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LED COB arrays designed for high density, high-light output applications

Wed, 06/04/2014 - 2:46pm

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Molex Incorporated (Lisle, IL) announces its Plastic Substrate Interconnect (PSI) for LED Chip-on-Board (COB) Arrays. These customizable interconnects feature a low-profile harness interface that delivers power to the array through a simple and reliable connection to a holder, or plastic substrate. 

Features include:
•    Low overall package height of ~2.00mm
•    A slim design for space-limited applications while minimizing substrate cost
•    Integrates the electrical and mechanical features with the array for a simple, solderless connection.
•    Ideal for high-density and high-light output applications
•    Customizable shapes, sizes, mounting hole patterns and interconnects 

For more information, visit www.molex.com

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