We have a VERY exciting Brainstorm about LEDs for our June Issue. This technology has been a really hot topic over the past few years with arguments about efficiency, price, preference and even environmental factors of utilizing different types of bulbs taking center stage.
Design engineers must take into account the type of harsh environments to which end-products may...
In the April issue, ECN is proud to announce the 2014 ECN IMPACT Award Finalists ...
Automotive infotainment systems of the future will benefit from a low-cost, low-power, flexible system-on-chip (SoC) architecture in order to enable a vehicle platform that adapts to evolving content delivery providers and cloud-based services.
Take a look at virtually any new smartphone or tablet device, and whatever the brand or size, they likely have one thing in common — touch screen displays. This ubiquitous level of adoption comes with challenges, particularly pricing and volume yields to meet mass market needs. The touch-enabled display represents one of the largest cost factors....
There are all sorts of harsh environments where electronic components need to function perfectly regardless of the temperature, dirt, weather, or other challenges. So what's the best way to protect them? Here's a great opportunity to showcase your opinion and knowledge on the topic by answering the question below. Ready to give it a try?
Solar is already a viable alternative to traditional carbon based and nuclear thermal power plants. In 2012, over 31 Gigawatts (GW) of new PV generation went online globally including 3.5GW in the United States alone. In 2013, that number in the United States is expected to grow by 28% to reach 4.9GW.
The December issue focuses on Test and Measurement and the challenges in the community when it comes to the push in the consumer market for faster, smaller, better electronics. The cover story focuses on predicting end-of-life for future mobile devices and is accompanied by a story exploring the options for reducing the effects when the systems do fail. The issue also featured our first OnDesign column by our newest writer Joshua Israelsohn who focused on Smart Grid technology.
Many of our aerial warfare and surveillance operations are now conducted in regions where we might not necessarily have air support operations near-by or they are in countries where we do not want the world to know we are conducting operations. The loss of a pilot is never something an air-wing wants to hear about....
3-D printing is spurring a new industrial revolution that is enabling design engineers to achieve new innovations in design and significant time and cost savings. The technology allows design engineers to build parts that cannot be made via traditional manufacturing, which in turn encourages heightened creativity and innovation.
I have the latest ACC with radar in my car, camera, lane departure warning, and what have you. Still, I need to watch out all the time, analyze the situation, engage, disengage, set a new setpoint, and so on. If I don’t do that, it can still become dangerous or at least uncomfortable, because the still relatively dumb system does not understand all it “sees”.
Capacitive screens have become fairly ubiquitous in the world of electronics. You can find them in tablets, cell phones, medical devices, and pretty much anywhere else you look. But using capacitive displays in designs can still be challenging. We want to know what you (or your company or your fellow engineer) struggle with when it comes to designing with touchscreens.
Machine assembly technology for all size orders (especially small sizes) and related advances in stencil printing capability significantly impacted board level assembly in 2013. The auto assembly field has benefited tremendously from this progress. A major driver for these auto assembly changes came from advances in board packaging from active components like semiconductors....
What’s the best technique for temperature management of sensitive components in extreme environments?November 22, 2013 4:33 pm | Articles | Comments
When it comes to environmental monitoring, most designers focus on temperature sensing for which there are a multitude of options. Few designers consider the benefits of including relative humidity (RH) sensing in their systems, which can be added to temperature sensing solutions without compromising board space and at very little additional cost.
It's about to be a new year at ECN and we're looking forward to the future with a Brainstorm about alternative energy! It's a hot topic in engineering and around the world as researchers, designers, and politicians try to figure out what the energy of the future will be. This month, we're focusing in on SOLAR POWER with a question for our readers
The advancement of the ultra low resistance Polymer Positive Temperature Coefficient (PTC) resettable fuse will impact the industry moving forward. Innovations in material science over the last few years have allowed PTC component makers to reduce the resistance of PTC’s....
3D printing has been used for years in larger companies, like the one I work for now. It is incorporated into the mechanical design process as part of the overall development and is optionally tailored out if not necessary or particularly useful. When end customers, as well as designers, see a plastic mock-up of the widgit they desire...
Here at ECN we're always looking for what's going to change the world of electrical design. This month we're focusing on board-level assembly. From adhesives to thermal gap pad management, we want to know what's happening in your lab and on your benches! We know our readers have varied opinions and valuable experiences...
Here at ECN, we love hearing from our own readers about different trends and new technologies you guys are working with! We like it so much we're devoting an entire issue to what our readers think about the impact of different technologies on their jobs and projects. Our forth and final category is automotive technology.
Here at ECN we're always looking for what's going to change the world of electrical design and make life better for our engineers. For November 15, we're focusing on Temperature Management. We know our readers have varied opinions and valuable experiences – now here’s a great opportunity to showcase them.
Paul Kierstead, Director of Marketing, Cree SiC Power With its proven ability to sustain high power densities in smaller devices, silicon carbide (SiC) material based power devices are now poised to replace silicon (Si) components, creating the potential to revolutionize energy efficiency and system performance in many types of power electronics systems.
Here at ECN we're always looking for what's going to change the world of electrical design and make life better for our engineers. For November, we're focusing on circuit protection. We know our readers have varied opinions and valuable experiences – now here’s a great opportunity to showcase them.
Here at ECN we're always looking for what's going to change the world of electrical design and make life better for our engineers. This month we're focusing on Time-to-Market strategies. We're looking at it a little bit differently and discussing the issues from the viewpoint of 3D printing and rapid prototyping.
Mike Kabala, ECN Reader The next advance in NFC will be in the area of multi-factor authentication. The current forerunner in this area is the Yubikey Neo, which contains both USB and NFC interfaces. Further advancement should eliminate the need for the USB connection, allowing a contact-free way of generating a one-time password for use in authentication.
V.Kadal Amutham, Reader: Already many countries are implementing mobile payment for ticketing in the bus / train and purchases at stores avoiding credit cards.Another possibility for this technology is as follows. The mobile phone will store any personal data like, size of cloth, preferred brand of many household items.
The biggest challenge is that LED chips are quickly approaching their theoretical limits for efficient light output. As they do, incremental improvements to the LED die are providing diminishing returns on investment. Fortunately, innovations in optical silicone packaging materials are introducing new, more cost-effective ways to enhance efficiency (lm/W), as well as cost (lm/$) and light density (lm/cm2).
Adeline Chan, product marketing manager, Cree, Inc.: LED technology has been evolving rapidly over the years. From a performance perspective, lumen output and efficacy numbers have been improving. Other “areas” of the LED technology have also progressed such as thermal properties, substrate materials, light distribution pattern,
Here at ECN we're always looking for what's going to change the world of electrical design. This month we're focusing on new material technology. From adhesives to thermal gap pad management, we want to know what's happening in your lab and on your benches!
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