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Flip-chip underfill solution features a high Tg of >240°C

Thu, 08/14/2014 - 4:36pm

AI Technology (Princeton Junction, NJ) material scientists have developed a series of new generation underfills that withstand RoHS compliant higher temperature processing and applications. The main advanced features and functions are listed below along with the table of characteristics:

  • Much lower moisture absorption and sensitivity than traditional epoxy underfills.
  • Lower and faster curing at relatively low temperatures of 150°C.
  • Higher Tg and modulus to enhance stress reduction.
  • Lower ionic impurities for even higher device reliability.

For more information on the underfills, visit www.aitechnology.com.

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