Amphenol Industrial Global Operations expanded its ePower connector series to include the IP67-rated ePower 200 for use in smaller scale electromechanical systems with a 200-A current limit as well as in power converters, motors for hybrid electric vehicles and
Winbond Electronics Corp. announced it is bringing its popular SpiFlash Serial Flash memory technology to the rapidly expanding automotive-electronics market.
Renesas Electronics introduced the new RH850 family of 32-bit microcontrollers (MCUs) for automotive applications. The RH850 is based on 40 nanometer (nm) MONOS (metal oxide nitride oxide silicon) embedded flash technology...
The upcoming electronica China 2012 taking place from March 20-22 at the New International Expo Center in Shanghai will host many suppliers of advanced technology including Melexis. electronica China is the leading trade platform for
ITT Interconnect Solutions has developed the APD Series transportation connectors specifically to overcome harsh environments commonly found in heavy transportation applications. Sealed to IP67/IP69K specifications (with
ON Semiconductor has announced two new low dropout (LDO) voltage regulator ICs. Building on the company’s market-leading power management portfolio for automotive applications, the new devices are ideal for use in audio and infotainment systems...
Honeywell introduced its RTY Series Hall-Effect Rotary Position Sensors that provide a variety of options (e.g., sensing range, pinout, voltage) to allow customers to customize the sensor configuration to meet their specific application needs, especially
Semtech Corporation launched the first device in a platform of high-frequency switchers. The SC220 is said to be the industry’s first buck regulator that enables designers to draw their own inductors directly on the PC board (PCB). This device offers
IEEE International Electric Vehicle Conference Program Brings Together World Experts To Advance Electric Vehicle TechnologyFebruary 17, 2012 5:09 am | News | Comments
Advancing the adoption of electric vehicles and the power grid infrastructure needed to create more energy-efficient transportation systems will require developing and integrating diverse technologies, as well as adopting policies and standards needed to fully deploy these systems.
Holt Integrated Circuits announced independent validation of its CAN controller family at C&S group in Germany.
TDK-EPC, a group company of TDK Corporation, has published the EPCOS Application Guide 2012 â€“ Electronic Components for Automotive Convenience Applications.
TE Circuit Protection announced a family of eight new single-channel and multi-channel silicon ESD (SESD) protection devices offering what it asserts are the lowest capacitance
The first IEEE International Electric Vehicle Conference (IEVC) is scheduled for 4-8 March 2012 at the TD Convention Center in Greenville, SC. IEVC 2012 is designed to facilitate the exchange of information on global trends in technology, engineering, standards and deployment aspects among industrial, academic and regulatory thought leaders for the rapidly-growing worldwide electric vehicle ecosystem.
Ioxus, Inc. announced its new iCAP 3,000 Farad (F) ultracapacitor, the first size in a new family of cell products. These ultracapacitors are said to represent the lowest weight, lowest equivalent series resistance (ESR) and
Maxim Integrated Products introduced the MAX16919/MAX16969 Hi-Speed USB 2.0 automotive-grade protectors with iPod/iPhone fast-charge detection and USB host-charger detection for all USB gadgets. The protectors’ fast-charge detection supports
The Tinker's Toolbox - Mark Lefebvre of IBM Rational on Next-Generation Automotive Electronics IntegrationJanuary 31, 2012 5:29 am | Podcasts | Comments
In today's podcast we talk to Mark Lefebvre, Strategic Alliances and Integrations, IBM Rational, about next-generation automotive electronics and the challenges facing system integrators.
Realizing a true gasoline competitor will require many improvements in battery technology. With new battery chemistries capable of big increases in energy and power density, comes significant complexity in battery management to enable their practical use.
Allegro MicroSystems, Inc. announced the release of a new dual, full-bridge PWM motor driver IC targeted at the office automation, automotive, industrial and consumer markets. The A4970 motor driver IC uses
Created with a low profile and multiple circuit topologies, including independent; dual; in parallel; common collector; and common emitter, two new Powerex split dual SiC MOSFET Modules (QJD1210010 and QJD1210011) are designed for
International Rectifier introduced the AUIR0815S automotive-qualified IC featuring very high output current in excess of 10 A to drive large IGBTs or MOSFETs in inverter stages for the power train of hybrid and electrical vehicles.
Infineon Technologies introduced an innovative package technology providing high-current capability and high efficiency for demanding automotive electronics applications, including electric and hybrid vehicles.
STMicroelectronics introduced what is presented as the market’s first multi-functional door-zone driver with an integrated electric-window control.
Texas Instruments introduced a 100-V synchronous buck regulator with integrated MOSFETs. The 600-mA LM5017 is appropriate for telecommunication, industrial, smart grid and automotive systems. Used in conjunction with the WEBENCH online design tool, the regulator is
Cal Sensors announced the global launch of a new Sensor Prototype Kit, a plug-and-play tool deigned to accelerate prototyping, validation and product development for new gas measurement instruments. Supporting PbS and PbSe detector technologies, the kit allows
Advantech launched SOM-6765, the latest COM-Express Compact CPU module. This module is powered by the low power Intel Atom N2600 and D2700 processors based on COM.0 R2.0 type 2 pin-out. Type 2 pin-out and legacy I/O support make for