Overmolded backshells on connector interfaces offer improved reliability
API Technologies Corp. (Orlando, FL) now offers overmolded backshells on connector interfaces from its Electromagnetic Integrated Solutions (EIS) product line, the leader in EMI/RFI components and interconnects. Ideal for use in military, aerospace, high-end industrial, oil and gas, as well as medical applications, these durable, waterproof and weather resistant backshells offer improved reliability and a simplified specification process. There is no hard tooling required for MIL-DTL-38999 or many other standard connector interfaces and minimal tooling charges for custom configurations. Features include:
• Molding material which electromagnetically shields the cable.
• Backshell design which encapsulates all internal wiring as well as the shield and jacket, ensuring waterproof termination.
• Cost reduction of approximately 50% compared to standard metal backshells.
For more information, visit www.apitech.com.