Yamaichi Electronics introduced the moveable ground pin for its popular Open Top socket series IC357 for QFP type IC packages with exposed pad in test & burn-in applications. With its gull-wing shaped lead feet surface mount, QFP is most
Nexeon has begun a collaboration with a global tier one automotive OEM with a view to optimising the company’s technology for electric vehicle applications. The joint development agreement, which is worth ‘several million pounds’, will see the two companies co-operate in the development and evaluation of Nexeon’s silicon materials.
At today’s 2011 IEEE International Electron Devices Meeting (IEDM) Imec and Holst Centre announced that they have made a micromachined harvester for vibration energy with a record output power of 489µW.
In this podcast we talk to Peter Green of International Rectifier about solid-state lighting and the circuits needed to drive them.
Due to the extremely weak strength of GPS satellite signals, relying on GPS alone for mission-critical security applications is not enough. Global positioning performance can be augmented through the hybrid combination of GPS receivers together with 2G/3G wireless modems that can identify and report visible GSM or UMTS cell attributes.
American Sensor Technologies has developed the AST 2000H2 Hydrogen ASIC Pressure Sensor for use on hydrogen-powered vehicles and in other emerging hydrogen applications. The sensors are already certified for use by European and Asian automobile manufacturers as
APEM Components introduced the P65 series of rotary switches, a high temperature version of the company’s PT65 dual in-line package (DIP) coded rotary switch. The series is specially designed for high temperature soldering and is appropriate for
Kistler has introduced the USB-based Type 2825A DynoWare universal data acquisition and analysis software, designed for direct compatibility with Kistler stationary and rotary measuring systems, including single- and multi-component dynamometers and other force sensors. Its operation allows for
Silicon Designs, Inc. has announced the global market introduction of its new LG Series, a dedicated product family of low-g range chips and modules, designed to support of a variety of zero-to-medium frequency aerospace, automotive, defense, energy, industrial, and general test & measurement requirements. The LG Series provides
Elektrobit announced a software development initiative with IBM to deliver an integrated development solution to manage the growing complexity of Electronic Control Units software in automotive development
This tutorial, provided by Digi-Key and NXP, will provide a brief introduction to Class D audio amplifiers, as well as NXP's product offering in the low, medium, and high power output Class D amplifier markets.
Allegro MicroSystems, Inc. announces the release of a new family of automotive-grade, high-current LED driver ICs with extensive diagnostics and protection features. The A6265, A6266 and A6267 are DC-DC converter controllers, with the
Clarion, a leading manufacturer of high-performance in-car entertainment systems, is collaborating with Wind River to develop Android-based in-vehicle infotainment systems.
Vishay Precision Group announced that its Vishay Foil Resistors division (VFR) has introduced a new series of ultra-high-precision Bulk Metal Z1-Foil hybrid chip resistors designed for demanding high-temperature applications
Silicon Laboratories introduced an advanced automotive tuner IC family designed to deliver the highest RF performance coupled with advanced signal processing to reduce the cost and complexity of car radio systems.
EAO Corporation was featured in NBC Today Show coverage of the NFB Blind Driver Challenge highlighting the development of the first full-sized blind drivable vehicle.
MEN Micro Inc. has released the SC24, a rugged, maintenance-free single board computer (SBC) with a modular design that is presented as enabling the rapid implementation of custom computing requirements. The board's
Connectors have aided the acceleration in speed-to-market for several technologies. There have been advances in flex connector technology, enabling additional features that make engineering more efficient. Of course, reduction in size continues to
Cinterion launches AH3, its new high-speed automotive M2M module with a new triple-diversity antenna design. AH3 delivers reliable always-on communications across global 2G and 3G cellular networks for advanced applications...
austriamicrosystems has announced the AS8222 FlexRay transceiver. This transceiver, with an in-package maximum ambient temperature of 150°C and bare dice with a maximum temperature of 165 °C, is the first to be able to work in harsh, high temperature powertrain applications.
Broadcom, Freescale Semiconductor, and OmniVision Technologies announced a jointly developed 360-degree surround view parking assistance system – presented as the world’s first Ethernet-based parking assistance solution.
ON Semiconductor has introduced two new LED drivers to help designers optimize their solutions for automotive, industrial and general lighting applications.
The drive for green power and mobility demands next generation current sensor technology. Melexis’ introduction of its MLX91207 high speed custom programmable Hall-Sensor delivers that next generation sensor.
The Consumer Electronics Association (CEA) announced today its record number of automotive exhibitors at the upcoming 2012 International CES. At least six of the industry’s top ten manufacturers will showcase their latest technologies among CES' enhanced lineup of automotive technology exhibits...