Few organizations have moved to cloud computing -- the delivery of computing as a service from remote centers -- and of those that have, many are disappointed with the results, a survey published on Tuesday found.
NXP shows several platform demonstrations of their video interface technologies at Boston ESC 2011
The conga-QAF Qseven module, which is based on the AMD Embedded G-Series, is the first module to combine high performance graphics, dual core processing power and low power consumption in such a small form factor.
SL Industries introduced the CINT1200 product family with 200 Watts of output power and eight different models ranging from 12 V to 48 V. This new single output embedded supply accepts wide input range of 90 V to 264 VAC and with over 90 percent efficiency plus
IBM today released the results of its X-Force 2011 Mid-Year Trend and Risk Report, which demonstrates the rapidly changing security landscape characterized by high-profile attacks, growing mobile vulnerabilities and more sophisticated threats such as “whaling.”
SanDisk, a global leader in flash memory storage solutions, announced that it has implemented the new SATA µSSD specification into its SanDisk iSSD product line of postage stamp-sized embedded SSDs.
The SSD Company, a leading global provider of solid-state drive technologies and products, announced that it has entered into a technology collaboration with OEM and customer Pure Storage, the all-flash enterprise storage company.
John from Cypress Semi demonstrates their latest touchscreen technology, featuring fast response, efficient operation, and very high noise rejection at ESC Boston 2011.
BitBlast is a Vector Engine Co-Processor enhancement that is able to achieve the fastest programming speeds for high-density managed NAND devices that utilize the eMMC interface.
RIA Connect’s AJS17G is positioned to bring high-speed and ultra-miniaturization to OTG devices. At roughly half the size of a mini-B style USB, the AJS17G connector is a surface mount device, appropriate for
This month's question is: Now that today’s products must not only be intelligent, they must be interactive with users and fellow devices over a network. What do you feel the greatest challenge to the engineer is to achieve that functionality?
Carrier Ethernet Aggregation Switches Offer 100 GbE Performance, Flexibility for PTN and IP-RAN DeploymentsSeptember 26, 2011 6:29 am | Product Releases | Comments
Broadcom Corporation unveiled its latest high performance StrataXGS® switch solutions optimized to meet the bandwidth, scalability and efficiency demands of next-generation Carrier Ethernet aggregation platforms. The StrataXGS BCM56640 Series for modular platforms, and the
In today's podcast we talk to Alf Bogen of Atmel on Intelligent Embedded Systems. Today's engineer is faced with designing products containing systems of systems, often individually intelligent.
Vector Fabrics has announced today they will showcase their vfEmbedded software development tool parallelizing code for NVIDIA's multicore mobile Tegra chip at ESC Boston.
SmartDraw Software announced key enhancements to SmartDraw VP, presented as the world's first visual processor, that improve the user experience and increase ease of use while adding key functionality.
This humorous video shows Lattice's ECP3 FPGA and touts its Low Power, SERDES, DDR3, Cascadable DSP, Embedded Memory Blocks, and other advantages with rapping engineers.
STMicroelectronics announced the introduction of its new STM32 F4 Series of microcontrollers (MCUs). This extension to the STM32 platform is based on the latest ARM Cortex-M4 core, which adds signal-processing capabilities and faster
EMA Design Automation announced the release of five PCB design productivity applications (apps) to be available inside the Cadence Design Systems OrCAD Capture Marketplace.
In today's podcast we talk to Mike Beunder, CEO of Vector Fabrics on optimization and parallelization of applications for multi-core processors.
WIN Enterprises announces thePL-80320, a fanless box computer for embedded applications powered by VIA Nano/Eden processors.
Ericsson has introduced two sixteenth-brick format DC-DC converters that are asserted to provide designers with quick and reliable board-mounted power solutions, addressing increasing demands for shorter time-to-market. Designed to
PLX Technology, Inc. expanded its PCI Express (PCIe) Gen3 switch family with three new devices compliant with the PCI Express Gen3 r1.0 Specification. The new PLX ExpressLane PEX8749 (48-lanes, 18 ports), PEX8733 (32 lanes, 18-ports) and PEX8725 (24 lanes, 10 ports) PCIe Gen3 switches promise
The Tinker's Toolbox - McObject CEO Steve Graves on Database Systems and Distributed Embedded SoftwareSeptember 19, 2011 5:47 am | Podcasts | Comments
In today's podcast we talk to McObject CEO Steve Graves about database system management and distributed embedded software.
The DFI Technical Group today released the preliminary DFI 3.0 specification defining an interface protocol between DDR memory controllers and PHYs. The new specification enables the development of chips to support the emerging DDR4 memory standard.
AVX Corporation has developed a broadband inductor that offers low insertion loss up through 40 GHz. Featuring a pyramid shape and rugged powdered iron core, the GL Series broadband inductor provides