Product Releases
Subscribe to ECN Magazine Product Releases

Microwave Transistors Serve Telecom Applications

February 3, 2009 4:57 am | Comments

Coming in industry-standard ceramic-metal packages, Cree's CGH21120F and CGH25120F GaN HEMT microwave transistors perform in telecommunication applications, such as W-CDMA, LTE and WiMAX. The components consist of single, input-pre-matched GaN HEMT devices providing >120 W. The CGH21120F is designed for

Universal Control Module Uses Resistive Touchscreen

February 3, 2009 4:16 am | Comments

Designed for the food service industry, Renau Electronic Laboratories’ UCM-1000 universal control module utilizes a 4.3” WQVGA TFT color resistive touchscreen. The 5.25” W × 3.45” H × 0.90” D unit connects to Renau’s Hybrid Micro Control Series process controllers via Renau’s Single Wire Communication Network. The touchscreen

Equaliser/Driver/Retimer IC Addresses 10G SFP+ System Design

February 3, 2009 4:01 am | Comments

Suitable for ‘direct attach’ passive twin-ax copper cables and 10GBASE-SR optical modules, Phyworks’ PHY1066 equaliser, driver, and retimer IC enables host board designers to create 10-Gbps Ethernet SFP+ receive and transmit interfaces. The flip-chip, 36-pin, BGA-packaged component dissipates 0.68 W and drives up to 15 m of ‘direct attach’ passive SFP+ copper cable. The device’s hardware algorithms are said to


Amp Family Maintains 1.14 mA/channel Quiescent Current

February 2, 2009 9:54 am | Comments

Intended for applications such as pressure and flow meters, seismic equipment, and electrocardiogram machines, the THS differential amplifier family from Texas Instruments has a quiescent current of 1.14 mA/channel. With a power-down current of 20 µA, the devices have a 145-MHz and 490-V/µs slew rate to buffer and amplify signals. Other features include

RJ45 Jacks Integrate Magnetic Isolation

February 2, 2009 8:55 am | Comments

With features such as integrated magnetic modules to isolate common and differential-mode interference, a family of RJ45 LAN jacks from EPCOS is available in single, dual and quad-port versions. Able to withstand a breakdown voltage of 1,500 VAC, the connectors have an insertion loss of -1.0 dB, with values of -16 dB and -40 dB for the reflection loss and crosstalk, respectively. The components can operate over

Linear Drive Touts High Resolution

February 2, 2009 8:52 am | Comments

Featuring pure analog throughput for high brushless motor resolution, the TA333 High Power Linear Drive from Trust Automation can be configured to interface with any motion controller with a ±10 VDC command output. Able to achieve currents up to 25 A, the drive uses an external 24 VDC source of power for the internal logic. With ±100 Volt, the drive measures 14.9” x 7.7” x 4.7.”

AMOLED Display Lasts over 30,000 Hours

February 2, 2009 6:48 am | Comments

Demonstrating a resolution of 240 × RGB × 320 with up to 262,000 colors, OSD Displays’ OSD0283AMQV-T 2.8” diagonal QVGA Active Matrix Organic LED (AMOLED) module exhibits a lifetime rating of >30,000 hours. The device supports 18-/16-/6-bit RGB (DCLK, VSYNC, HSYNC, DE) and Intel/Motorola MPU 18-/16-/9-/8-bit bus interfaces. The 49.10-mm × 67.70-mm × 1.85-mm unit presents typ. luminance of

Voltage Measurement Instruments Offer 48 Inputs

February 2, 2009 6:29 am | Comments

Addressing lithium-ion cell-by-cell determination, Data Translation’s VOLTpoint Series precision voltage measurement instruments include 48 separate 24-bit resolution inputs each with its own A/D converter for direct connection to a PC via


Thermally Conductive Adhesives Dissipate Heat to 500ºF

February 2, 2009 6:09 am | Comments

Combining high-temperature resins and conductive fillers, Cotronics’ Duralco 132 thermally conductive adhesives form bonds with continuous service at up to 500ºF. The products are suitable for bonding and assembling heating coils, cooling coils, heating elements, heat sinks, reaction vessels, semi-conductors, rectifiers, and

Crystal Oscillators Exhibit Low Jitter

February 2, 2009 5:55 am | Comments

Covering from 150 MHz to 220 MHz, Pericom Semiconductor’s 2.50-V and 3.30-V SX and SN Series, and 3.30-V SD and SH Series XP crystal oscillators demonstrate a typ. phase jitter of 0.25 ps rms for CMOS and PECL clock applications, respectively. The components present peak-to-peak jitter of 40 ps, max. power consumption of

On Solid-State Lighting

February 2, 2009 5:37 am | Comments

This podcast is a discussion of Solid-State Lighting in the international marketplace. Solid-State Lighting (SSL) is poised to change the world, or at least the way we illuminate it, and technologies such as OLEDs and LEDs are at the vanguard. In addition, SSL is also behind the latest breakthroughs in high-definition televisions and projectors, the leaders in consumer technology spending. This discussion will examine where SSL is currently being used, where it is going, and what you can do with it.

Carrier Supports Four LXI Function Cards

February 2, 2009 4:41 am | Comments

Running the Linux 2.6 kernel via a 300-MHz processor, Bustec's ProDAQ 6100 LXI function card carrier provides access for up to 4 Bustec ProDAQ function cards through a standard Gigabit LAN interface. The 1U 19” half-wide device offers an accuracy of 20 ns via synchronization of the data acquisition and Ethernet clocks to

Mini 3-A Converter Boasts Integrated Inductor

February 2, 2009 4:39 am | Comments

Delivering an output of 3 A in a 28-mm² package, the EN5337QI synchronous buck DC/DC converter from Enpirion has an integrated inductor for a power density of 149 W/in². The 5-MHz device accepts an input from 2.375 V to 5.5 V and operates at an efficiency as high as 92%.


Battery Charger IC Enhances Internal Protection

February 2, 2009 4:20 am | Stmicroelectronics | Comments

Operating in cell phone handsets, STMicroelectronics’ ESDA8V-1MX2 battery charger IC absorbs mains-borne surges containing peak pulse energy of up to 500 W. The 1-mm × 1.45-mm × 0.55-mm unit offers a 50% reduction in leakage current, which reduces drain on the battery for improved performance and longer recharge

DRAM Chip Is Densest Available

January 30, 2009 10:50 am | Comments

Using 50-nm process technology, the 4Gb DDR3 DRAM chip from Samsung is presented as having the highest density available. The chip can be produced in 16-GB registered DIMMs for servers, as well as 8-GB unbuffered DIMM, and 8-GB small outline DIMM.


You may login with either your assigned username or your e-mail address.
The password field is case sensitive.