Flip-chip underfill solution features a high Tg of >240°C
AI Technology (Princeton Junction, NJ) material scientists have developed a series of new generation underfills that withstand RoHS compliant higher temperature processing and applications. The main advanced features and functions are listed below along with the table of characteristics:
- Much lower moisture absorption and sensitivity than traditional epoxy underfills.
- Lower and faster curing at relatively low temperatures of 150°C.
- Higher Tg and modulus to enhance stress reduction.
- Lower ionic impurities for even higher device reliability.
For more information on the underfills, visit www.aitechnology.com.