Fox Electronics offers a new line of Application Specific XpressO oscillators optimized for Fibre Channel configurations. As with all models in the 3.3 V XpressO line, the Fibre Channel oscillators are off-the-shelf, pre-configured to precise application-specific requirements in
The Elo TouchSystems 2242L touchmonitor includes IntelliTouch Plus surface acoustic wave product technology. It provides OEMs and software developers a ruggedized, 22-inch open-frame touchmonitor built to reliably run multi-touch gaming, wayfinding, concierge services and other touch-powered self-service programs.
MIPS Technologies, Inc. announced that Altair Semiconductor licensed MIPS Technologies’ multi-threaded synthesizable processor IP for next-generation chipsets targeting mobile broadband baseband and modem applications for mobile devices. Altair is a long-time MIPS licensee, leveraging the MIPS® architecture across its entire line of LTE chipsets.
Pelican Imaging Corporation announced that it has developed the first prototype array camera for mobile devices. In addition, the company has announced its Technical Advisory Board that is comprised of three leading experts in computational imaging. The members are
In this episode of the Tinker's Toolbox we talk to Sherif Hanna of Atmel about their the maXTouch E Series of single-chip capacitive touchscreen controllers for touchscreens from 2 to 12 inches, a sweet spot in the tablet device category.
Integrated Product Management: New approach to software tools and processes for the systems engineerFebruary 8, 2011 7:43 am | by Steve Shoaf, IBM Rational | Articles | Comments
The demand for smarter products is driving manufacturers and service providers to look for new, innovative ways to differentiate their products and enable them to be easily configurable for highly individualized usages. However, because most manufacturers now rely on a global network of design partners and suppliers to create highly sophisticated products...
SL Industries expanded its AULT brand line of PoE injector products with the addition of the high-power PENT1080 Series capable of supporting data transfer rates of up to one gigabit. The new series accepts AC-DC universal input
XP Power announced the launch of the ECP150 Series of compact open frame 150-W AC-DC power supplies. Measuring 4 x 2 x 1.26 inches (101.6 x 50.8 x 32 mm) and with a power density of
TDK-Lambda Americas has added to its line of AC-DC medical, ITE (information technology equipment), and industrial power supplies. The single-output CSS500 Series of 360 W to 500 W supplies accepts a
Bourns, Inc announced its latest series of TBU (Transient Blocking Unit) circuit protection devices for high speed protection of communications ports. The devices are said to be the industry’s first electronic current limiters (ECLs) designed to tolerate AC mains power contact without
In this episode of the Tinker's Toolbox we talk to Chris Forbes, CEO of Knovel.
A big portion of electrical energy is lost between generation and transmission. Besides the need for improving efficiency, many other market forces are causing a major transformation in the Energy and Utilities (E&U) industry (E&U)...
International Rectifier introduced a family of DirectFET plus power MOSFETs featuring the company’s new generation of silicon that is asserted to set a new standard in efficiency for 12-V input synchronous buck applications including
Scientists studying an exotic new superconductor based on the element ytterbium reported that it displays unusual properties that could change how scientists understand and create materials for superconductors.
Semiconductor Research Corporation and researchers from Stanford University have developed a novel combination of elements that yields a unique nanostructured thermal material for packaging.
Lumex announced the global launch of the surface mounted QuasarBrite 0404 RGB LED. Its 1.0 mm x 1.00 mm x 0.25 mm package size is asserted to be the smallest RGB LED package available today, and it is suited for multicolor LED indicator applications in
Extreme Engineering Solutions, Inc. (X-ES) introduced the XPedite7470, a conduction- or air-cooled 3U VPX Single Board Computer (SBC). Based on the 2nd generation Intel Core i7, the SBC uses the processor's quad-core technology operating at 2.1 GHz to
Electro Standards Laboratories offers Fiber 232 Models 4137EU and 4139EU with two-pin European power supplies. These HP VersaLink Fiber to RS232 Converters are used to connect fiber optic linked terminals to a controller having an RS-232 interface port. They are
At this years Consumer Electronics show, the most interesting product I saw wasn’t a Windows 7 or an Android pad. Yawn. Perfectly fine products for sure, but not really new. Rather, simply a turn of the crank and put in an iPad like form factor.
At the NVIDIA GPU Technology Conference (GTC) in September this year several ISVs announced extensive support for GPU based functionality. A reasonable question that arises from these announcements is ‘why now’? GPUs have already found favour in a number of computational disciplines...
Gizmox today introduces Instant CloudMove, the first automated tool-based solution for transforming enterprise client/server applications from desktop to a Cloud/Web and mobile deployment. Leveraging Gizmox’s Visual WebGui (VWG) virtualization application and streaming platform...
Bliley Technologies, Inc. introduced a customizable oven controlled crystal oscillator (OCXO), the NV47AE, for high-precision telecommunications, medical and military electronics. The OCXO is positioned as specifically configured for
In this episode of the Tinker's Toolbox, we talk to Steve Fossi of Symmetricom about their new chipscale atomic clock (CSAC), the first commercial device of its kind. Right-click to download the podcast
NXP Semiconductors announced the LPC11C22 and LPC11C24 – the industry’s first integrated high-speed CAN Physical Layer transceiver and microcontroller with on-chip CANopen drivers.
Analog Bits announced availability of a full design kit for their PLL IP products, supporting the 28nm Common Platform process of IBM, Samsung and Global Foundries.