Music blared and white smoke swirled in the cavernous Tata Motors hall at the India Auto Expo as an excited crowd milled near a stage displaying the company's new hybrid car.
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, will demo its next generation BONDJET BJ93X Heavy Wire Bonder at APEC 2012
The newest addition to Gefen’s growing family of Auto Volume Stabilizers boasts a high quality digital audio decoder, offering a new way to process audio and output rich sound. The GefenTV HD Auto Volume Stabilizer w/Digital Audio Decoder delivers a consistent volume level at all times...
Allegro MicroSystems, Inc. announced a new, two-wire, Hall-effect latch that is programmed at the factory to optimize the magnetic switch point accuracy. The A1244 Hall-effect latch uses the same high frequency, four-phase, chopper-stabilization
Car shoppers can expect auto offerings for 2012 to pack more of an environmental punch, with auto makers touting mileage in addition to performance.
When education and practical application merge, the results can be astounding. That was the aim of the College for Creative Studies (CCS), Visteon and OSRAM in their collaboration during the 2011/2012 academic year. As part of CCS’s ongoing Corporate Sponsorship program...
The MLX90132 from Melexis is a 13.56MHz, fully integrated, multi-protocol RFID/NFC transceiver IC. It supports ISO/IEC protocols 18092, 14443A and B, 15693 as well as 18000-3.
Over the next three years, the University of Washington team will compete amongst 15 Universities from the United States and Canada to develop a plug-in hybrid vehicle power train for a donated 2013 Chevrolet Malibu; build a showroom quality vehicle; acquire local sponsors; and launch an exhaustive outreach program intended to educate consumers on green vehicle technology.
Renesas Electronics announced that it has developed what is presented as the industry's first 40-nanometer (nm) memory intellectual property (IP) for automotive real-time applications.
Renesas Electronics Develops Industry's First 40nm Embedded Flash Memory Technology IP for Automotive Real-Time ApplicationsDecember 14, 2011 6:06 am | Renesas | Product Releases | Comments
Renesas Electronics Corporation today announced that it has developed the industry's first 40-nanometer (nm) memory intellectual property (IP) for automotive real-time applications. Renesas will also be the first to launch 40nm embedded flash microcontrollers (MCUs) for automotive applications...
The iC-MH8 system on chip magnetic encoder device provides fast step response for motor control applications. Combined with a diametrically magnetized permanent magnet, this compact device (QFN28 5x5 package) can be used to
Yamaichi Electronics introduced the moveable ground pin for its popular Open Top socket series IC357 for QFP type IC packages with exposed pad in test & burn-in applications. With its gull-wing shaped lead feet surface mount, QFP is most
Nexeon has begun a collaboration with a global tier one automotive OEM with a view to optimising the company’s technology for electric vehicle applications. The joint development agreement, which is worth ‘several million pounds’, will see the two companies co-operate in the development and evaluation of Nexeon’s silicon materials.
At today’s 2011 IEEE International Electron Devices Meeting (IEDM) Imec and Holst Centre announced that they have made a micromachined harvester for vibration energy with a record output power of 489µW.
In this podcast we talk to Peter Green of International Rectifier about solid-state lighting and the circuits needed to drive them.
Due to the extremely weak strength of GPS satellite signals, relying on GPS alone for mission-critical security applications is not enough. Global positioning performance can be augmented through the hybrid combination of GPS receivers together with 2G/3G wireless modems that can identify and report visible GSM or UMTS cell attributes.
American Sensor Technologies has developed the AST 2000H2 Hydrogen ASIC Pressure Sensor for use on hydrogen-powered vehicles and in other emerging hydrogen applications. The sensors are already certified for use by European and Asian automobile manufacturers as
APEM Components introduced the P65 series of rotary switches, a high temperature version of the company’s PT65 dual in-line package (DIP) coded rotary switch. The series is specially designed for high temperature soldering and is appropriate for
Kistler has introduced the USB-based Type 2825A DynoWare universal data acquisition and analysis software, designed for direct compatibility with Kistler stationary and rotary measuring systems, including single- and multi-component dynamometers and other force sensors. Its operation allows for
Silicon Designs, Inc. has announced the global market introduction of its new LG Series, a dedicated product family of low-g range chips and modules, designed to support of a variety of zero-to-medium frequency aerospace, automotive, defense, energy, industrial, and general test & measurement requirements. The LG Series provides
Elektrobit announced a software development initiative with IBM to deliver an integrated development solution to manage the growing complexity of Electronic Control Units software in automotive development
This tutorial, provided by Digi-Key and NXP, will provide a brief introduction to Class D audio amplifiers, as well as NXP's product offering in the low, medium, and high power output Class D amplifier markets.
Allegro MicroSystems, Inc. announces the release of a new family of automotive-grade, high-current LED driver ICs with extensive diagnostics and protection features. The A6265, A6266 and A6267 are DC-DC converter controllers, with the
Clarion, a leading manufacturer of high-performance in-car entertainment systems, is collaborating with Wind River to develop Android-based in-vehicle infotainment systems.
Vishay Precision Group announced that its Vishay Foil Resistors division (VFR) has introduced a new series of ultra-high-precision Bulk Metal Z1-Foil hybrid chip resistors designed for demanding high-temperature applications