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Xilinx on-chip interconnect demo using 4 video streams at the 2010 ESC

September 24, 2010 9:50 am | Videos | Comments

This Xilinx demo of an on-chip interconnect standard at the 2010 Embedded Systems Conference in Boston uses a Xilinx Virtex-6 FPGA and multiple video steams.

RTOS Incorporates Security Stack for Networks

September 24, 2010 6:42 am | Product Releases | Comments

Express Logic announced the integration of the ?SSL Security Stack from Cypherbridge Systems, a standards-based solution for chip-to-chip and chip-to-server interoperabilty across wired and wireless networks.

Dell's Industrial Computing Platform at the 2010 Embedded Systems Conference

September 23, 2010 6:48 am | Videos | Comments

Dell shows off its first targeted entry into the industrial computing space at the 2010 Boston Embedded Systems Conference.

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Vote for your Favorites in the ECN Readers Choice Tech Awards

September 17, 2010 10:48 am | Articles | Comments

This has been a good year for the electronic design community, with advances in hardware, software, materials, and technology. Take a moment to nominate your favorites for the 2010 ECN Readers Choice Tech Awards.

Front-end Power Supplies Meet Climate Savers Computing Standards

September 17, 2010 6:33 am | TDK-Lambda Americas, Inc. | Product Releases | Comments

TDK-Lambda EMEA introduces the HFE1600 Series; 1U high, single output AC-DC hot swap front end power supplies that have desirable power density for a 1.6 kW front-end of 25.2 W/in3. Intended for equipment requiring

A Picture is Worth a 1,000 lines of C++ Code

September 16, 2010 7:54 am | by Daniel Kane, UC San Diego (www.ucsdnews.ucsd.edu) | News | Comments

That’s certainly the case for the computer science students at the University of California, San Diego who paint pictures with C++ computer programming code.

Type D Micro Connector Meets HDMI Specification 1.4a

September 16, 2010 7:41 am | Product Releases | Comments

Molex Incorporated announced that its next generation HDMI Type D (Micro) connector is available. The HDMI Type D (Micro) connector is a new miniaturized connector solution designed to

3U cPCI Module Features Freescale Dual-Core QorIQ P2020 Processor

September 15, 2010 11:39 am | Product Releases | Comments

Extreme Engineering Solutions (X-ES) announced the availability of its XPedite5530, a conduction- or air-cooled 3U CompactPCI single board computer based on Freescale Semiconductor’s dual-core QorIQ P2020 processor. The SBC provides

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Public Access Femtocell Solution Enables 32 Channels for Simultaneous Voice, HSPA+ Data

September 14, 2010 9:19 am | Product Releases | Comments

picoChip unveiled the PC333, a System-on-Chip (SoC) device specifically designed to extend the femtocell into the realm of public access infrastructure such as metro femto, rural femto and strand-mounted systems. The PC333 SoC is asserted to

OLED Pushbutton Switch Family Doubles Its Display Life

September 10, 2010 8:26 am | Product Releases | Comments

NKK Swiches announced it has doubled the display life of its OLED SmartSwitch pushbutton switches and reduced the devices’ low power consumption by 30 percent. The display has increased to

Audio Codec Enhances Loudspeaker Performance, Uses Little Power

September 9, 2010 11:47 am | Product Releases | Comments

Maxim Integrated Products introduced the MAX98088 stereo audio codec that leverages the company’s Flexsound audio processor. This proprietary technology is said to improve loudspeaker performance by

Programmable DSP Core Touts Power Efficiency for Next-Gen Communications and Multimedia SoCs

September 9, 2010 10:46 am | Product Releases | Comments

CEVA, Inc. introduced the CEVA-X1643, a 1 GHz DSP core designed to boost overall chip performance for a broad range of applications including wireline and wireless communications, surveillance and portable multimedia. Features include

TFT Features a High-Resolution WVGA 5.0” Format

September 9, 2010 8:03 am | Product Releases | Comments

The OSD050T0714-29 features a high-resolution WVGA (800xRGBx480) format in a 5.0” diagonal size. This TFT-LCD display features a parallel 24-bit TTL interface with a high-quality 16.7M color palette. The module has

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Epoxy Combines High Strength and Toughness with Chemical and Abrasion Resistance

September 8, 2010 1:07 pm | Product Releases | Comments

Combining the characteristics of epoxy resins and polyurethanes, Master Bond Polymer System EP30D-7 offers desirable strength, flexibility, abrasion resistance and toughness. This two-component epoxy is appropriate for

Capacitive Touch Sensing Controller Touted as Easy-to-Implement

September 8, 2010 11:34 am | Product Releases | Comments

Cypress Semiconductor Corp. announced a new CapSense capacitive touch-sensing controller that enables designers to achieve mechanical button replacement (MBR) without having to write firmware or learn to use new software tools. The device

Multi-channel 2.4 GHz FSK Transceiver Includes Built-in Star Network Manager

September 8, 2010 6:26 am | Product Releases | Comments

austriamicrosystems has announced the AS3940, the first fully integrated 2.4 GHz multi-channel FSK (frequency shift keying) transceiver with integrated link manager for reliable control of star networks (up to eight clients). It features low power, high sensitivity (-100 dBm at 250 kbps, -92 dBm at 2 Mbps), data rates from

Mini-ITX Board Suits HD-intensive, Commercial Multimedia-centric Devices

September 7, 2010 1:38 pm | Product Releases | Comments

VIA Technologies, Inc. announced the VIA EPIA-M850 Mini-ITX board for suit HD-intensive, commercial multimedia-centric devices. Measuring 17 cm x 17 cm, this Mini-ITX board features the VIA Nano E-Series processor, available in both 1.3+GHz (clocked at 1.6 GHz) and fanless 1.2 GHz SKUs. The VIA Nano E-series is

Mid-range Logic Analyzer Features High-End Debug Capabilities

September 7, 2010 11:07 am | Tektronix | Product Releases | Comments

Tektronix announced the TLA6000 Series, a logic analyzer that brings high-end debug and analysis to mainstream embedded systems designers. Higher signal speeds and increased board densities often lead to signal integrity issues such as crosstalk, ground bounce, and ringing that manifest themselves in functional failures of the digital system. The logic analyzer is asserted to

Sensor System Presents as Ensuring Optimal Heat Sink Efficiency

September 2, 2010 7:58 am | Product Releases | Comments

The Tactilus heat-sink analysis system by Sensor Products Inc. enables engineers to visualize actual contact forces and pressure distribution data on the circuit board components. As the mounting screws between the CPU and the heat sink are torqued, it

New Type of Logic Device Uses Piezoelectric Effect

September 2, 2010 6:40 am | by John Toon, Georgia Institute of Technology | News | Comments

Researchers at the Georgia Institute of Technology have developed a new class of electronic logic device in which current is switched by an electric field generated by the application of mechanical strain to zinc oxide nanowires.

Software Brings Web-Based Connectivity and Control to Embedded Apps

August 31, 2010 9:58 am | Product Releases | Comments

AdaCore 's Ada Web Server for Wind River’s VxWorks Real-Time Operating System, when used in conjunction with the GNAT Pro development environment, enables developers to embed an Ada-based web server within any application, accessible through web browsers.

Automated Test Outlook - Peer-To-Peer Computing

August 31, 2010 8:17 am | by by Matt Friedman, National Instruments (www.ni.com) | Blogs | Comments

For years the computing industry has implemented distributed architectures by dividing computing among multiple processing nodes.

Mini-ITX Motherboard Supports DDR3 Memory

August 31, 2010 7:41 am | Product Releases | Comments

The Minix 890GX motherboard is presented as the world’s first USB 3.0 & SATA 6Gbps mini-ITX form factor motherboard capable of supporting DDR3 memory targeted at applications such as HTPCs, Car PCs, BYO routers, servers, and NAS devices

UHS-II PHY IP Core Provides Next-Generation Memory Interface

August 30, 2010 8:33 am | Product Releases | Comments

Arasan Chip Systems, a leading provider of Total Semiconductor IP Solutions, announced that it has developed the UHS-II PHY IP core, a next generation memory interface being finalized by the SD Association.

PCI Express Cable Link Boards are Conduction-Cooled

August 30, 2010 6:17 am | Product Releases | Comments

PCI-Systems  announced OpenVPX Conduction-Cooled PCI Express Cable Link Boards, enabling accelerated development of rugged conduction cooled embedded systems.

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