Nordson EFD (East Providence, RI) introduces the new ValveMate 9000, state-of-the-art precision valve controller. The intricate microprocessor circuitry ensures the dispensing of precise, accurate, and repeatable amounts of the adhesives, lubricants, and other assembly fluids....
Stadium Power’s (Norfolk, UK) JSF Series of single output enclosed switched mode power supplies offer a compact and low cost unit with a high operating temperature up to 70°C for industrial, instrumentation, telecoms and IT systems. The JSF Series is
Test Equipment Plus (LA Center, WA) announced the Signal Hound BB60A, a real-time spectrum analyzer and RF recorder designed to capture and display RF events as short as 1 µs. The BB60A is a small, lightweight, and affordable USB-based real-time RF spectrum analyzer....
Tripp Lite (Chicago, IL) has introduced eight 3-phase switched Power Distribution Units (PDUs) in both hardwire and plug-in options that provide up to 28.8kW capacity. These new PDUs support 415V 3-phase input to the rack, a highly efficient means of power distribution....
Researchers in Liverpool have developed a computer virus that spreads via Wi-Fi like the "common cold." Now, when nearly every home has wireless Internet, it means that the virus can go from network to network exploiting weaknesses. The virus, once...
I can’t wait to live in GE’s home of the future. (Last week, I talked about the car I must have, so it seems fitting that my next topic be about my dream house. As with the car, this is assuming an unlimited budget and available technology.) Last week, I headed to Allentown, PA to the Da Vinci Science Center in order to see an exhibit called Home 2025.
VadaTech (Henderson, NV) announced a 40G MicroTCA chassis platform. The 5U chassis holds up to 12 full-sized Advanced Mezzanine Card (AMC) modules in the single width format. The VT866 is designed for 40GbE (10GBASE-KR) signals.
Silicon Labs (Austin, TX) expanded its ARM-based Ember ZigBee system-on-chip (SoC) portfolio delivering desirable wireless performance, energy efficiency and reliability for the Internet of Things (IoT). The EM358x family includes six SoC products that combine
To meet a specific need, system creators often assemble test solutions that incorporate a variety of hardware and software elements. One key benefit of accepted industry standards is the ability to pick and choose among elements offered by multiple vendors. Achieving success with—and confidence in—the integration of a multi-vendor solution depends on compatibility at the mechanical, electrical and software levels.
Every second, your computer must process billions of computational steps to produce even the simplest outputs. Imagine if every one of those steps could be made just a tiny bit more efficient. "It would save precious nanoseconds," explained Northeastern University assistant professor of physics Swastik Kar.
Curtiss-Wright Corporation (Ashburn, VA) announced that its Defense Solutions division has begun shipping its highest performance embedded graphics module, the new VPX3-716 3U OpenVPX multi-head graphics display card, the first based on the next generation AMD Embedded Radeon E8860 “Adelaar” GPU.
We have “smart” phones, watches, homes, cars, and even toothbrushes, and they’re getting smarter by the second. What will artificial intelligence revolutionize next? Ray Kurzweil, director of engineering at Google, bets it’ll be the search engine.
I am in desperate need of a self-driving car. We’re talking desperate. I would pay a considerable amount of money — in this circumstance not only does the self-driving car exist, it is widely available and I have hit the lottery — for a self-driving car.
There’s good news on the Net Neutrality front, and then there’s not-so-good news. First, the good news: On Wednesday, February 19, the Federal communications Commission announced it would not challenge the Federal Court’s ruling that vacated the FCC’s 2010 Open Internet rules and would instead rewrite its rules.
Air to Air heat exchangers offer increased heat power transfer within the industry standard footprintFebruary 20, 2014 10:01 am | Marlow Industries Inc. | Product Releases | Comments
The new Climatherm range of Air to Air heat exchangers from Marlow is said to bring increased heat power transfer while remaining within the industry standard footprint. Using Thermo Electrics at its core, these compact and modern designs give
EMAC (Carbondale, IL) has created the iPAC-9X25. Made in the USA, this industrial-strength ARM embedded single board computer is based on Atmel AT91SAM9X25 Processor. It has an industrial temperature range of -40C to +85C and utilizes 4GB of eMMC Flash, 16MB of Serial Data Flash (for boot), and 128 MB of DDR RAM.
Molex’ (Lisle, IL) Mega-Fit wire-to-board, mid-range power connector is presented as filling a significant power void in today’s interconnect marketplace by delivering 23 A in a small 5.7-mm footprint. The connectors are appropriate for
Emerson Network Power (Bannockburn, IL) announced an addition to the Johnson line of coax connectors, SMPM for applications such as radar, satellite, high density packaging, and applications requiring higher frequencies up to 65 GHz. These subminiature connectors feature
Silicon Labs (Austin, TX) introduced the industry’s first single-chip digital ultraviolet (UV) index sensor ICs designed to track UV sun exposure, heart/pulse rate, and blood oximetry and provide proximity/gesture control for smartphone and wearable computing products.
Announced today by Acopian Power Supplies (Easton, PA) is the UL recognition and CE approval of their mini encapsulated series of linear regulated power supplies. The AC-DC power supply series is encapsulated in an ultra-compact, low profile housing to provide the ultimate in environmental protection in space-limited applications.
Don’t you wish you could turn back the clock and apply the lessons you’ve learned later in life to the decision you made earlier in your career? Well, if you’re a new engineer, here’s your chance. We collected advice from experienced engineers, asking what they wish they knew when they just starting an engineering career.
Murata (Mansfield, MA) announced two additions to the Okami OKL range of non-isolated point-of-load DC-DC converters manufactured by Murata Power Solutions. The OKL2-T/12 and the OKL2-T/20 converters feature Murata's inspectable Land Grid Array (iLGA) package....
The Spectroline (Westbury, New York) PC-2200A UV EPROM/Wafer Erasing System is a portable, rugged unit that provides high UV intensity and irradiance uniformity to ensure complete erasure of programmed memory from every EPROM chip or wafer in as little as 5.4 minutes.
Cadia Networks (Laguna Hills, CA) announces the latest addition to its ARM product offerings in the form of a development kit for the iMX6 family of ARM SBCs, the iMX6-DK. This kit provides a single-box solution for OEMs....
With the new CAN-IB 500 and the CAN-IB 600, HMS (Chicago, IL) offers two interface cards (passive/active) that support not only CAN but also the new CAN FD standard. Both cards are for the PCI Express standard.