Modular connector series addresses the rugged environmental requirements of the defense and commercial aviation markets
Smiths Connectors announced the rollout of its IDI Dovetail modular connector series. Dovetail, the latest entry in the company’s wide array of interconnect products, is a new and innovative interconnect solution that has been developed to address the rugged environmental requirements of the defense and commercial aviation markets, as well as demanding industrial electronics applications. The high-grade spring probes that are embodied in the Dovetail ensures excellent performance in environments that feature shock, vibration and extreme temperatures.
The product has been designed for inside-the-box applications and will, in most cases, be used between two printed circuit boards within a sealed housing. The Dovetail connector features and benefits include the proven performance of the IDI C Series industry-leading spring probe range, a compact modular housing, very light weight, blind mating, instant prototyping, and unique flexibility and adaptability that affords users the opportunity to design exactly the configurations that they desire into their particular products. In addition, IDI’s expertise in spring probe technology plays a key role in making it possible for Dovetail connectors to be used to rapidly prototype cabled blind mate connectors which should have a positive impact across the traditional prototype lead-times arena.
Cost-effectiveness is another tangible benefit to customers that is associated with Dovetail’s configurable nature. Traditional COTS products in predefined formats have not always proven to be conducive in addressing unique combinations or mixed signal capabilities within the confines of an individual connector. It is a dilemma that often finds customers wrestling with the costly and time-consuming alternative of custom designing solutions. The individual probe blocks in the Dovetail solution now make it possible for customers to build exactly what they need in a single day and bypass the problematic issues of tooling and long lead-times.