TSMC, the world's top contract chip maker, confirmed on Tuesday it is aiming to manufacture bigger silicon wafers that could lower the cost of chip production, but said technical difficulties will remain in the next five years.
A newly developed carbon nanotube material could help lower the cost of fuel cells, catalytic converters and similar energy-related technologies by delivering a substitute for expensive platinum catalysts.
University of Utah engineers designed microscopic mechanical devices that withstand intense radiation and heat, so they can be used in circuits for robots and computers exposed to radiation in space, damaged nuclear power plants or nuclear attack.
The young interns, some of the nation's best and brightest in technology, business and design, had plenty of enthusiastic words to describe their summer employer.
The European Extremely Large Telescope (ELT) will directly image planets outside the solar system and those orbiting other suns in so-called "habitable zones" to perhaps answer the question of whether there is life elsewhere in the universe.
Apple Inc. says its newest MacBook Pro laptop computer will be about as thin as its already-slim MacBook Air. It will also have a sharper display, akin to what the iPhone and the iPad now have.
On Wednesday, the Internet Corporation for Assigned Names and Numbers will release a list of some 2,000 proposals for new Internet address suffixes. They can represent hobbies, ethnic groups, corporate brand names and more.
As touch panel interfaces become the norm on mobile devices, laptops and tablets, Loctite Liquid Optically Clear Adhesives (LOCA) from Henkel Corporation are improving the viewing experience, increasing display durability, extending product life, reducing power consumption and enabling thinner device designs. New dual cure technologies allow full cure in shadowed areas, and offer vastly reduced shrinkage to control display distortion and eliminate mura. As touch panel interfaces become the norm on mobile devices, laptops and tablets, Loctite Liquid Optically Clear Adhesives (LOCA) from Henkel Corporation are improving the viewing experience, increasing display durability, extending product life, reducing power consumption and enabling thinner device designs. New dual cure technologies allow full cure in shadowed areas, and offer vastly reduced shrinkage to control display distortion and eliminate mura.
The event, "RoboCity12: Robots para los ciudadanos" (Robots for the people), hosted by the Escuela Técnica Superior de Ingenieros Industriales (School of Industrial Engineering - ETSII) of the Universidad Politécnica de Madrid (UPM), gathered nearly 40 robots "made in Spain" for two days. The objective was to present the most recent advances in robotics that have been developed in the Community of Madrid, as well as the main innovations that have appeared on the national and international scenes.
WinSystems today introduced two new isolated digital signal conditioning and termination boards for OEM embedded computer system designers.
Pepperl+Fuchs introduces F260 Series Ultrasonic Sensors.
When Apple Inc kicks off its annual conference for software developers on Monday, all the power players in the Apple universe will be on hand, save the one that is in many ways driving the agenda: Google Inc.
President Barack Obama couldn't bear to part with his BlackBerry. Oprah Winfrey declared it one of her "favorite things." It could be so addictive that it was nicknamed "the CrackBerry.
Is your doctor a technophobe? Increasingly, the answer may be no. There's a stereotype that says doctors shun technology that might threaten patients' privacy and their own pocketbooks. But a new breed of physicians is texting health messages to patients, tracking disease trends on Twitter, identifying medical problems on Facebook pages and communicating with patients through email.
Curtiss-Wright Controls Defense Solutions has announced that it is currently shipping the XMC-651, the embedded military market’s first managed XMC Ethernet Switch.
Texas Instruments Incorporated (TI) (NASDAQ: TXN) is offering developers a cool treat to kick off their summer right. TI today announced the availability of a new software development kit (SDK) that brings Android 4.0 (“Ice Cream Sandwich”) to TI’s Sitara™ AM335x and AM37x ARM®-Cortex™-A8 processors. This complete software offering allows innovators to
Molex Incorporated announces the addition of two new products in its Premo-Flex line of flat flex cable (FFC) and etched polyimide jumpers. Both products provide ultra-flexible, durable PCB connections for a variety of applications including medical devices, consumer electronics and automotive electronics.
Google Inc is deploying a fleet of small, camera-equipped airplanes above several cities, the Internet search company's latest step in its ambitious and sometimes controversial plan to create a photo-based map of the world.
TOREX SEMICONDUCTOR LTD. has developed a low noise amplifier in CMOS process aimed at the 470MHz~880MHz bandwidths of terrestrial digital TV.
Australia's Defense Minister Stephen Smith left his laptop and mobile phone in Hong Kong to avoid cyber espionage in mainland China where he will attend bilateral defense minister talks on Wednesday, Australian media reported.
Eugene Kaspersky, whose lab discovered the Flame virus that has attacked computers in Iran and elsewhere in the Middle East, said on Wednesday only a global effort could stop a new era of "cyber terrorism".
Embedded computing packaging continues to pack faster/hotter processors into tighter spaces. Not only are the processors requiring more cooling, but often the enclosures are stuffed with more boards and components, taking away space from airflow. Electronics packaging companies have had to get creative to tackle some of the more challenging applications
Engineers can follow my tips to ensure their diagrams enhance their writing.
(Reuters) - Apple Inc is facing delays in renewing its request that a U.S. judge ban Samsung Electronics' Galaxy 10.1 tablets, a key battleground in the worldwide patent wars between the technology giants.
As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges. To help them address these challenges and ensure that products meet performance and reliability requirements,