RF front end module designed for Wi-Fi and Bluetooth connectivity
Microchip Technology announced its latest 2.4 GHz, 50 ohm Matched RF WLAN Front End Module (FEM)—the SST12LF09—for Bluetooth connectivity, as well as 802.11b/g/n and 256-QAM Wi-Fi applications. The SST12LF09 integrates a transmitter power amplifier, a receiver low-noise amplifier, and a low-loss, single-pole three-throw antenna switch for Bluetooth connectivity into one compact 2.5x2.5x0.4 mm, 16-pin QFN package, making it ideal for high-data-rate wireless applications. With its high linear output power of up to 15 and 17 dBm for 1.8% dynamic EVM at 3.3V and 5V, respectively—along with 17 and 18.5 dBm linear power for 3% EVM at 3.3V and 5V, respectively—this FEM significantly extends the range of IEEE 802.11b/g/n WLAN systems while providing excellent transmit power at the maximum 256-QAM data rate. The receiver has a 12 dB gain and a greater than -6 dBm input (1 dB) compression level. In the LNA bypass mode, the receiver has a 9 dB loss and an 8 dBm input compression level.
Attaining the maximum data rate, longest range and highest integration in a small package is essential to the designers of mobile devices, multi-channel access point/routers and set-top boxes. Developers can take advantage of the SST12LF09’s small package size and extra output power at 5V bias to reduce the board size and complexity of their designs while boosting their products’ output power. This FEM also features 50 ohm on-chip input and output match, which is easy to use and shortens time to market.
Evaluation boards for the new SST12LF09 front-end module are available through Microchip’s sales representatives.
Pricing & availability
The SST12LF09 is available today for sampling and volume production, in a 2.5x2.5x0.4 mm, 16-pin QFN package. Pricing is $0.60 each, in 10,000-unit quantities.
For additional information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip’s Web site at http://www.microchip.com/get/95TE.