See where the UK's national time scale is generated at the National Physical Laboratory.
www.orkin-design.de The device of the flexible display allows a new concept in notebook design growing out of the traditional bookformed laptop into unfurling and convolving portable computer. By virtue of the OLED-Display technology and a multi touch screen the utility of a laptop...
In this video we go through the process of installing an Intel solid state disc into an Asus UL30VT ultraportable. We then install a fresh copy of Windows 7 on it
Video footage from Day 1 keynote at Google I/O 2010 For Google I/O session videos, presentations, developer interviews and more, go to: code.google.com/io
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Intel Corporation has developed a research prototype representing the world's first silicon-based optical data connection with integrated lasers.
Toradex announced a new addition to the Colibri product range,the Colibri Tegra T20, based on the latest Nvidia Tegra T20 Cortex A9 MPCore (Dual Core) processor.
The largest commercially available collection of numerical algorithms for C and C++---NAG C Library—widely used for electronics application development, has now been expanded by the Numerical Algorithms Group (NAG) with the addition of over 150 functions for a total of well over 1300 user-callable functions...
VIA Technologies announced device development kits for the VIA AMOS-5000 series, facilitating a more rational design infrastructure for a broad range of application-specific and fanless Em-ITX-based devices.
Dontech Therma Klear transparent heaters provide the warmth necessary to extend the operating temperature of liquid crystal displays (LCDs) in cold environments.
Nuvoton Technology its ChipCorder voice/audio device to enable telephony functions in commercial and consumer systems. The ISD61S00 provides a digital-audio interface, audio storage interface, macro-scripting ability, and streamlined programmability that allows designers to
PICASO-GFX2 is an intelligent custom 4DGL (4D Graphics Language) Graphics Controller designed to interface with virtually all popular OLED and LCD display panels. It provides a graphics user interface solution for rapid application development and time-to-market. Built-in features include
TDK-EPC has extended its range of power factor correction (PFC) capacitors. The EPCOS PhaseCap Compact series now also comprises types for voltages from 415 V AC, 440 V AC, 480 V AC and 525 V AC. As an alternative to capacitors with dimensions of
Physicists at the NIST have demonstrated an ion trap with a built-in optical fiber that collects light emitted by single ions, allowing quantum information stored in the ions to be measured.
At Apple's Worldwide Developers Conference in San Francisco, Apple CEO Steve Jobs unveiled the company's latest iPhone.
Pentagon research scientists have taken a first step towards "Transformers"-style shape-shifting cars and aircraft, with a robot that can fold itself like origami into different forms.
The remarkable ability of an electron to exist in two places at once has been controlled in the most common electronic material – silicon – for the first time.
Haydon Kerk Motion offers a line of high output can stack linear actuators. The Haydon line of high output can stack actuators include the 20 mm, 25 mm, and 35 mm frame sizes. The linear actuators were designed and built with
PLX Technology announced the sampling of three USB SuperSpeed 3.0-to-SATA controllers targeting the consumer storage market. The new PLX trio includes the OXU3102, OXU3101 and OXU3100, which are said to provide
CHiL Semiconductor Corporation announced a new configuration in its computing voltage regulator (VR) solutions for CPU, GPU, and DDR applications. Now configured to optimize efficiency from the lowest idle state to the highest operating state of
Texas Instruments today introduced a SuperSpeed USB (USB 3.0) transceiver capable of data transfers up to 10 times the speed of current USB 2.0 technology.
Floating gate Flash memory has been scaling at a tremendous pace in recent years to arrive at a startling density of 32 gigabit (4 gigabyte) on a single die today, using 30nm technology and below.
Interface Concept introduced its IC-PQ3-XMCa ultra low power Processor XMC module, based on the Freescale PowerQUICC III MPC8536E processor. The IC-PQ3-XMCa is designed to offer both the Gigahertz-class complex application processing abilities and
General Micro Systems, Inc. (GMS) developed an Intel Atom-based rugged SBC that offers low power consumption. Combined with its small footprint and high performance, the Atom XPC40x (extended temperature, conduction-cooled) and Atom XP40x (standard temperature) are said to
Kycon is expanding its USB product line by adding USB 3.0, the next generation design-in Universal Serial Bus – KUSBX-xx1N9 Series. The USB 3.0 connectors, also known as SuperSpeed USB, support data transfer rates of up to 10 times faster than the USB 2.0 version and are