Product Releases

Overmolded backshells on connector interfaces offer improved reliability

Mon, 02/24/2014 - 4:17pm


API Technologies Corp. (Orlando, FL) now offers overmolded backshells on connector interfaces from its Electromagnetic Integrated Solutions (EIS) product line, the leader in EMI/RFI components and interconnects. Ideal for use in military, aerospace, high-end industrial, oil and gas, as well as medical applications, these durable, waterproof and weather resistant backshells offer improved reliability and a simplified specification process. There is no hard tooling required for MIL-DTL-38999 or many other standard connector interfaces and minimal tooling charges for custom configurations. Features include:

• Molding material which electromagnetically shields the cable.
• Backshell design which encapsulates all internal wiring as well as the shield and jacket, ensuring waterproof termination.
• Cost reduction of approximately 50% compared to standard metal backshells.

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