Thermal interface material designed to transfer heat to heat sink
Fujipoly announces the availability of Sarcon 50GR-Ae, an extremely soft .5mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink. The unique physical properties of this material allow it to protect delicate board-level components as it fills unwanted air gaps and levels uneven surfaces.
This high-performance silicone based compound delivers a thermal conductivity of 1.3 W/m°K with a thermal resistance of only .63 °Cin2/W. Sarcon GR-Ae is available in pre-cut sheets up to 200 mm x 300 mm or die-cut to your exact application specifications.
Fujipoly America Corporation