Mill-Max introduces its family of SPDIP mating pin headers to compliment its line of SPDIP sockets. SPDIP (shrink plastic) packaging reduces device lead spacing between pins down to .070" pitch (1.778 mm) which is useful in memory, microcontrollers, video controllers and automotive design applications.
Texas Instruments introduced miniature 2.25 MHz, step-down DC/DC converters, which support low-power DSPs and microcontroller-based portable electronics. Said to extend battery life in Bluetooth headsets, cell phones and other Li-Ion battery-powered applications, the converters also save board space. These 300 mA, 600 mA and 1A synchronous, step-down DC/DC converters can efficiently regulate output voltages down to 0.6V with ±1.5 percent accuracy.
Xilinx added power efficient Spartan-3A DSP devices to its XtremeDSP portfolio for signal processing applications. The devices offer DSP capabilities in a low-power FPGA for applications such as tactical radios for military communications, wireless access points and portable medical equipment. The Spartan-3A DSP low power (LP) devices are said to deliver a 50 percent static power savings, and a 70 percent savings while in suspend mode, compared to the standard devices, and they are available in industrial rated grades.
Endicott Interconnect Technologies’ HyperBGA PTFE-based coreless semiconductor package enables silicon devices to run at high speeds. The combination of the low loss, low dielectric constant material and strip line cross sections enables signal speeds surpassing 12 Gb/s. The material compliance of the PTFE, combined with the dimensional stability of a copper-invar-copper center plane
Phoenix Contact releases its QC (Quick Connect) 1.5 plugs, an insulation displacement connection (IDC)-based plug for use in an expanded range of wire gauges. They offer flexibility in wire selections (24 AWG to 16 AWG), they are designed on a 5 mm pitch (centerline) spacing and they come with or without mounting flanges. The plugs mate with proprietary 5 mm headers, enabling vertical, horizontal or lengthwise PCB mounting for wider range flexibility.
Kinetic Systems introduces high-performance breadboards that provide a flat, stable surface for a variety of applications that include mounting or assembling lasers, small optical systems, prototyping and precise inspections. Available in four standard configurations, these breadboards feature high natural frequency, nominal broadband damping, and flatness of ±0.004" over a 24" × 24" area.
Elmo Motion Control introduced three miniature servo drives that support up to 2,400W. The new Whistle servo drives achieve high power density coupled with SimplIQ intelligence and are available in the following additional models: WHI-15/60 (15A, 60VDC), WHI-10/100 (10A, 100V), WHI-15/100 (15A, 100V). By integrating the company’s FASST (Fast And Soft Switching Technology) power management technology with thermal management technology, the miniature Whistle exhibits a power density of 35 W/cm3.
Laird Technologies announces that 31 fingerstock standard products made from Recyclable Clean Copper (RCC) that offer similar performance characteristics to beryllium copper (BeCu) products, and they will work in 80 percent of all applications where BeCu is now used. RCC products do not contain beryllium, giving customers who want to avoid the use of beryllium containing metals a choice in alloy selections
Haydon Switch & Instrument, Inc. announces its size 11 hybrid linear actuators with an integrated connector. Offered alone or with a harness assembly, this connector is RoHS compliant and features a positive latch in order for high connection integrity. The connector is rated up to 3A and the mating connector will handle a range of wire gauges from 22 to 28.
Texas Instruments Incorporated introduced what is said to be the industry’s lowest power zero-crossover operational amplifier (op amp). Featuring a unique single-input-stage architecture, the OPA369 achieves rail-to-rail performance without input crossover to solve the common design problem of input offset distortion due to the change in common mode voltage that is very prominent in low-voltage, rail-to-rail applications. Combined with 1µA quiescent current, SC70 package and operation down to
Anderson Power Products offers its multi-axial rotational connector (MARC). Suitable for medical and mobility applications, the MARC is designed to mate while traveling through an arc with a 3" minimum radius. It is rated to 30 while combining power, signal and ground circuitry into one package. Featuring eight Powerpole circuits integrated into a blind mate housing, the two-row horizontally oriented connector uses proprietary flat wiping contacts.
FCI extended its Gig-Array high-speed, high-density product line with 25 mm plug connectors. These mezzanine connectors provide either 200 or 296 signal contacts, and they add the capability for 40 mm stack height when used with the company’s existing 15 mm receptacles. The 25 mm plug connectors can also be paired with 5 mm receptacle connectors to provide an additional option to achieve 30 mm board-to-board spacing.
Molex, Inc. introduced its Pico-Clasp single and dual row wire-board connectors. This family of products offers space savings in applications such as plasma display panel (PDP) TVs, liquid crystal display (LCD) TVs and notebook PCs. This .039" pitch connector system is compact, making it suitable for any compact FPD system. Versions with an inner positive lock provide latch protection and secure mating confirmation. Positive lock versions are available in six to 50 circuits
PEM introduces its R’Angle self-clinching fasteners that create permanent right-angle attachment points in metal sheets as thin as .040/1 mm. These aluminum self-tapping or steel threaded fasteners can serve as alternatives to bent tabs at edges of sheets, bent tabs in the middle of sheets, bent flanges, right-angle brackets, tack welds and loose hardware.
RAF Electronic Hardware introduces its male-female stacking spacers that come in round and hexagonal profiles. Manufactured for PC/104 and PC/104-plus embedded applications, they are available in nylon and aluminum. By using these stacking spacers, circuit boards are spaced exactly 0.6" apart to build structurally secure module stacks. The standalone stacks can be used like compact bus boards, but without the need for backplanes or bird cages.