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Sensor System Presents as Ensuring Optimal Heat Sink Efficiency
Sensor System Presents as Ensuring Optimal Heat Sink Efficiency

The Tactilus heat-sink analysis system by Sensor Products Inc. enables engineers to visualize actual contact forces and pressure distribution data on the circuit board components. As the mounting screws between the CPU and the heat sink are torqued, it

New Type of Logic Device Uses Piezoelectric Effect
New Type of Logic Device Uses Piezoelectric Effect

Researchers at the Georgia Institute of Technology have developed a new class of electronic logic device in which current is switched by an electric field generated by the application of mechanical strain to zinc oxide nanowires.

Software Brings Web-Based Connectivity and Control to Embedded Apps

AdaCore 's Ada Web Server for Wind River’s VxWorks Real-Time Operating System, when used in conjunction with the GNAT Pro development environment, enables developers to embed an Ada-based web server within any application, accessible through web browsers.

Automated Test Outlook - Peer-To-Peer Computing
Automated Test Outlook - Peer-To-Peer Computing

For years the computing industry has implemented distributed architectures by dividing computing among multiple processing nodes.

Mini-ITX Motherboard Supports DDR3 Memory
Mini-ITX Motherboard Supports DDR3 Memory

The Minix 890GX motherboard is presented as the world’s first USB 3.0 & SATA 6Gbps mini-ITX form factor motherboard capable of supporting DDR3 memory targeted at applications such as HTPCs, Car PCs, BYO routers, servers, and NAS devices

UHS-II PHY IP Core Provides Next-Generation Memory Interface

Arasan Chip Systems, a leading provider of Total Semiconductor IP Solutions, announced that it has developed the UHS-II PHY IP core, a next generation memory interface being finalized by the SD Association.

PCI Express Cable Link Boards are Conduction-Cooled
PCI Express Cable Link Boards are Conduction-Cooled

PCI-Systems  announced OpenVPX Conduction-Cooled PCI Express Cable Link Boards, enabling accelerated development of rugged conduction cooled embedded systems.

PLC Development Kit Can Support Multiple Modulation and Protocol Standards
PLC Development Kit Can Support Multiple Modulation and Protocol Standards

The PLC Development Kit (TMDSPLCKIT-V2) is based on the industry's only PLC modem solution capable of supporting multiple modulation and protocol standards on a single hardware platform.

Applying OpenVPX Interoperability
Applying OpenVPX Interoperability

Ensuring interoperability between components, boards and systems has been an ongoing challenge for virtually all embedded systems designers, and was a factor in stifling the market potential for the powerful new VPX standard.

The Next Steps in OpenVPX Development
The Next Steps in OpenVPX Development

OpenVPX is now beginning to sprout promising green shoots as interoperability has become a significant focus around the VPX topic.

How Low Can You Go with “Low-Power Wireless”?
How Low Can You Go with “Low-Power Wireless”?

4 hours ago

One thing I’ve learned over the years in the semiconductor industry is that I really don’t know anything. Or rather, what I think I know is always changing or isn’t quite what I thought it was.

Darnell Power Forum Provides a New Look at Alternative Energy Applications
Darnell Power Forum Provides a New Look at Alternative Energy Applications

Sep 1

Wind power and photovoltaics get plenty of publicity, but how are the implementations taking place? Darnell’s Power Forum will feature several papers that look at some innovative applications in the alternative energy space.

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