TDK-Lambda EMEA introduces the HFE1600 Series; 1U high, single output AC-DC hot swap front end power supplies that have desirable power density for a 1.6 kW front-end of 25.2 W/in3. Intended for equipment requiring
That’s certainly the case for the computer science students at the University of California, San Diego who paint pictures with C++ computer programming code.
Molex Incorporated announced that its next generation HDMI Type D (Micro) connector is available. The HDMI Type D (Micro) connector is a new miniaturized connector solution designed to
Extreme Engineering Solutions (X-ES) announced the availability of its XPedite5530, a conduction- or air-cooled 3U CompactPCI single board computer based on Freescale Semiconductor’s dual-core QorIQ P2020 processor. The SBC provides
picoChip unveiled the PC333, a System-on-Chip (SoC) device specifically designed to extend the femtocell into the realm of public access infrastructure such as metro femto, rural femto and strand-mounted systems. The PC333 SoC is asserted to
NKK Swiches announced it has doubled the display life of its OLED SmartSwitch pushbutton switches and reduced the devices’ low power consumption by 30 percent. The display has increased to
Maxim Integrated Products introduced the MAX98088 stereo audio codec that leverages the company’s Flexsound audio processor. This proprietary technology is said to improve loudspeaker performance by
CEVA, Inc. introduced the CEVA-X1643, a 1 GHz DSP core designed to boost overall chip performance for a broad range of applications including wireline and wireless communications, surveillance and portable multimedia. Features include
The OSD050T0714-29 features a high-resolution WVGA (800xRGBx480) format in a 5.0” diagonal size. This TFT-LCD display features a parallel 24-bit TTL interface with a high-quality 16.7M color palette. The module has
Combining the characteristics of epoxy resins and polyurethanes, Master Bond Polymer System EP30D-7 offers desirable strength, flexibility, abrasion resistance and toughness. This two-component epoxy is appropriate for
Cypress Semiconductor Corp. announced a new CapSense capacitive touch-sensing controller that enables designers to achieve mechanical button replacement (MBR) without having to write firmware or learn to use new software tools. The device
austriamicrosystems has announced the AS3940, the first fully integrated 2.4 GHz multi-channel FSK (frequency shift keying) transceiver with integrated link manager for reliable control of star networks (up to eight clients). It features low power, high sensitivity (-100 dBm at 250 kbps, -92 dBm at 2 Mbps), data rates from
VIA Technologies, Inc. announced the VIA EPIA-M850 Mini-ITX board for suit HD-intensive, commercial multimedia-centric devices. Measuring 17 cm x 17 cm, this Mini-ITX board features the VIA Nano E-Series processor, available in both 1.3+GHz (clocked at 1.6 GHz) and fanless 1.2 GHz SKUs. The VIA Nano E-series is
Tektronix announced the TLA6000 Series, a logic analyzer that brings high-end debug and analysis to mainstream embedded systems designers. Higher signal speeds and increased board densities often lead to signal integrity issues such as crosstalk, ground bounce, and ringing that manifest themselves in functional failures of the digital system. The logic analyzer is asserted to
The Tactilus heat-sink analysis system by Sensor Products Inc. enables engineers to visualize actual contact forces and pressure distribution data on the circuit board components. As the mounting screws between the CPU and the heat sink are torqued, it
Researchers at the Georgia Institute of Technology have developed a new class of electronic logic device in which current is switched by an electric field generated by the application of mechanical strain to zinc oxide nanowires.
AdaCore 's Ada Web Server for Wind River’s VxWorks Real-Time Operating System, when used in conjunction with the GNAT Pro development environment, enables developers to embed an Ada-based web server within any application, accessible through web browsers.
For years the computing industry has implemented distributed architectures by dividing computing among multiple processing nodes.
The Minix 890GX motherboard is presented as the world’s first USB 3.0 & SATA 6Gbps mini-ITX form factor motherboard capable of supporting DDR3 memory targeted at applications such as HTPCs, Car PCs, BYO routers, servers, and NAS devices
Arasan Chip Systems, a leading provider of Total Semiconductor IP Solutions, announced that it has developed the UHS-II PHY IP core, a next generation memory interface being finalized by the SD Association.
PCI-Systems announced OpenVPX Conduction-Cooled PCI Express Cable Link Boards, enabling accelerated development of rugged conduction cooled embedded systems.
The PLC Development Kit (TMDSPLCKIT-V2) is based on the industry's only PLC modem solution capable of supporting multiple modulation and protocol standards on a single hardware platform.
Ensuring interoperability between components, boards and systems has been an ongoing challenge for virtually all embedded systems designers, and was a factor in stifling the market potential for the powerful new VPX standard.
OpenVPX is now beginning to sprout promising green shoots as interoperability has become a significant focus around the VPX topic.
OpenVPX provides order to the rugged deployed embedded community with a framework that enables disparate computational entities to co-exist within a larger system while defining compliance to adjudicate disagreements.