AVX demonstrates the advantages of using their new wire-to-board connectors at electronica 2010.
Akros Silicon shows off its Power System-on-Chip solution with Power-over Ethernet capability at electronica 2010.
NXP provides details their new automotive LED Driver ICs with advanced features at electronica 2010.
ZMD launched the second wave of its ZLED family of LED control solutions with two new low-voltage ICs designed for battery-powered handheld devices.
Analog Devices shows off their online reference design tool that aids engineers in creating subsystems to empower their designs.
Energy Micro demonstrates a vibration-harvesting energy-generation system at electronica 2010.
XMOS demonstrates their latest motor-control chip and its flexibility of I/O and control capabilities at the 2010 electronica conference.
Silicon Labs shows off the latest in their timing device portfolio at electronica 2010.
International Rectifier demonstrates their new Gallium Nitride (GaN) transistors and how they can shrink the size and parts count of an audio power amp design.
With electronica now receding in our collective rearview mirrors, we can look forward along the road we are travelling into the future and think about what we saw at the event that will help us along the way. Trade shows can be a great way to discover where we are and where we are heading.
ITT shows off their new UL-qualified EVC high-amperage e-vehicle charging handle/connector that enables faster charging times.
Cree demonstrates half-bridge hard-switched Silicon Carbide (SiC) MOSFET in a 1,000-V DC/DC converter configuration delivering 10.38 kW at 97.5% efficiency.
Nextreme demonstrates how their energy-harvesting technology can use the heat from a human arm to drive low-power (~60 microwatts in this case) electronics with no external power supply.
Rochester Electronics describes their end-of-life critical-part licensed manufacturing services and shows some notable examples of the authorized products they provide.
Fairchild Semiconductor demoed its latest technological advancements for mobile applications, as well as power solutions that focus on the smart grid at electronica 2010.
KEMET Corporation, a leading manufacturer of tantalum, ceramic, aluminum, film, paper and electrolytic capacitors featured its Flex Mitigation technology this week at Electronica 2010 in Munich, Germany.
The topics of virtualisation and multicore are the central thread that runs through the electronica 2010 trade fair to be held from 9th to 12th November at the Munich Trade Fair Centre. Leading international semiconductor manufacturers will exhibit the latest single core...
The number of visitors at electronica also remained at a constantly high level in 2010 with over 70,000 trade visitors. 2, 595 international exhibitors presented their products, solutions and services at the trade fair from November 9 to 12, 2010.
The last day of electronica 2010, i.e. November 12, 2010, will be devoted to the promotion of future professionals: 26 exhibitors will provide 260 interested school students from Years 12 and 13 with insights into the occupational field of electronics and will explain about career opportunities...
SIE Computing Solutions, Inc, introduced a 3U seven-slot CompactPCI benchtop chassis. This latest addition to the SIE 505 Series is a configurable enclosure solution for systems in embedded telecommunications, military, and test and measurement applications. This
SemiSouth Laboratories, Inc., announced a range of SiC power Schottky diodes including the 30 A rated SDP30S120 – said to be the industry’s highest current 1200 V part to be commercially available in a TO 247 package. The full 1200
Fairchild Semiconductor developed the AccuPower load switch series, said to be the industry’s first 2.8V to 36V integrated load switches, intended to address the designer’s mid-voltage needs. These load switches feature
Everlight Electronics’"Yi" Series high power, high brightness LED family with 5-W power consumption comes in a compact ceramic package. This four-chip device offers
Digitaltest GmbH, and JTAG Technologies, announced the integration of their test methods within the Digitaltest MTS Series of in-circuit test systems, offering electronics designers and manufacturers
The innovativeness and competence were the themes of TDK-EPC’s first Technologies & Products Press Conference, which was held at electronica 2010. One highlight was the introduction of the first connectivity modules in groundbreaking SESUB...