Curtiss-Wright Controls, Inc. announced the launch of its new Defense Solutions business group, the Defense and Aerospace market's largest supplier dedicated to Commercial-Off-The-Shelf (COTS) and open standards solutions. The new Curtiss-Wright Controls Defense Solutions (CWCDS) organization, headquartered in Ashburn, VA, integrates the business operations of the Company's former Electronic Systems and Embedded Computing business units.Â
OCZ Technology Group, Inc. (Nasdaq:OCZ), a leading provider of high-performance solid-state drives (SSDs), announces the debut of new and exciting SSD solutions. Using the world's most popular technology tradeshow as a platform, OCZ's latest SSDs demonstrate a commitment to advancing flash storage technology into greater realms of performance and versatility, further driving adoption in client and enterprise applications.
This week at International CES 2012, Toshiba America Electronic Components, Inc. (TAEC), will be demonstrating the latest additions to its lineup of flash memory offerings – the TransMemory-EX series of USB flash memory products. The new drives are compliant with the new USB 3.0 standards – known as Super Speed USB. Initial storage capacities include a 32GB model and a 64GB model.
Bosch Sensortec announced the BMG160 digital triaxial gyroscope for smartphone and gaming applications. Asserted to be the world’s smallest triaxial gyroscope, the part features
Taking advantage of Micron's 4Gb DRAM technology, a family of 8GB DDR3 memory modules across the Crucial Ballistix Sport, Tactical, and Elite series provide users with the maximum capacity, performance, and density needed.
TranSwitch Corporation, a leading provider of semiconductor solutions in the rapidly growing consumer electronics and telecommunications markets, introduced its HDwire video interface solution. The Company's HDwire video interface solution offers the industry's fastest video interface, supporting current and next-generation, high-definition (HD) video displays. The ultra-fast HDwire panel interface ensures
TE Connectivity launched the FORGE power drawer connector for high-current and high-voltage power supplies and power distribution systems. This blind-mateable connector, produced from a scalable mold platform, allows users to
Maxim Integrated Products Inc. announced its TINI family of integrated SoCs and codecs for consumer applications. Offering desirable functional integration, these products enable
The Industrial Automation Group of Advantech introduces a new series of Class I, Division 2 certified automation computers, the UNO-1100H series, which all have received the Class I, Division 2 (Group A, B, C, D) certification expanding their uses to hazardous locations.
STMicroelectronics has introduced a dual-core gyroscope capable of handling both user-motion recognition and camera image stabilization. The dual-core gyroscope’s design employs separate output paths optimized for the two different functions in a
In this podcast we talk to Brian Kumagai of Toshiba about embedded memory.
ZiiLABS unveiled its 100-core ZMS-40 StemCell Media processor optimized for Android, combining 96 of ZiiLABS' StemCell media processing cores with four 1.5GHz ARM Cortex-A9 CPUs.
To enable applications to more quickly adapt to Tensilica's multicore configuration, PSI's Poly-Platform now supports Express Logic's ThreadX RTOS on Tensilica's Xtensa multicore devices.
VIA Technologies announced the VIA VB7009 embedded Mini-ITX board. Measuring only 17cm x 17cm, the flexible embedded board offers desirable functionality and performance for POS and kiosks. The VIA VB7009 offers a broad range of power efficient VIA CPU choices, including
Purdue researchers have created a new type of optical device small enough to fit millions on a computer chip that could lead to faster, more powerful information processing and supercomputers.Â Â
American Industrial Systems Inc., AIS, is an ISO 9001:2008 certified supplier and manufacturer of a 7” human machine interface terminal featuring RISC-based open architecture for easy integration and deployment. The commercial-off-the-shelf technologies are utilized to meet their increasing demands for easy to use HMI’s offering a lower total cost of ownership for printing, labeling and packaging machine industries. The GOIT750 operator interface terminal powered by Windows CE 6.0 operating system provides
Aitech Defense Systems Inc., has released the A175, a rugged, self-contained, EMC/EMI-protected Remote Interface Unit (RIU) I/O expansion subsystem that provides dynamic mission profile reprogramming. The subsystem uses
The WIZ820io from Saelig is a plug-in network module that offloads Internet tasks to a mini-board that includes WIZnet's popular W5200 IC (TCP/IP hardwired chip + PHY), a mag-jack (RJ45 with transformer) and other peripheral logic.
Vishay Intertechnology, Inc. announced that it has increased the minimum capacitance values for its VJ HVArc Guard surface-mount X7R multilayer ceramic chip capacitors (MLCCs). For lower capacitance values, the company offers a
LDRA has integrated its tool suite with National Instruments LabVIEW Virtual Instruments. The LDRA-NI solution offers hardware-in-the-loop (HIL) simulation, a technique used to develop and test the complex real-time embedded systems commonly
POSITAL's OPTOCODE absolute rotary encoders are available with full support for DeviceNet and EtherNet/IP interface standards. This ensures that these devices can be readily integrated into control systems based on Rockwell Automation/Allen-Bradley and Schneider PLC’s, providing
Ericsson has introduced two new isolated DC/DC power converters that come in an industry-standard sixteenth-brick form factor and deliver an output current up to 20 A, or an output power equivalent to
In this podcast we talk to Jon Devlin, Director of Ecosystem Enablement for the Networking Components Division of LSI about high-performance next-generation networks.
The Khronos Group today announced a new initiative to create an open, royalty-free standard for cross platform acceleration of computer vision applications.
Wind River is collaborating with Infineon Technologies as part of a multi-year partnership to extend its integrated software tools portfolio by optimizing Wind River Diab Compiler for the TriCore microcontroller architecture