VIA Technologies, Inc. announced the VIA EPIA-M850 Mini-ITX board for suit HD-intensive, commercial multimedia-centric devices. Measuring 17 cm x 17 cm, this Mini-ITX board features the VIA Nano E-Series processor, available in both 1.3+GHz (clocked at 1.6 GHz) and fanless 1.2 GHz SKUs. The VIA Nano E-series is
Tektronix announced the TLA6000 Series, a logic analyzer that brings high-end debug and analysis to mainstream embedded systems designers. Higher signal speeds and increased board densities often lead to signal integrity issues such as crosstalk, ground bounce, and ringing that manifest themselves in functional failures of the digital system. The logic analyzer is asserted to
The Tactilus heat-sink analysis system by Sensor Products Inc. enables engineers to visualize actual contact forces and pressure distribution data on the circuit board components. As the mounting screws between the CPU and the heat sink are torqued, it
Researchers at the Georgia Institute of Technology have developed a new class of electronic logic device in which current is switched by an electric field generated by the application of mechanical strain to zinc oxide nanowires.
AdaCore 's Ada Web Server for Wind River’s VxWorks Real-Time Operating System, when used in conjunction with the GNAT Pro development environment, enables developers to embed an Ada-based web server within any application, accessible through web browsers.
For years the computing industry has implemented distributed architectures by dividing computing among multiple processing nodes.
The Minix 890GX motherboard is presented as the world’s first USB 3.0 & SATA 6Gbps mini-ITX form factor motherboard capable of supporting DDR3 memory targeted at applications such as HTPCs, Car PCs, BYO routers, servers, and NAS devices
Arasan Chip Systems, a leading provider of Total Semiconductor IP Solutions, announced that it has developed the UHS-II PHY IP core, a next generation memory interface being finalized by the SD Association.
PCI-Systems announced OpenVPX Conduction-Cooled PCI Express Cable Link Boards, enabling accelerated development of rugged conduction cooled embedded systems.
The PLC Development Kit (TMDSPLCKIT-V2) is based on the industry's only PLC modem solution capable of supporting multiple modulation and protocol standards on a single hardware platform.
Ensuring interoperability between components, boards and systems has been an ongoing challenge for virtually all embedded systems designers, and was a factor in stifling the market potential for the powerful new VPX standard.
OpenVPX is now beginning to sprout promising green shoots as interoperability has become a significant focus around the VPX topic.
OpenVPX provides order to the rugged deployed embedded community with a framework that enables disparate computational entities to co-exist within a larger system while defining compliance to adjudicate disagreements.
Lyric Semiconductor, a DARPA- and venture-funded MIT spin-out, today emerged from stealth mode to launch a new technology called probability processing.
Semtech Corp. announced the SC442, a 10-channel white LED driver with an integrated 3A boost power switch. The device is capable of driving up to 120 LEDs at up to 30 mA per channel and is packaged in a low-profile 4 mm x 4 mm x0.6 mm, 28-pin MLPQ package. The SC442 operates
Crystek has introduced the 190 Series CCK26.5 and CCSMA26.5 cable assemblies, new additions to its line of low-loss RF coaxial cables. Designed to operate up to 26.5GHz, the 190 cable assemblies offer a minimum bend radius of 1.1 in. and
Phihong announced the release of its 30 W passive power injectors for PoE Plus applications. Available in a two-wire model designated the POE31W series and a three-wire model designated the POE31U Series, both series are
Elma Electronic Systems division offers the Secure PMCDisk for securely erasing and write-protecting sensitive data in harsh environments often found in military and defense applications. The new, high-capacity mass data storage mezzanine supports
VIA Technologies, Inc, announced the addition of the VIA COME8X80 module to its COM Express portfolio; the first COM Express type product utilize the 64-bit VIA Nano E-Series processor. The VIA COME8X80 is
McObject has released its Data Relay technology as a key building block for fast and flexible data-sharing between real-time applications based on eXtremeDB, and external systems such as an enterprise DBMS.
The do-it-yourself approach to a real-time operating system appeals to many an engineer’s desire to control, schedule, and manage application interrupts. So ten years ago, the number of in-house RTOS applications outstripped all commercial RTOS implementations. Although the do-it-yourself (DIY) RTOS remains the number-one competitor to commercial RTOSs, industry analyst Embedded Market Forecasters has found
The risks to users of wireless technology have increased as the popularity of wireless grows. Hackers are becoming more sophisticated so it's very important that wireless device manufacturers secure their devices properly.
MH&W International provides U 90 silicone-free thermal interface materials (TIMs) with a new light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads, and allow
US Digital announced the release of its latest encoder interface device, the QSB (Quadrature to USB) adapter. Encoder verification is asserted to be made easy with the QSB, which allows simple interface of standard quadrature encoder signals into a
The all new iGo19-RT2 is the ultimate industrial fanless embedded all-in-one touch screen solution. With a 19" TFT Resistive Touch WXGA widescreen LCD panel supporting 1440 x 900 native resolution, it provides a clear view to your product.