The YouTube video, featuring a young blonde sitting in a strikingly modern San Francisco home, offers a telling insight into the attitudes that are shifting the geography of the Bay Area technology scene.
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Phoenix Display International (PDI), Inc., has introduced a new line of custom and standard transflective TFT LCDs ideally suited for demanding outdoor applications. The transflective color LCD screen modules are available in 320 x 240 (QVGA) resolution in 2.2”, 2.8”, 3.2”, and 3.5” sizes as well as
Verotec’s H family of horizontal chassis provide a “plug ’n ’play” environment for hardware and software developers and system integrators using either cPCI or VME64x architectures. The chassis, which mount PCBs horizontally, are complete with a PSU, thermal management and have
Murata Power Solutions announced the OKX Series of miniature non-isolated single output DC-to-DC converters designed for embedded point-of-load (PoL) applications. Within the OKAMI OKX Series there are four models that provide 3-A or 5-A outputs with either 5-V or 12-V nominal inputs.
Bosch Sensortec has integrated two triaxial MEMS sensors in a single package. This combination of an acceleration sensor and a gyroscope yields the BMI055, said to be the smallest Inertial Measurement Unit in the market. The IMU is designed to
Taiwan's UMC, the world's No.2 contract chip maker, said it will invest $8 billion in a 12-inch wafer plant in Taiwan, joining its peers in investing in high-end technology to meet demand for chips in fast-growing markets like mobile devices.
Intel Corp is launching research in Israel into technology that mimics the human brain and develops devices that "learn" about their user.
As the nation readies itself for the upcoming 2012 Hurricane Season, businesses and organizations have evolved their business continuity and disaster recovery plans to include mobile security services in the effort of protecting their IT infrastructure.
(Reuters) - Apple has maintained its place as the world's most valuable brand over the past year, leading a group of technology-related companies that dominate the top 10, according to a study published on Tuesday. The iPhone and iPad maker has boosted its brand value by
Ericsson has announced a new series of Power Interface Modules that save board space for core processing functions and enable system architects to design equipment with energy monitoring features, enabling the use of optimization algorithms to
WinSystems announced a two channel, Gigabit Ethernet LAN module designed to offer flexible, high-performance networking connectivity for industrial embedded applications. Named the PPM-GIGE-2, it offers self-stacking I/O expansion on PC/104, EPIC, and EBX SBCs based on the industry-standard
Two new controller kits for the ScanWorks platform for embedded instruments from ASSET InterTech can, according to the company accelerate test throughput by plugging into the high-speed PCI Express (PCIe) bus in the personal computer where ScanWorks is running.
Anyone involved in high-performance computing understands that among the most crucial elements of a successful cloud implementation is storage and memory technology that complements all ingredients of the computer system. Memory, in particular, must provide speed, capacity and scalability.
Comic book hero superpowers may be one step closer to reality after the latest technological feats made by researchers at UT Dallas. They have designed an imager chip that could turn mobile phones into devices that can see through walls, wood, plastics, paper and other objects.
Silicon intellectual property (IP) provider Evatronix SA has announced the release of the first member of its PANTA high performance display controller core family. Developed using ARM technology the PANTA DP20 is targeted specifically at high-end mobile/portable products...
VIA Technologies today announced the latest addition in the growing VIA Modular Solutions portfolio, the VIA COMe-8X91. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles for customers to rapidly develop new and exciting devices.
Data Translation, Inc. announced the release of the DT9838 strain- and bridge-based acquisition module for USB. The module offers high-speed performance in a compact form factor for applications including strain, load, pressure, and other bridge-based measurements.
Here’s another video of Enprion’s Power SoC technology. Here, Mark Cieri, Director of Marketing and Business Development, and Ahmed Abou-Alfotouh, Ph.D., manager Systems Architect Group demonstrate
PC-based analysis of previously captured test data is a growing technology that offers great value to teams looking for alternatives that hold promise. While PC-based tools that operate with files captured on oscilloscopes have existed for a decade, adoption has been slow.
Congatec Inc. introduced conga-TM77, a new module with a significant improvement in computing performance combined with enhanced energy efficiency, according to the company. The crucial innovations in the 3rd generation Intel Core processors relate to
Central Semiconductor Corp., announced the CTLT3410-M621 (NPN) and CTLT7410-M621 (PNP) transistors in the space saving, low profile TLM621 surface mount package. These new devices are rated at 1.0 A of continuous collector current, 25-V collector-to-emitter voltage and have an
VIA Labs, Inc. announced its 3rd generation USB 3.0 hub controller, the VIA Labs VL812. The controller uses a new low-power design and features an integrated 5V DC-DC switching regulator, offering a single-chip solution that
Kycon added a high-current panel mount DC power jack option to their current series of power jacks. The expansion of the power jack line allows for design flexibility, with reliability in high-current and repetitive applications such as
Texas Instruments Incorporated (TI) introduced an integrated circuit (IC) that, according to the company, converts a smartphone or tablet computer’s narrow soundstage into a much wider and exciting audio experience for consumers. The LM48903 stereo Class D spatial array IC