Electronic Component News

Product Releases

Subscribe to ECN Magazine Product Releases
View Sample

FREE Email Newsletter

ECN Daily

Single-chip Bluetooth IC with Reduced Power Consumption and Toll-quality Voice

September 26, 2007 8:06 am | Comments

CSR launched its sixth generation of BlueCore silicon for Bluetooth. BlueCore6 includes both full support for the latest version of the Bluetooth specification (v2.1+EDR) plus the company’s AuriStream technology, which provides toll quality voice calls and is capable of a 40 percent reduction in power consumption in BlueCore6-ROM as compared with standard Bluetooth voice transmission methods, according to the company. The IC provides BlueCore6 Class 1 Bluetooth range

Quad-SPI Serial Flash Memory

September 26, 2007 8:00 am | Comments

Winbond Electronics announced what is said to be the industry’s first Serial Flash memory with Quad-SPI (Serial Peripheral Interface). The W25Q16 16-megabit SpiFlash® Memory is the first in a family of high-performance memories ranging from 8 to 64 megabits, and features single, dual and quad I/Os in 8-pin packaging. According to the company, the W25Q16’s Quad-SPI architecture allows for greater than six times the performance of the current generation of Serial Flash memories and offers a true code-execution (XIP) alternative to Parallel-NOR Flash.

Custom Shaped Flat Cables Provide Space Efficiency

September 26, 2007 7:40 am | Comments

Cicoil announces its custom shaped flat silicone cables that allow for precise cable routing without folding, kinking or pinching. The custom shapes also contribute to the elimination of signal failures due to physical stress at the cable connector. Stressing miniaturization and space efficiency, this cable has applications in medical diagnostic equipment, motion control robotics, marine electronics and the automotive industry.

Advertisement

Nanostructured Thin Film Harvests and converts Waste Heat into Electricity

September 26, 2007 7:39 am | Comments

Nextreme developed a miniature, thin film thermoelectric generator (TEG) that converts heat directly into electricity. Ideal for waste heat conversion applications, the solid state TEG delivers power generation densities (>3W/cm2) in excess of those achieved using bulk materials and is optimized to provide power in a form factor that can be as much as 20x thinner than bulk material alternatives, according to the company. Manufactured using semiconductor fabrication techniques, the TEG is scalable, cost-effective, and can be utilized in a broad range of markets and applications

Low Profile Modular Jack Components

September 26, 2007 7:29 am | Comments

ERNI Electronics announces its line of modular jack components to include low profile versions with integrated magnetic filters. These compact network connectors for heavy-duty applications are resistant to electromagnetic faults, and they are designated for use in compact RJ45 applications compliant with 10/100 or 10/100/1000 Base-T (gigabit) Ethernet.

Serial Analyzers for PCIe 2.0 Provide Power Management and Cross Bus Analysis

September 26, 2007 7:06 am | Tektronix | Comments

Tektronix announced new TLA7S16 and TLA7S08 Serial Analyzers for test and validation of PCI Express (PCIe) 1.0 and 2.0 designs. The devices provide detailed PCIe 2.0 protocol information along with cross-bus analysis. The new analyzers plug into the company’s TLA7000 Series logic analyzers, adding the ability to debug and correlate general purpose signals and other system interconnects including memory and computer processors.

Protective Caps Seal Threaded Connectors

September 26, 2007 6:41 am | Comments

Binder-USA announces it’s M8 protective caps that ensure a protection rating of IP67 when applied to unmated connectors. These caps are suitable for use in factory automation and process control applications. They feature a PA (polyamide) body, PUR (polyurethane) retaining strap and a nitrile rubber (NBR) seal.

Cordsets and Receptacles for Factory Automation Equipment

September 26, 2007 6:30 am | Comments

Turck, Inc. announces its 26 and 28-pin molded M27 multifast connectors that can be used to provide power and signals to factory automation equipment in the automotive, semiconductor and material handling industries. They are replacements for D-Sub (DB-25) style connectors in industrial settings where DB-25 connectors are limited to 30V and low current.

Advertisement

Miniature Aluminium Enclosures Offer Desirable EMC Protection

September 26, 2007 6:09 am | Comments

TEKO launched its MINITEKAL range of miniature aluminium enclosures. These versatile and robust housings have been designed for easy assembly of the electronics. The all-aluminium design allows good levels of EMC protection to be implemented. Typical applications will include small hand-held measurement devices, low power Radio equipment, power supplies, peripherals, monitoring systems and detection devices.

Integrated Programmable Connectivity Platform Targets Mobile Devices

September 26, 2007 5:58 am | Comments

QuickLogic announced an integrated programmable connectivity solution platform targeting mobile devices. The revolutionary ArcticLink platform embeds high performance controllers, a programmable fabric for implementing additional controllers and peripheral connectivity, as well as a selectable processor interface in a single, small form factor low power device.

Closed-loop Fan Controllers and High-end Temperature Sensors

September 26, 2007 5:53 am | Comments

SMSC announced the introduction of its new family of fan controllers, the EMC210x family, with four new devices (EMC2103, EMC2104, EMC2105 and EMC2106) featuring technologies that employ RPM closed-loop control and manage multiple temperatures. In addition, SMSC is launching three new SMBus temperature sensors (EMC1046, EMC1047 and EMC1428) for systems requiring a high level of temperature monitoring.

Pressure Transducers Provide a Full Scale Accuracy of 0.25 Percent

September 26, 2007 5:05 am | Comments

Gems Sensors & Controls introduced the 3100 Series Pressure Transducers which provide a full scale accuracy of 0.25 percent. Long term drift is limited to 0.1 percent over the full scale per year. This performance and stability is achieved using sputtered thin film sensing technology, and has less than 1" in diameter, weighing 32g

Flagship MCU Family with Enhanced Performance, Lower Cost

September 25, 2007 12:15 pm | Stmicroelectronics | Comments

STMicroelectronics released a new version of its 32-bit ARM9-based STR910F flash microcontrollers. Through technology enhancements, the new STR910FA delivers 25 percent greater system performance at a more competitive price, compared to the previous STR910F devices. The STR910F microcontroller Series with Ethernet, USB and CAN interfaces plus desirable on-chip SRAM and Flash memory, has received a performance enhancement.

Advertisement

Low-power Zero Crossover Op Amp for Battery Powered Portable

September 25, 2007 12:10 pm | Comments

Texas Instruments introduced a low power zero-crossover operational amplifier (op amp). Featuring a unique single-input-stage architecture, the OPA369 achieves rail-to-rail performance without input crossover to solve the common design problem of input offset distortion due to the change in common mode voltage that is very prominent in low-voltage, rail-to-rail applications.

Three-channel, Constant-Current LED Driver

September 25, 2007 12:01 pm | Comments

Allegro MicroSystems introduced a new three-channel constant-current LED driver with on-chip oscillator for simple programmable brightness control. It is typically used to drive a cluster of red/green/blue (RGB) LEDs for one pixel in a large display or a lighting fixture. It precisely controls LED brightness via 10-bit pulse-width modulation (PWM) per channel, complemented by seven-bit analog current control per channel to adjust color balance.

Pages

X
You may login with either your assigned username or your e-mail address.
The password field is case sensitive.
Loading