VIA Technologies today announced the latest addition in the growing VIA Modular Solutions portfolio, the VIA COMe-8X91. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles for customers to rapidly develop new and exciting devices.
Data Translation, Inc. announced the release of the DT9838 strain- and bridge-based acquisition module for USB. The module offers high-speed performance in a compact form factor for applications including strain, load, pressure, and other bridge-based measurements.
Here’s another video of Enprion’s Power SoC technology. Here, Mark Cieri, Director of Marketing and Business Development, and Ahmed Abou-Alfotouh, Ph.D., manager Systems Architect Group demonstrate
PC-based analysis of previously captured test data is a growing technology that offers great value to teams looking for alternatives that hold promise. While PC-based tools that operate with files captured on oscilloscopes have existed for a decade, adoption has been slow.
Congatec Inc. introduced conga-TM77, a new module with a significant improvement in computing performance combined with enhanced energy efficiency, according to the company. The crucial innovations in the 3rd generation Intel Core processors relate to
Central Semiconductor Corp., announced the CTLT3410-M621 (NPN) and CTLT7410-M621 (PNP) transistors in the space saving, low profile TLM621 surface mount package. These new devices are rated at 1.0 A of continuous collector current, 25-V collector-to-emitter voltage and have an
VIA Labs, Inc. announced its 3rd generation USB 3.0 hub controller, the VIA Labs VL812. The controller uses a new low-power design and features an integrated 5V DC-DC switching regulator, offering a single-chip solution that
Kycon added a high-current panel mount DC power jack option to their current series of power jacks. The expansion of the power jack line allows for design flexibility, with reliability in high-current and repetitive applications such as
Texas Instruments Incorporated (TI) introduced an integrated circuit (IC) that, according to the company, converts a smartphone or tablet computer’s narrow soundstage into a much wider and exciting audio experience for consumers. The LM48903 stereo Class D spatial array IC
MEN Micro offers the G214, a 3U CompactPCI Serial multi-display controller board based on the latest AMD Radeon processor architecture. The new peripheral board is appropriate for use for video surveillance in control rooms as well as
Analog Devices, Inc. introduced a series of 1-GHz, dual-core, Blackfin processors. The ADSP-BF608 and ADSP-BF609 are optimized for embedded vision applications, featuring a high performance
PLX Technology, Inc. announced the TeraPHY TN8045 10GBase-T transceiver, a quad-port physical layer (PHY) housed in a small 25mm-square package that is space-optimized to allow for 12 devices to fit side-by-side in a
Greg Brown of Microchip Technology is my guest in this edition of Five Questions. Microchip has just introduced its PIC16F(LF)178X family of 8-bit enhanced mid-range core microcontrollers which include
EarthLCD.com announced the immediate availability of its ezLCD-302 smart LCD module. The unit provides a desirable solution as a graphical user interface (GUI) for outdoor applications. Its all-in-one modular design unites
Express Logic, Inc. announced the IAR Systems exclusively offered ThreadX-Lite RTOS, a new, single-user license targeting the ARM Cortex-M series microcontrollers. A subset of the popular ThreadX RTOS, ThreadX-Lite contains many
STMicroelectronics has introduced a new member of the iNemo sensing family, a 9-Degree Of Freedom, fully integrated sensor module, to enable advanced movement and location-sensitive apps, location-based services (LBS) and indoor navigation on portable
Microchip Technology Inc. announced the expansion of its 8-bit PIC16F(LF)178X enhanced Mid-range core microcontroller (MCU) family to include advanced analog and integrated communication peripherals, such as on-chip 12-bit analog-to-digital converters (ADCs), 8-bit digital-to-analog converters (DACs), operational
Tinker’s Toolbox returns to the data center with Jeff Klaus, Director of Data Center Solutions at Intel. Workload, power consumption, thermal management and energy efficiency are always concerns in the data center, and Jeff will
Dialog Semiconductor plc announced a high performance VoIP phone chipset, the SC14453. The single chip processor the company’s VoIP portfolio as its flagship product and integrates
OKW has launched the new ’CARRYTEC’ range of plastic enclosures for portable electronics equipment. These enclosures have a modern contoured design and feature an integrated handle which is ergonomically designed for
iWorx has introduced the IX-404E Data Acquisition System for OEM applications that require data recording and analysis. The system features four single-ended analog inputs and a 16 bit analog-to-digital converter. It is capable of
Powerstax introduced the D0601 DC input 1U rack mounted front-end power module to complement its existing popular range of AC input models. It is designed to operate as part of a DC-UPS or distributed DC power system, with or without battery backup and
How do you feel the Cloud will most impact product development in the coming year?
The MESA 7I70 is a 48 point remote isolated field input card designed for fast real time PC based control systems. The 7I70 communicates with the host with a robust isolated RS-422 link. Standard CAT5 cables are used for wiring convenience.
Despite the human and economic toll wreaked by the Japanese earthquake one year ago, the country's NAND flash memory industry managed to pull off a rapid rebound from the disaster, as strong demand and other factors allowed Toshiba Corp. to quickly regain some of its lost market share, according to the IHS iSuppli Memory & Storage Service at information and analytics provider IHS. The earthquake that occurred on March 11, 2011 impacted