ISCO International has issued a new guide that outlines a variety of interference sources that contribute to suboptimal performance in 3G networks.
STMicroelectronics announced a multi-sensor module with five degrees of freedom.
STMicroelectronics announced its new FingerTip technology, which enables a single-chip solution for capacitive touchscreens up to 10 inches in diameter with multi-touch capability.
RFMW and RFaxis announced a distribution agreement for the Americas, Europe, the Middle East, and Africa effective June 2, 2011.
Cortus S.A., MagnaChip Semiconductor Corporation and Taegee Company, Ltd., have collaborated to develop an advanced, low power, 32bit microprocessor based ASMCU (Application Specific Microcontroller) and associated IP for use in products such as tablet computers, smart phones, laptops and other widely-used touch screen applications.
Cellcrypt, the leading provider of encrypted voice calling on mobile phones, today announced that it has launched Cellcrypt Mobile for Android, a version of its encrypted voice calling application that runs on Android devices operating over Wi-Fi, GSM and CDMA wireless networks.
Neul announced the launch of NeulNET, presented as the first production wireless radio system designed to use the white space spectrum.
At Sensors Expo 2011, Vijendra Kuroodi, principal systems architect at ROHM Semiconductor, demonstrates the company's new BU21023/BU21024 Series of high-speed, high noise immunity, low voltage resistive touchscreen controllers.
Himax Technologies, today unveiled an industry-leading 3D timing controller for naked-eye 3D panels, suitable for handheld applications including tablet PCs, digital photo frames, portable DVD players and gaming devices.
This training module, provided by Digi-Key and Qualtek, will give a brief history of the progression of the USB standard, educate the reader about the differences of Half and Full duplex, compare the specifications of USB 2.0 with USB 3.0, and showcase the newest features of USB 3.0.
Spanish police arrested three suspected members of the so-called "Anonymous" group on Friday on charges of cyber-attacks against targets including Sony's PlayStation network, governments, businesses and banks.
Texas Instruments is enabling contactless temperature measurement in portable consumer electronics with a single-chip passive infrared (IR) MEMS temperature sensor. The TMP006 digital temperature sensor provides manufacturers of mobile devices
The new BU21023/BU21024 Series of high-speed, high noise immunity, low-voltage resistive touchscreen controllers are now available from ROHM Semiconductor. These new controllers are
Futurestate IT announced the general availability of its AppRx Application Currency Management (ACM) platform to assess, plan and execute migration of applications for Windows 7 or Server 2008 as well as determine if/how applications can be virtualized.
STMicroelectronics, a leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications, announced a multi-sensor module with five degrees of freedom.
A well-known and highly respected manufacturer of audio and video products came to Elma with a requirement for a customized switch for a high-end tube amp.
The Agilent MIPI M-PHY test suite helps design engineers turn on, debug and validate all layers of their M-PHY devices, including physical and protocol layers, at speeds up to 5.8 Gb/sec.
Microchip Expands MiWi Wireless Development Environment for IEEE 802.15.4 2.4 GHz and Unlicensed Sub-GHz NetworksJune 2, 2011 11:33 am | Microchip Technology Inc. | Product Releases | Comments
Microchip Technology Inc. announced its expanded MiWi Development Environment (DE), which is a complete ecosystem for designing star and mesh wireless networking products. The MiWi DE is comprised of
When the specifications for Sony’s new handheld PSP console were made public in January, they showed that ARM had replaced MIPS as the architecture for the main processor.
The second generation of Triaxis sensors from Melexis addresses a variety of position sensing requirements in advanced device and subsystem control as well as in human/machine interfaces.
American Ballast has developed a series of high lumen, multi-voltage and energy–efficient ballasts. The High Ballast Factor (HBF) ballast line is asserted to provide energy costs savings in a wide range of applications including
Everlight Electronics introduced an Ambient Light Sensor (ALS) product family that meets the requirements for power management solutions for the display backlighting of mobile appliances such as mobile phones, notebooks and PDAs. The sensors combine
Epyon Power, the leading European supplier of intelligent fast-charging solutions for electric vehicles, today announced compatibility with the Open Charge Point Protocol (OCPP) and said that it will also embrace other commonly used standards for back-office integration.
Display integration specialist 2S2, under their OutdoorHDTV brand, has implemented Zytronic’s ZYTOUCH Projected-Capacitive Technology (PCT) into its latest outdoor digital signage offering, the OHDC-EDSXXX series.
EnSilica has announced a collaboration with Evatronix to offer fully featured eSi-RISC processor SoC solutions with USB 1.1, 2.0 and 3.0 connectivity.