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Thermal interface material designed to transfer heat to heat sink

Tue, 01/29/2013 - 4:13pm

Fujipoly announces the availability of Sarcon 50GR-Ae, an extremely soft .5mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink. The unique physical properties of this material allow it to protect delicate board-level components as it fills unwanted air gaps and levels uneven surfaces.

This high-performance silicone based compound delivers a thermal conductivity of 1.3 W/m°K with a thermal resistance of only .63 °Cin2/W.  Sarcon GR-Ae is available in pre-cut sheets up to 200 mm x 300 mm or die-cut to your exact application specifications. 

Fujipoly America Corporation
(732) 969-0100
http://www.fujipoly.com.

 

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