Transducers USA (Elk Grove Village, IL) has introduced their new piezo ceramic MLCT (Multilayer Ceramic Transmitter) series. Its unique simple acoustic multi-layer ceramic construction produces a high output of 80 Db with only 16V low driving voltage.
RFMW (San Jose, CA) announces application and sales support for a new line of Low PIM (Passive Intermodulation) coaxial switches from Radiall. The rapid growth of 4G/LTE networks has led to the need for better-performing Low PIM devices. As a result, Radiall developed a broad series of switches....
TRUMPower (Santa Clara, CA) launched the TMP65 Series of low cost medical grade AC/DC desktop power adapters, which has both Class I and Class II models availability. The TMP65 Class II units, furnished with an IEC 320/C8 AC inlet without a ground pin, are
Premier Magnetics (Lake Forest, CA) announces its POL-LYT Series of switch-mode transformers designed to complement Power Integrations’ LYTSwitch family of integrated off-line LED driver/controller ICs. Features include a universal input range of 90 to 265 Vac.
NIC Components (Melville, NY) is pleased to announce the addition of NFVC_H series of surface-mount chip fuses to its expanded offering of circuit protection products. The newly released NFVC_H series feature high inrush withstanding performance in 6125 (2410) case size.
Schaefer (Hopkinton, MA) unveils the new PowerStack Power System, which is a 400KW to +10MW highly reliable, fully-customizable “built-to-project” Power Conversion building block. This is a ruggedized design for harsh environments and utilizing the newest state-of-the-art insulated-gate bipolar transistor (IGBT).
VadaTech (Henderson, NV) announced a 40G MicroTCA chassis platform. The 5U chassis holds up to 12 full-sized Advanced Mezzanine Card (AMC) modules in the single width format. The VT866 is designed for 40GbE (10GBASE-KR) signals.
HARTING (Elgin, IL) has brought a one-stop concept for designing and manufacturing 3D-MID components to North America. 3D-MID (3D Molded Interconnect Device) components are injection-molded plastic parts with integrated electrical circuits. These circuits can
Silicon Labs (Austin, TX) expanded its ARM-based Ember ZigBee system-on-chip (SoC) portfolio delivering desirable wireless performance, energy efficiency and reliability for the Internet of Things (IoT). The EM358x family includes six SoC products that combine
Digia (Nuremberg) has released a major update to Qt Enterprise Embedded, the fully-integrated solution that enables users to get started immediately with software development for an embedded device with a tailored user experience. The Qt Enterprise Embedded update introduces several new value-add features....
Leader Tech (Tampa, FL) beryllium-copper fingerstock gaskets are an ideal choice for making reliable electrical contact between parallel seams (mating surfaces) that are created by enclosure access doors and panels. Features include hundreds of easy-to-install styles and sizes to accommodate thousands of enclosure applications.
Power Partners (Hudson, MA) announces the PEAD90SLF Series of single output AC/DC desktop switching power supplies, which provide up to 90W of power. The standard input voltage range of 90-264VAC (47 to 63Hz) converts to output voltages of 12VDC, 18VDC, 19VDC and 24VDC....
The new maxon (Fall River, MA) EC-4pole 32 HD motor has been designed for extremely rough operating conditions, particularly applications in deep drilling. Deep drilling technology (called “downhole drilling” in the field of oil and gas exploration) makes it possible to recover oil and gas from depths of more than 2500 m.
Altium Limited (Sydney, Australia) announces the release of Altium Designer 14.2, the latest update of the DesignVision Award-winning Altium Designer 14. For this release, the emphasis of development was around the use of copper areas on the board.
Fujipoly’s (Carteret, NJ) 2005 Zebra Connector is constructed from alternating layers of conductive carbon and non-conductive silicone that are as thin as 0.0004” (0.010mm). This unique construction allows for 500 conductive layers per inch making it ideal for densely packed boards.