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40-nm MCUs target HEV/EV motor control applications

August 28, 2014 9:03 am | Renesas Technology America, Inc. | Comments

Renesas Electronics Corporation (Santa Clara, CA) announced the new RH850/C1x Series of 32-bit microcontrollers (MCUs), designed for motor control in hybrid electric vehicles (HEVs) and electric vehicles (EVs). Based on the…

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Chassis and modules are compliant to MicroTCA.1 spec for air-cooled rugged applications

August 28, 2014 8:58 am | Vadatech, Inc. | Comments

VadaTech (Henderson, NV) offers chassis and modules that are compliant to the MicroTCA.1 specification for air-cooled rugged applications. The MicroTCA.1 specification uses ...

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Crimp style, wire-to-board, subminiature connector targets LED applications

August 27, 2014 4:49 pm | Jst Corporation | Comments

The new LEN Series wire-to-board, crimp style, disconnectable connectors recently introduced by JST Corporation (Waukegan, Il) offer subminiature size, design flexibility, and reliable contact construction for high density LED light applications.

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Multi-band PIM analyzers include s-parameter capability

August 27, 2014 10:37 am | Comments

AWT Global has launched a new product line of passive intermodulation (PIM) analyzers for manufacturing, R&D and QA: PEM42A Series. These new PIM analyzers can handle up to four frequency bands in the range of 385 MHz to 2600 MHz.

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Wireless charging and NFC reference design is automotive ready

August 27, 2014 10:12 am | Melexis, Freescale Semiconductor | Comments

Combining the automotive grade NFC (Near Field Communication) transceiver of Melexis with Freescale Semiconductor’s wireless charging technology enables a ready to use reference design solution that is positioned to free drivers from the dreaded low battery warning.

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3D TSV Technology-based DDR4 modules support enterprise servers

August 27, 2014 9:47 am | Samsung | Comments

Samsung Electronics, Ltd. (Seoul, Korea) has started mass producing what are believed to be the industry’s first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use …

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MCUs bring 16-bit ADC precision performance to industrial control applications

August 26, 2014 4:19 pm | Texas Instruments | Comments

Texas Instruments (Dallas, TX) introduced its new C2000 Delfino 32-bit F2837xS microcontrollers (MCUs). These single-core MCUs are believed to be the first in the industry to offer four 16-bit analog-to-digital converters (ADCs), enabling …

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Wireless sensor transmits pressure/temperature over Bluetooth

August 26, 2014 12:07 pm | Transducers Direct | Comments

The new TDWLB pressure/temperature sensor designed by Transducers Direct (Cincinnati, OH) is said to be the industry's first to be powered with a coin-cell battery, controlled with a smartphone app, and certified as Bluetooth Smart.

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6000-W electronic load offers 1000-V high voltage capability

August 26, 2014 11:03 am | Intepro Systems | Comments

Intepro Systems (Berkshire, UK) introduced a high voltage EL9718E-M1 1000-V 6-kw electronic load. The EL9718E-M1 electronic load has been developed specifically to meet high voltage applications and offers …

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Copper piezo actuators feature long operating life

August 26, 2014 9:57 am | TDK Corporation of America | Comments

TDK Corporation announced the third generation of EPCOS piezo actuators with copper internal electrodes, which offer both improved performance and higher cost-effectiveness, according to the company. These actuators can …

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15-W GaN on SiC pulsed power transistor delivers 63 percent drain efficiency

August 26, 2014 9:36 am | Comments

M/A-COM Technology Solutions Inc. (Lowell, MA) announced a new GaN on SiC HEMT pulsed power transistor for civilian and military radar pulsed applications. The MAGX-000035-015000 and MAGX-000035-01500S are gold-metalized GaN on Silicon Carbide RF power transistors optimized for ...

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10.1” multi-touch panel includes COF tail and w/o cover lenses

August 26, 2014 8:52 am | Microtips Technology | Comments

Microtips Technology announces their new 10.1” PCAP display. The 10.1” PCAP is based on F/F/G structure (film/film/Glass), or the ability of using one film layer for the X axis and then another film for the Y axis. The design cover lens is then placed on top of the LCD....

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Class-D audio amplifier designed for eCall, instrument cluster and telematics

August 25, 2014 4:14 pm | Texas Instruments | Comments

Texas Instruments (Dallas, TX) introduced the industry’s first automotive Class-D audio amplifier to integrate load-dump protection and diagnostics in a single device for emergency call (eCall) and instrument cluster systems. Designers can eliminate multiple discrete components....

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Hot swap controller protects batteries from voltage & current faults

August 25, 2014 4:06 pm | Linear Technology Corporation | Comments

Linear Technology Corporation introduces the LTC4231, an ultralow quiescent current (IQ) Hot Swap controller, enabling safe board or battery insertion and extraction from 2.7V to 36V systems. The LTC4231 controls an external N-channel MOSFET to gently power up board capacitors....

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Weld-free, rugged cabinet features longer structural integrity

August 25, 2014 3:49 pm | Elma Electronic Inc. | Comments

Optima Stantron, an Elma company, has developed a weld-free, rugged cabinet for electronics that offers increased structural integrity to withstand a variety of demanding, extreme environments. The new, modular MB-Series is a set of flexible, customer tailored cabinets....

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