Provided in a 21 × 21 mm 449-pin BGA package, Renesas’ SH-NaviJ SH77722 is designed for use in compact portable navigation systems and low-end through mid-range dashboard-mounted car navigation and infotainment systems.
TDK Corporation has announced that it has developed soft termination MLCC capacitors that offer improved thermal and mechanical robustness. To address reliability issues with the C1005 (CC0402) through C3225 (CC1210) case sizes, TDK has developed a four-layer termination structure that exhibits
New Scale Technologies announced 0.5 µm resolution and additional packaging options for its miniature Tracker position sensor. This robust non-contact sensor is suited for optical imaging stabilization and zoom in digital cameras, phone cameras, binoculars and other optical devices. It is also suitable for
Connor-Winfield’s 5 mm x 3.2 mm M Series TCXOs/VCTCXOs are designed for use in Stratum 3 applications, GPS receivers, instrumentation, femtocell, FTTH and FTTC or any other application requiring tight frequency stability in a small package. Through the use of
Agilent Technologies introduced a low-power double data rate (LPDDR) ball grid array (BGA) probe for oscilloscopes and logic analyzers. The LPDDR BGA probe provides signal access points for LPDDR and mobile-DDR synchronous dynamic random access memory (SDRAM) for electrical, timing and protocol characterization. It is appropriate at the
National Instruments introduced the NI Measurement Suite for Fixed WiMAX (IEEE 802.16-2004), a software suite that can be used to configure software-defined PXI RF measurement systems. With this suite, engineers can test WiMAX base stations and mobile subscriber stations as well as components such as
Vishay Intertechnology, Inc. released 300-W, 600-W, and 800-W thick film power resistors featuring a small size and a broad range of resistance values. The LPS300, LPS600, and LPS800 devices are non-inductive (<0.1 µH) and provide a resistance range of 0.3 Ohms to 900 kOhms. Featuring
E-Switch introduced the TS2 Series, subminiature switch featuring surface mount termination. Its small package size is designed for higher reliability applications and its SMT design suits it for many board-level applications. Specifications include
Targeting military, avionics, and high-end industrial applications, the PowerlinePlus Series of DC/DC converters from Recom boast operating efficiencies of 90% and higher. The devices are available with ratings from 20 to 50 W.
Provided in a DB-9 form-factor shell, the CE-USB integrated USB2.0-to-RS232 adapter can add a USB interface to legacy serial products without hardware or software redesign requirements.
A fast-mate version of the 2-mm pitch J-Tek Datamate cable-to-cable, cable-to-board, and board-to-board connector family, the 101Lok Datamate connectors from Harwin require a 101-degree quarter turn to secure the retention device.
In the early 1950s, as the advent of television threatened the supremacy of movies, 3-D was hailed as the future of cinema, the magic solution to Hollywood's postwar slump. Now, in 2009, 3-D is once again being hailed as the savior of cinema, but no one has the guts to call it a gimmick.
The Robotics and Mechanisms Laboratory (RoMeLa) of the College of Engineering at Virginia Tech has developed a unique robotic hand that can firmly hold objects as heavy as a can of food or as delicate as a raw egg, while dexterous enough to gesture for sign language.
Available in battery-powered and AC-line powered versions, the high-voltage EC104 and low-voltage EC106 digital PWM motor controls from LCR Electronics provide speed and torque control as well as bi-directional operation and overload protection.
Addressing 3D integration of CMOS ICs into devices such as photo sensors, gas sensors, power devices, or MEMS components, the Through Silicon Via (TSV) technology from austriamicrosystems two eight-inch wafers can be electrically connected, with typical TSV depths of 200 µm to 300 µm.