Computing
Voice-audio IC Integrates Telephony Features
July 12, 2010 10:39 am | Product Releases | CommentsNuvoton Technology its ChipCorder voice/audio device to enable telephony functions in commercial and consumer systems. The ISD61S00 provides a digital-audio interface, audio storage interface, macro-scripting ability, and streamlined programmability that allows designers to
4DGL Graphics Controller Performs Out of the Box
July 9, 2010 11:53 am | Product Releases | CommentsPICASO-GFX2 is an intelligent custom 4DGL (4D Graphics Language) Graphics Controller designed to interface with virtually all popular OLED and LCD display panels. It provides a graphics user interface solution for rapid application development and time-to-market. Built-in features include
PFC Capacitors Target Three-phase Industrial Networks
July 9, 2010 7:27 am | Product Releases | CommentsTDK-EPC has extended its range of power factor correction (PFC) capacitors. The EPCOS PhaseCap Compact series now also comprises types for voltages from 415 V AC, 440 V AC, 480 V AC and 525 V AC. As an alternative to capacitors with dimensions of
Novel Ion Trap Could Link Atoms and Light in Quantum Networks
July 8, 2010 9:19 am | News | CommentsPhysicists at the NIST have demonstrated an ion trap with a built-in optical fiber that collects light emitted by single ions, allowing quantum information stored in the ions to be measured.
WWDC: Steve Jobs unveils iPhone 4 (raw video)
July 7, 2010 10:25 am | by macworld | Videos | CommentsAt Apple's Worldwide Developers Conference in San Francisco, Apple CEO Steve Jobs unveiled the company's latest iPhone.
Pentagon Develops Shape-Shifting Robot
July 6, 2010 5:07 am | by Tom Chivers | Videos | CommentsPentagon research scientists have taken a first step towards "Transformers"-style shape-shifting cars and aircraft, with a robot that can fold itself like origami into different forms.
Silicon Breakthrough Brings Quantum Computing Closer
July 1, 2010 5:23 am | News | CommentsThe remarkable ability of an electron to exist in two places at once has been controlled in the most common electronic material – silicon – for the first time.
Stepper Motor Linear Actuators Feature Optimized Stator Tooth Geometry
June 28, 2010 8:38 am | Product Releases | CommentsHaydon Kerk Motion offers a line of high output can stack linear actuators. The Haydon line of high output can stack actuators include the 20 mm, 25 mm, and 35 mm frame sizes. The linear actuators were designed and built with
USB SuperSpeed 3.0-to-SATA Controllers Targeting Consumer Storage
June 28, 2010 7:58 am | Product Releases | CommentsPLX Technology announced the sampling of three USB SuperSpeed 3.0-to-SATA controllers targeting the consumer storage market. The new PLX trio includes the OXU3102, OXU3101 and OXU3100, which are said to provide
Voltage Regulators for Computing Tout Efficiency Shaping Tech
June 28, 2010 7:17 am | News | CommentsCHiL Semiconductor Corporation announced a new configuration in its computing voltage regulator (VR) solutions for CPU, GPU, and DDR applications. Now configured to optimize efficiency from the lowest idle state to the highest operating state of
SuperSpeed USB 3.0 Transceiver Offers Over 10x USB 2.0 Speed
June 28, 2010 5:00 am | Product Releases | CommentsTexas Instruments today introduced a SuperSpeed USB (USB 3.0) transceiver capable of data transfers up to 10 times the speed of current USB 2.0 technology.
Vertical Flash Platform Increases Memory Density
June 22, 2010 5:56 am | Articles | CommentsFloating gate Flash memory has been scaling at a tremendous pace in recent years to arrive at a startling density of 32 gigabit (4 gigabyte) on a single die today, using 30nm technology and below.
Processor XMC Module Touts Gigahertz-class Complex Application Processing
June 19, 2010 8:05 am | Product Releases | CommentsInterface Concept introduced its IC-PQ3-XMCa ultra low power Processor XMC module, based on the Freescale PowerQUICC III MPC8536E processor. The IC-PQ3-XMCa is designed to offer both the Gigahertz-class complex application processing abilities and
Rugged SBC Rivals iPhone in Size
June 18, 2010 10:57 am | Product Releases | CommentsGeneral Micro Systems, Inc. (GMS) developed an Intel Atom-based rugged SBC that offers low power consumption. Combined with its small footprint and high performance, the Atom XPC40x (extended temperature, conduction-cooled) and Atom XP40x (standard temperature) are said to
Connectors Are Designed for SuperSpeed USB 3.0
June 18, 2010 8:51 am | Product Releases | CommentsKycon is expanding its USB product line by adding USB 3.0, the next generation design-in Universal Serial Bus – KUSBX-xx1N9 Series. The USB 3.0 connectors, also known as SuperSpeed USB, support data transfer rates of up to 10 times faster than the USB 2.0 version and are
Three-Phase Brushless DC Motor Pre-Driver IC Targets Office Automation
June 18, 2010 6:20 am | Product Releases | CommentsAllegro MicroSystems, Inc. has introduced a three-phase brushless DC motor pre-driver with outputs for direct high current gate drive of an all N-channel power MOSFET three phase bridge with a maximum supply voltage of 38 V. Allegro’s A4936 device has
PC-104 A-D and D-A Modules Eliminate Need for Recalibration
June 18, 2010 5:52 am | Product Releases | CommentsWinSystems’ PCM-MIO-G-AD-1 is a 16-channel, 16-bit analog input card and the PCM-MIO-G-DA-1 is an eight-channel, 12-bit analog output card. Both cards also support 48-lines of digital I/O. These small, 90 mm x 96 mm expansion boards are designed to
PWM Controller Combines Fast Transient Response, Efficiency and Digital Control
June 17, 2010 8:57 am | Product Releases | CommentsSemtech Corp. announced the SC493, the company’s first digitally controlled DC/DC converter. The product is positioned to users to digitally configure and interrogate the status of the controller via an I2C bus. It combines the
Em-ITX Form Factor Board Features HD video over HDMI
June 16, 2010 1:01 pm | Product Releases | CommentsVIA Technologies announced the VIA EITX-3001, its latest Em-ITX form factor board for durable and fanless next generation devices in kiosk, HMI, POI and POS embedded applications. Combining the latest VIA Nano E-Series processor and the VIA VX855 media system processor, the VIA EITX-3001 offers
Triple-speed 10GBASE-T Server Adapter Targets Virtualized Data Centers
June 15, 2010 11:35 am | Product Releases | CommentsSolarflare Communications announced today its Solarstorm SFN5121T dual-port 10GBASE-T server adapter. Said to be less than half the power of competitive offerings (less than 6.5 W/ port in 100-m mode and 5.5 W/port in data center mode the SFN5121T is asserted to be the industry’s lowest-power 10GBASE-T network interface card (NIC). Designed to
IPv4-IPv6 Gigabit Ethernet Switch Suits VPX and OpenVPX Platforms
June 15, 2010 7:22 am | Product Releases | CommentsThe Kontron Gigabit Ethernet Switch VX3910 offers 3U VPX (VITA 46.x) and OpenVPX (VITA 65) platforms Enterprise-Class Switching functionality with a total of 28 Gigabit Ethernet ports and advanced management features. With its
Lamp Integrates Light, Computing, and Vision
June 14, 2010 5:40 am | Videos | CommentsLuminAR reinvents the traditional incandescent bulb and desk lamp, evolving them into a new category of robotic, digital information devices.
Miniature Digital Temperature Sensors Protect Portable Products
June 12, 2010 8:32 am | Stmicroelectronics | Product Releases | CommentsSTMicroelectronics announced a miniature, digital temperature sensor targeting portable devices. The STTS751 is mounted on the circuit board to feedback accurate temperature data allowing the system to
Low-Profile Power Inductors Handle High Currents
June 5, 2010 12:35 pm | Product Releases | CommentsMag Layers USA announced itsLow Profile Ultra High Current Power Inductors. The company offers case sizes ranging from 3 mm x 3 mm to 12 mm x 12 mm with a frequency range to
Inductors Tout Desirable DC Bias Characteristics
June 5, 2010 12:04 pm | Product Releases | CommentsTaiyo Yuden’s NRS6010 (6.0 mm x 6.0 mm, with a maximum height of 1.0 mm) and NRS5012 (5.0 mm x 5.0 mm, with a maximum height of 1.2 mm) wire-wound power inductors feature
