interference (EMI). It is also much easier to preplan a method of abatement during the build of a machine rather than try to initiate a resolution once the equipment is built. However, in reality, it’s common to have to improve or otherwise develop procedures to prevent the noise from disrupting intended signals of existing equipment or designs.

EMI Shielding: Connector and Passive Component Technology Impacts

September 7, 2011 12:36 pm | by Ron Demcko, AVX Fellow | Articles | Comments

It is hard to recall of the time where EMI shield coatings and seal gaskets were not available, but those times existed not so long ago. EMI shielding has evolved in many respects through the years and will likely have an increased and expanding role in future of high performance electronics.

Radicom Research Introduces Low-Cost Bluetooth Modules For Short Distances

August 18, 2011 11:08 am | Product Releases | Comments

Radicom Research announced the launch of its new RB4000 and RB4000HM Bluetooth modules for short-range wireless data connectivity.


Anatomy of a Digital Isolator

August 16, 2011 2:25 pm | by David Krakauer, Analog Devices, Inc., | Articles | Comments

For years, designers of industrial, medical and other isolated systems had limited options when implementing safety isolation: the only reasonable choice was the optocoupler. Today, digital isolators offer advantages in performance, size, cost, power efficiency and integration. Understanding the nature and interdependence of three key elements of a digital isolator is important in choosing the right digital isolator.

Embedded Electronics from Schmid Engineering at NIWeek 2011

August 11, 2011 6:41 am | Videos | Comments

Here is a demo on several interesting and innovative electronic embedded systems from Schmid Engineering using LABView at this year's NIWeek.

Multicore DSPs Power Next-generation Industrial Inspection Systems

August 3, 2011 1:50 pm | by Mukesh Kumar, Texas Instruments, | Articles | Comments

With the advent of new generations of digital signal processors (DSPs), specifically multicore DSPs, developers have high performance, low-cost and power efficient alternatives for implementing the real time image processing in inspection applications.

Contactless Capacitive Sensor Signal Conditioners most practical for harsh environments

July 22, 2011 7:16 am | by David Grice, System Architect, ZMDI ( | Articles | Comments

Capacitive-based sensors have been in use for many years, but they are seeing a rapid increase in interest for a variety of reasons. One of the primary reasons for this is the expanding number of harsh environment applications where capacitive sensing is the best choice...

Photo-Optical Devices Deliver Reliable, Cost-Effective Sensing and Control Solutions

July 20, 2011 10:29 am | by Avi Elmaleh, ROHM Semiconductor, | Articles | Comments

Infrared (IR) PhotoOptic devices are used for sensing and control in a variety of general market applications. These devices – LEDs and phototransistors - operating in the near IR region (700-1400 nm)...


Getting Back “in Touch” with Mobile Devices

July 20, 2011 10:10 am | by Dirk Schapeler, CEO, Artificial Muscle Inc. | Articles | Comments

Varying the “touch” or “feel” of tomorrow’s touchscreens represents the next wave of mobile device customization thanks to advances in Electroactive Polymers (EAP) actuator technology. Imagine downloading customized effects that enable a mobile device’s smooth touchscreen...

PID Based Servo Tuning: Black Art, Rocket Science, or Walk in the Park

July 15, 2011 9:28 am | Articles | Comments

This article provides an overview of PID (proportional, integral, derivative) based servo tuning, and introduce two standard manual tuning methods that work well for a large variety of systems. It also shows that

BLDC Motor Controller Chips Help Conserve Energy

July 15, 2011 5:21 am | by Scott C. Chen, Fairchild Semiconductor, | Articles | Comments

AC and DC are the two types of motors used in household appliances. DC can be further categorized as either brushed or brushless DC (BLDC) motors. Considerable breakthroughs have recently been made in both the technology and production of BLDC motors. The BLDC motor offers

Advanced Roller Pinion Technology Provides Increased Accuracy for Motion Control Applications

July 12, 2011 11:05 am | by Dave Hein, Nexen Group, Inc., | Articles | Comments

Rack and pinion technology is commonly used in linear motion systems to convert rotary motion into linear motion. Providing versatile operation, rack and pinion systems can be employed in a variety of motion control applications, ranging from cutting systems to medical and robotics applications. A traditional rack and pinion system is

What Size Fan Do I Need?

May 23, 2011 12:48 pm | by Mel Berman, TDK Lambda Americas, | Articles | Comments

There are many AC-DC power supplies and DC-DC converters with output power ratings that can vary dependant upon the type of air cooling provided. “Convection air cooling” usually refers to situations where a power supply or converter is cooled by the prevailing ambient air temperature...


Addressing Product Miniaturization Challenges for Medical Electronics

May 23, 2011 6:19 am | by Vern Solberg, Tessera Technologies | Articles | Comments

With the rapid deployment of new products from an ever growing number of competing companies, time-to-market can be the difference between leading and following. For that reason, many manufacturers will rely heavily on more innovative package solutions...

High Reliability Passives Remain Vital in Medical Contact, Imaging, and Analysis

May 3, 2011 11:27 am | by Stephen Oxley, tt electronics Fixed Resistors Busines Unit | Articles | Comments

The great advances of recent years in medical diagnostic and therapeutic capability owe as much to electronic engineering as they do to medical science. Furthermore, medical devices are leaving the confines of hospitals and serving the growing community-based and home-based healthcare markets.

3D Integration of Power MOSFETs Drives Performance in Low-voltage Synchronous Buck Converters

March 23, 2011 5:54 am | by Jeff Sherman and Juan Herbsommer, Texas Instruments | Articles | Comments

Efficiency and power loss in microelectronic devices is a major issue in power electronics applications. The engineers are challenged every year to increase power density and at the same time reduce the amount of power dissipated in the applications...

Integrate Flat Wire Inductors in High Frequency, High Current Designs

March 22, 2011 6:09 pm | by Guido Zehnder, Bourns, Inc. | Articles | Comments

As electronics increasingly become faster and smaller, it is imperative that the components scale appropriately, and inductors are no exception. In order for an inductor to provide a highly conductive solution...

Designing the Flat Data Center Network

March 1, 2011 6:49 am | by Gary Lee, Fulcrum Microsystems | Articles | Comments

There has been a lot of discussion recently about flat data center networks, which is a major shift from the deployment of traditional multi-layer enterprise network architectures that are no longer viewed as an efficient solution for large data centers due to their high latencies and complex software.

Designing Rugged Electromechanical Solutions for Harsh Environment Industrial Applications

February 28, 2011 10:34 am | by Owen Camden, C&K Components, | Articles | Comments

Whether designing electromechanical solutions for industrial instrumentation, automation or high-end testing equipment, OEMs are requesting switch designs that combine increased precision, versatility and functionality with ruggedness and reliability.

Interconnecting Solid State Lighting System Elements

February 2, 2011 8:53 am | by Rob Rix, Vice President, Lighting Tyco Electronics Communications & Industrial Solutions | Articles | Comments

Advances in light emitting diode (LED) performance and cost, combined with the push for greater lighting efficiency have created an unprecedented opportunity for Solid State Lighting (SSL). However, the manufacture of solid state lighting fixtures is far more complex...

Ensuring Reliability: A New Method for Measuring Pressure Distribution During Encapsulation

February 2, 2011 8:36 am | by Dr. Thomas Schreir-Alt, Fraunhofer IZM,, and Jeffrey G. Stark, Sensor Products Inc., | Articles | Comments

The integration of sensors and actuators into encapsulated multi-chip modules creates formidable challenges to characterizing and controlling process pressure. However, a new measurement method developed by Fraunhofer IZM...

Miniaturization and Through-hole Reflow Tech Drive Terminal Block Advancements

February 2, 2011 8:05 am | by Koos Steding, FCI, | Articles | Comments

Terminal blocks have been around a long time, but they are still popular choices as interconnect solutions and continue to evolve based on users’ current application needs. Approximately nine out of 10 PCB boards currently supplied to FCI customers require a terminal block component...

Managing Loops and Data Synchronization Are Keys to Successful Parallelization

January 24, 2011 9:34 am | by Bryon Moyer, Vector Fabrics, | Articles | Comments

Parallelization of a program is simple in concept but can be more complex in actual implementation. It also depends on the application. Some applications lend themselves to parallelization more than others.

Adapting OpenMP in Multicore Embedded Systems

January 24, 2011 8:46 am | by Dr. Eric Stotzer, Senior Member Technical Staff, Texas Instruments | Articles | Comments

Multicore processors are changing application development in all areas of computing. Because they offer higher performance with lower energy consumption, multicore processors are being used in more embedded applications than ever and are enabling entirely new applications.

Traditional Versus Asymmetric Multicore Solutions

January 24, 2011 8:20 am | by Henri Tervonen, Sundar Vedantham, Ph.D., and Tareq Bustami, LSI Corporation, | Articles | Comments

When considering a communications processor for a next-generation application such as an eNodeB base station, cost and determinism requirements factor heavily in the decision. In today’s communications processors, there are two competing multicore architectural approaches in the marketplace.

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