Infineon Technologies AG introduced a family of integrated intelligent power modules that contain nearly all of the semiconductor components required to drive electronically controlled variable-speed electric motors. The CiPoS (Control Integrated Power System) modules are designed to enable energy-efficient operation of consumer appliances such as washing machines and air conditioners, offering efficiencies of up to 94 percent.
MicroStrain announced that its energy harvesting wireless strain sensing modules have been released for sale. The company asserts its sensing systems will operate indefinitely -- without the need for batteries -- by converting the component’s cyclic strains into DC power using piezoelectric materials. The miniaturized energy harvesting sensing nodes, called ESG-LINK, feature a precision time keeper, non-volatile memory for on-board data logging and frequency agile IEEE 802.15.4 transceiver.
The XSR Series Wire-to-Board connector from JST Corp. is said to be the world’s smallest 0.6 mm pitch insulation displacement (ID) connector for discrete wires. This connector has a mounting height of 1.45 mm and a depth of 3 mm. The twin U-slot along with a new design approach for wire strain relief ensures a reliable contact/connector system. It features a secure locking design between the socket housing and PCB assembly
Development Platform and Production-ready Module Enable Key Deterministic Industrial Standards in COM ExpressJuly 30, 2007 11:43 am | Comments
Freescale is introducing an all-in-one networking platform for industrial markets featuring Power Architecture technology and delivered in the COM Express form factor. The platform’s MPC8360E PowerQUICC II Pro processor is said to meet or exceed the performance of ASICs and FPGAs and support control and communications processing tasks on a single device. It also integrates QUICC Engine communications controller technology for desirable programmability and the ability to support evolving
Digi International introduced the ConnectPort X line of gateways that provide seamless connectivity of ZigBee, Wi-Fi, cellular and Ethernet traffic to centralized applications and databases. They also support GPS and 1 GB of local storage. The product family is augmented by new families of XBee adapters and wall routers that provide end-device connectivity and network extension. “Drop-in Networking” devices provide end-to-end wireless connectivity to commercial grade electronic devices in locations where wired infrastructure doesn’t exist or satisfy customer needs.
Agilent Technologies Inc. introduced what is said to be the industry's only dual-purpose SAN tester and protocol analyzer for 8 Gb/s Fibre Channel (FC). Combining realistic network stimulus of the SAN tester application with sophisticated protocol analysis and troubleshooting capabilities allows engineers to speed up the design and development of next-generation storage devices. The module helps storage equipment manufactures conduct realistic tests on their device under test (DUT) early in the development and qualification cycle
NTE Electronics, Inc. announced additions to its line of resistors. Round Silicone wirewound ceramic resistors in 1W, 3W, 5W, and 10W Versions feature a high temperature silicone coating with complete welded construction, and provide stability in operation and exhibit a high power to size ratio. Fixed vitreous wirewound types in
National Semiconductor Corporation introduced what is said to be the industry’s highest-precision programmable gain amplifier (PGA). The LMP8100A delivers guaranteed 0.03 percent gain accuracy using a software adjustable gain (in 1V/V increments) from 1V/V to 16V/V over the full industrial temperature range of -40°C to 125°C. The company also offers the LMP8100 semi-precision grade PGA, which provides guaranteed 0.075 percent gain accuracy over the -40°C to
Asis North America announced its Effective Series AdvancedTCA chassis, available in AC or DC versions and two-, five- and 14-slot configurations. Effective Series 2 and 5-slot versions are available with removable top cover making them an ideal development platform. Its cooling system implements a pressurized-only cooling method and uses the latest fan and airflow technologies. The system has been verified to meet more than the 200W per slot requirement, while
Catalyst Semiconductor introduced a buck converter in a TSOT-23 package for driving high-brightness, 350 mA LEDs at up 94 percent efficiency. The CAT4201 incorporates the company's patent-pending switching control algorithm. This new architecture is said to reduce system complexity, improve efficiency and allow an external RSET control resistor to preset a regulated LED current up to 350 mA from supplies as high as 24V for inductor control and to eliminate the need for a dedicated heat sink.
Linear Technology's LTM4600HVMPV is a complete and encapsulated 10A switching DC/DC regulator system and the first device in a new family of uModule (micromodule) DC/DC regulators for rugged military and avionics applications. The device is fully tested over the temperature range of -55°C to 125°C, and it is offered in a 15 mm x 15 mm x 2.8 mm Military Plastic LGA (Land Grid Array) package. Comprised entirely of Linear Technology silicon and supported by the company's in-house testing, the LTM4600HVMPV is
Pepperl+Fuchs added the WCS3B Read Head to its PosiTrack™ Position Tracking System. Designed to provide simplified installation and improved operational performance, this read head provides a 32 mm slot width, compared with the 25mm slot width available from the existing WCS3A model. The result is increased reader/code rail misalignment tolerances of 20 percent on the horizontal axis and 40 percent on vertical axis. Increased read head slot width allows for a
Agilent Technologies introduced the first time-to-digital converter (TDC) from its Acqiris product line, featuring six independent stopwatches for precise timing measurements from a common start event to multiple stop events at a high resolution. The TC890 is appropriate for time measurement applications, including laser detection and ranging (LIDAR) for 3D mapping and navigation, fluorescence lifetime spectrometry, and ion counting in time-of-flight mass spectrometry (TOFMS). Many pulse-timing measurements, such as period, frequency and time interval analysis (TIA), are suitable for the TDC's precise measurement technology.
VIA Technologies announced the VIA EPIA NR Nano-ITX mainboard, powered by a fanless 1.0 GHz VIA C7 processor and VIA CX700 system media processor for compact, quiet and durable embedded systems. Measuring 12 cm x 12 cm, it is said to be the first Nano-ITX mainboard to natively support LVDS in two single or one dual-channel monitor configuration without the need for a daughterboard; this makes it appropriate for
Tundra Semiconductor introduced its Tsi352 PCI-to-PCI Bridge, fully compliant with PCI Local Bus Specification, Revision 2.3. The bridge makes it possible to extend a system’s load capability limit beyond that of a single PCI bus by allowing motherboard designers to add more PCI devices or more PCI option card slots than a single PCI bus can support. The device has two identical PCI Interfaces that handle PCI transactions for its respective bus. This traffic isolation can