LED COB arrays designed for high density, high-light output applications
Molex Incorporated (Lisle, IL) announces its Plastic Substrate Interconnect (PSI) for LED Chip-on-Board (COB) Arrays. These customizable interconnects feature a low-profile harness interface that delivers power to the array through a simple and reliable connection to a holder, or plastic substrate.
• Low overall package height of ~2.00mm
• A slim design for space-limited applications while minimizing substrate cost
• Integrates the electrical and mechanical features with the array for a simple, solderless connection.
• Ideal for high-density and high-light output applications
• Customizable shapes, sizes, mounting hole patterns and interconnects
For more information, visit www.molex.com