Stantum, a leading developer of multi-touch technology, announced a dual-chip high-resolution architecture for its patented Interpolated Voltage Sensing Matrix (IVSM) touch-and-write technology.
Stantum, a leading developer of multi-touch technology, announced today that its patented Interpolated Voltage Sensing Matrix (IVSM) technology now supports Google's Android operating system.
In this episode, we talk to Jon Kiachian, the senior marketing director for touch technologies at Atmel about the touchscreen space and Atmel's efforts to advance engineer's abilities to create products and devices for a variety of applications.
The Small Form Factor Special Interest Group (SFF-SIG), a collaboration of leading suppliers of embedded component, board and system technologies, announced the public availability of the new RS-DIMM Rugged Memory Specification.
Scientists at HP and the University of California, Santa Barbara have discovered the physical and chemical properties of the memristor, a likely component of future memory and computational circuitry.
In this episode, we talk with Manish Gupta of Symmetricom about SyncWorld, a program with industry leaders including Cisco, Alcatel-Lucent and NSN to support precise timing and synchronization requirements for 4G/LTE deployments.
Avnet Embedded Americas introduces Performance Matched Kits, a complete portfolio of motherboard, display, peripheral and support products from world-class manufacturers that eliminates the need to source individual components, develop cables and spend precious time and resources validating hardware.
Texas Memory Systems introduced their new high-performance RamSan-70, a 900-GB half-length PCIe card featuring Toshiba’s newest 32nm SLC Flash.
FlowWorld is a configurable portal technology enabling the connection of devices to the cloud. Used alongside Imagination’s METAflow connected processor technology it enables an end to end solution for delivery of services and content between service providers and users through the cloud.
Texas Instruments unveiled its TMP103 digital temperature sensor, which consumes 97 percent less power and is 75 percent smaller than the next closest competitor, according to the company. It also provides
TE Connectivity (TE) launched 1.95-mm connectors to fit into various consumer devices such as cell phones and tablets that have limited space for SIM cards. These connectors offer partial shielding that provides
In this episode, we talk with Jack Bogdanski, Director of New Product Development at Microsemi about their new TRRUST-Stor secure solid state drive (SSD) designed from the ground up for aerospace, defense, and military applications.
SiTime Corporation introduced the SiT380X family of MEMS-based Voltage Controlled Oscillators (VCXOs) for telecom, networking and embedded applications. The SiT3808 and SiT3809 VCXOs offer
TDK-Lambda Americas announced 50-Watt ZWS50BAF and 75-Watt ZWS75BAF power supplies which combine efficiency, even at low load conditions, with a wide operating temperature range, small size and up to
WinSystems announced their EPX-C380, an EPIC-compatible, Intel 1.66 GHz ATOM-based single board computer (SBC). The device uses either the Intel ATOM single core N450 or dual core D510 processor combined with
Microchip Technology Inc. announced its next-generation, open-source integrated development environment — the MPLAB X IDE — with cross-platform support for Linux, Mac OS and Windows operating systems. New features include
AMD introduced the Radeon E6760 embedded discrete graphics processor. The GPU offers embedded system designers the combination of OpenCL support along with support for six independent displays to enable
If you’re part of a medium to large IT organization, it’s likely that you’re spending an increasing percentage of your application budget just to keep the lights on.
National Semiconductor introduced a family of PCI Express (PCIe) Gen-3 (8 Gbps) repeaters that offer desirable signal conditioning performance and low-power consumption for data center servers and storage systems. Powered by
VLSI Solution announced the VS1063 audio codec chip. According to the company, this IC can encode an unforeseen multitude of audio formats, from MP3 and Ogg Vorbis to G.711 u-law, G.711 A-law, G.722 and 16-bit PCM. The proprietary
VIA Technologies’ Nano X2 E-Series processors feature an optimized, power-efficient dual-core architecture most demanding 86-bit x86 embedded system design applications. Available in two models running at speeds of 1.2+ GHz and 1.6+ GHz, these processors
Atmel Corporation has integrated haptics capability to its QTouch capacitive touch controllers to support buttons, sliders and wheels (BSWs). This integration allows our customers to have a richer experience with
Texas Instruments announced what it asserts are the industry’s first ultra-low-power ferroelectric random access memory (FRAM) 16-bit microcontrollers. The MSP430FR57xx FRAM Series ensures data can be
Pulse introduced a dual central office VDSL2 splitter module. The B8891DVNL combines two central office (CO) splitter modules onto one platform. This configuration increases available printed circuit board space by 40 percent while
STMicroelectronics introduced the LSM303DLHC geo-magnetic module. Housed inside a miniature 3 x 5 x 1 mm package with operating current consumption down to just 110 uA, this module meets