Advanced Power Solutions announces an extension of it’s APS63VI series to include triple output models. This family of 2" × 4" open-frame power offer a low profile of only 0.92”. The supply features Class B Emissions and worldwide safety approvals including UL/cUL60950-1 / EN60950-1 and bear the CE Mark (LVD). These power supplies offer efficiencies of up to 80 to 89.5 percent typical and an operating temperature of
Minmax's MSKW2000-Series 5W DC/DC converters are housed in a "gull-wing" SMT package and meet 245°C/10sec in solder-reflow for lead free process. The series consists of 21 models that operate over input voltage ranges of 9V DC to 18V DC, 18V DC to 36V DC and 36V DC to 75V DC which provide precisely regulated output voltages of 3.3V, 5V, 12V, 15V, ±5V, ±12V and ±15V DC. The -40°C to +71°C operating temperature range makes it suitable for data communication equipments
Aitech Defense Systems, Inc. announced an environmentally sealed, 2-slot 3U CompactPCI enclosure that provides desirable flexibility and performance. In addition to its rugged environmental properties, the compact and lightweight E192 incorporates a modular and removable power supply, making the enclosure suitable for harsh mechanical, climactic, chemical and electrical stresses typically encountered in rigorous embedded applications.
Tyco Electronics Corp. introduces its miniature Micro-USB connector cthat enables portable device makers to miniaturize real estate in devices such as mobile phones, MP3 players, GPS navigation systems, digital cameras and digital video cameras. This connector meets the USB Implementers Forum specification which supports the current USB On-The-Go supplement, allowing communication between portable devices without going through a host.
OKW Enclosures introduces its VERSAMET 19" rack cases which conform to the DIN and IEC standards for 19" equipment. They are suitable for rack mounted and desktop equipment. Typical applications include test and measurement devices, audio and video systems, and networking and communications equipment. These aluminum enclosures are supplied fully assembled, with a standard 19" anodized aluminum front panel, folded top cover, base panel and a removable rear panel.
Binder-USA announces the addition of stainless steel M12 threaded sockets to its 763 series to provide a complete range of stainless steel connectors that are suitable for use in applications requiring a robust sealed and EMI-protected connection such as those in food processing and pharmaceutical manufacturing. Featuring a precision machined stainless steel body, these connectors are available in male and female versions.
Omega Engineering, Inc. announces its wireless thermocouple connector series that features stand-alone, compact, battery powered thermocouple connectors that transmit linearized, cold junction compensated measurements back to a USB powered receiver connected to a PC. Each wireless connector unit can be programmed in the field to work as a type J, K, T, E, R, S, B, N or C calibration connector.
Elma Bustronic Corp. announced its MicroTCA backplane in the cube style format that features six AdvancedMC, one MicroTCA carrier hub and one power module slot. This backplane has a Star topology, and it fits in a 4U wide cube-style MicroTCA portable enclosure. The backplane also features a JSM (J-Tag switch module) slot, and it has connections at the bottom for a cooling unit and at the top for temperature sensors.
ITT Electronic Components introduces its VEAM VSC Series threaded coupling, 19-pin, cylindrical connector for entertainment lighting applications. The connectors are sealed to IP 67 when mated, have a black, hard anodized, non-conductive finish for scratch and wear resistance, and they feature a heavy-duty, ribbed coupling nut to provide easy mating and un-mating. They are rated to 700V DC and 500V AC.
Turck added the DeviceNet Drive Interface station to its line of DeviceNet I/O stations. The station is designed for use where adjustable frequency drives need to be interfaced onto a DeviceNet network, and it is capable of supporting up to four stand-alone adjustable frequency drives on the network. The station’s small size makes it appropriate for upgrading existing adjustable frequency drives in the automotive, pharmaceutical, chemical and material handling industries.The housing is constructed of glass-filled nylon that provides an IP 20 protection rating.
CSR launched its sixth generation of BlueCore silicon for Bluetooth. BlueCore6 includes both full support for the latest version of the Bluetooth specification (v2.1+EDR) plus the company’s AuriStream technology, which provides toll quality voice calls and is capable of a 40 percent reduction in power consumption in BlueCore6-ROM as compared with standard Bluetooth voice transmission methods, according to the company. The IC provides BlueCore6 Class 1 Bluetooth range
Winbond Electronics announced what is said to be the industry’s first Serial Flash memory with Quad-SPI (Serial Peripheral Interface). The W25Q16 16-megabit SpiFlash® Memory is the first in a family of high-performance memories ranging from 8 to 64 megabits, and features single, dual and quad I/Os in 8-pin packaging. According to the company, the W25Q16’s Quad-SPI architecture allows for greater than six times the performance of the current generation of Serial Flash memories and offers a true code-execution (XIP) alternative to Parallel-NOR Flash.
Cicoil announces its custom shaped flat silicone cables that allow for precise cable routing without folding, kinking or pinching. The custom shapes also contribute to the elimination of signal failures due to physical stress at the cable connector. Stressing miniaturization and space efficiency, this cable has applications in medical diagnostic equipment, motion control robotics, marine electronics and the automotive industry.
Nextreme developed a miniature, thin film thermoelectric generator (TEG) that converts heat directly into electricity. Ideal for waste heat conversion applications, the solid state TEG delivers power generation densities (>3W/cm2) in excess of those achieved using bulk materials and is optimized to provide power in a form factor that can be as much as 20x thinner than bulk material alternatives, according to the company. Manufactured using semiconductor fabrication techniques, the TEG is scalable, cost-effective, and can be utilized in a broad range of markets and applications
ERNI Electronics announces its line of modular jack components to include low profile versions with integrated magnetic filters. These compact network connectors for heavy-duty applications are resistant to electromagnetic faults, and they are designated for use in compact RJ45 applications compliant with 10/100 or 10/100/1000 Base-T (gigabit) Ethernet.