Mar 19 | Products
Pulse introduced what it asserts is the first digital subscriber line (DSL) NanoFilter. The Z-321NF in-line DSL customer premises equipment (CPE) MicroFilter offers both voice and data protection by
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Mar 18 | News
The demand for increased current density with modular power solutions has been met by a new breed of power interconnects from Tyco Electronics. The new designs make better use of available airflow and provide improvements in long-term reliability. Specific challenges related to energized...
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Mar 15 | Products
Standex Electronics introduces the R12575 micro-proximity switch which is ideal for use in non-contact position sensing in very small spaces. Built around the proven Standex GR200 ultra small magnetic reed switch, the R12575 measures just .379" in length and .098" in diameter, yet provides unparalleled sensitivity and performance.
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Mar 9 | Products
Efficient Power Conversion Corporation (EPC) today introduced a family of enhancement mode power transistors based on Gallium Nitride on Silicon technology.
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Mar 8 | Products
Amorphous cores from Payton Magnetics are made of magnetic alloys that are melted and then cooled at an extremely high rate. The materials exhibit metallic properties but lack the crystalline lattice of conventional metals, thus giving the materials
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Mar 5 | Products
NIC Components has expanded its NSPE family of high performance hybrid construction aluminum electrolytic capacitors to include extended temperature +135°C and 80 VDC and 100 VDC ratings. The NSPE products feature
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Mar 5 | Products
Vishay Intertechnology announced a series of metrology and laboratory ultra-high-precision Bulk Metal Z-Foil resistors built using Z1-Foil technology that features
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Mar 4 | Products
TT electronics IRC’s MHP Series power resistors feature power ratings from 20 W to 600 W in industry standard TO-220, TO-247 and SOT-227 transistor-style packages. The resistors provide
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Mar 4 | Products
RAF Tabtronics announced the release of a line of SMD Power Inductors for high reliability applications. This SESI Power Inductor product line features a low profile ruggedized high-grade package with an operating temperature range of -55°C to +125°C. The product is highly customizable with either SMD or thru-hole pin-outs and flexibility in the number of terminations.
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Mar 3 | Video
Jeff Sherman of TI demonstrated their latest packaging tech - DualCool, which incorporates extra heat-transfer structures in a power MOSFET to improve performance.
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