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MOSFET power modules allow designers to shrink system size

Fri, 09/27/2013 - 9:20am

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Richardson RFPD, Inc. today announces availability and full design support capabilities for eleven new low-loss, high-density silicon carbide (SiC) MOSFET power modules from Microsemi Corporation (Microsemi).

The new modules feature high-speed switching, low switching losses, low input capacitance, low drive requirements, minimum parasitic inductance, increased reliability, and low profiles—allowing designers to shrink system size and weight, while reducing overall system costs.

The extended temperature ranges of the new devices meet next-generation power conversion system requirements for higher power densities, operating frequencies and efficiencies. The new modules are ideally suited for a range of high power, high voltage industrial applications requiring high performance and reliability, including high power switch mode power supplies, motor drives, uninterruptible power supplies, solar inverters, and oil exploration.

Key features of the new modules include:

The devices are in stock and available for immediate delivery. To find more information, or to purchase these products today on the Richardson RFPD website, please visit the Microsemi SiC MOSFET Power Modules webpage.

More information is available online at www.richardsonrfpd.com.

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