Elma Bustronic Corp. announced its MicroTCA backplane in the cube style format that features six AdvancedMC, one MicroTCA carrier hub and one power module slot. This backplane has a Star topology, and it fits in a 4U wide cube-style MicroTCA portable enclosure. The backplane also features a JSM (J-Tag switch module) slot, and it has connections at the bottom for a cooling unit and at the top for temperature sensors.
ITT Electronic Components introduces its VEAM VSC Series threaded coupling, 19-pin, cylindrical connector for entertainment lighting applications. The connectors are sealed to IP 67 when mated, have a black, hard anodized, non-conductive finish for scratch and wear resistance, and they feature a heavy-duty, ribbed coupling nut to provide easy mating and un-mating. They are rated to 700V DC and 500V AC.
Turck added the DeviceNet Drive Interface station to its line of DeviceNet I/O stations. The station is designed for use where adjustable frequency drives need to be interfaced onto a DeviceNet network, and it is capable of supporting up to four stand-alone adjustable frequency drives on the network. The station’s small size makes it appropriate for upgrading existing adjustable frequency drives in the automotive, pharmaceutical, chemical and material handling industries.The housing is constructed of glass-filled nylon that provides an IP 20 protection rating.
CSR launched its sixth generation of BlueCore silicon for Bluetooth. BlueCore6 includes both full support for the latest version of the Bluetooth specification (v2.1+EDR) plus the company’s AuriStream technology, which provides toll quality voice calls and is capable of a 40 percent reduction in power consumption in BlueCore6-ROM as compared with standard Bluetooth voice transmission methods, according to the company. The IC provides BlueCore6 Class 1 Bluetooth range
Winbond Electronics announced what is said to be the industry’s first Serial Flash memory with Quad-SPI (Serial Peripheral Interface). The W25Q16 16-megabit SpiFlash® Memory is the first in a family of high-performance memories ranging from 8 to 64 megabits, and features single, dual and quad I/Os in 8-pin packaging. According to the company, the W25Q16’s Quad-SPI architecture allows for greater than six times the performance of the current generation of Serial Flash memories and offers a true code-execution (XIP) alternative to Parallel-NOR Flash.
Cicoil announces its custom shaped flat silicone cables that allow for precise cable routing without folding, kinking or pinching. The custom shapes also contribute to the elimination of signal failures due to physical stress at the cable connector. Stressing miniaturization and space efficiency, this cable has applications in medical diagnostic equipment, motion control robotics, marine electronics and the automotive industry.
Nextreme developed a miniature, thin film thermoelectric generator (TEG) that converts heat directly into electricity. Ideal for waste heat conversion applications, the solid state TEG delivers power generation densities (>3W/cm2) in excess of those achieved using bulk materials and is optimized to provide power in a form factor that can be as much as 20x thinner than bulk material alternatives, according to the company. Manufactured using semiconductor fabrication techniques, the TEG is scalable, cost-effective, and can be utilized in a broad range of markets and applications
ERNI Electronics announces its line of modular jack components to include low profile versions with integrated magnetic filters. These compact network connectors for heavy-duty applications are resistant to electromagnetic faults, and they are designated for use in compact RJ45 applications compliant with 10/100 or 10/100/1000 Base-T (gigabit) Ethernet.
Tektronix announced new TLA7S16 and TLA7S08 Serial Analyzers for test and validation of PCI Express (PCIe) 1.0 and 2.0 designs. The devices provide detailed PCIe 2.0 protocol information along with cross-bus analysis. The new analyzers plug into the company’s TLA7000 Series logic analyzers, adding the ability to debug and correlate general purpose signals and other system interconnects including memory and computer processors.
Binder-USA announces it’s M8 protective caps that ensure a protection rating of IP67 when applied to unmated connectors. These caps are suitable for use in factory automation and process control applications. They feature a PA (polyamide) body, PUR (polyurethane) retaining strap and a nitrile rubber (NBR) seal.
Turck, Inc. announces its 26 and 28-pin molded M27 multifast connectors that can be used to provide power and signals to factory automation equipment in the automotive, semiconductor and material handling industries. They are replacements for D-Sub (DB-25) style connectors in industrial settings where DB-25 connectors are limited to 30V and low current.
TEKO launched its MINITEKAL range of miniature aluminium enclosures. These versatile and robust housings have been designed for easy assembly of the electronics. The all-aluminium design allows good levels of EMC protection to be implemented. Typical applications will include small hand-held measurement devices, low power Radio equipment, power supplies, peripherals, monitoring systems and detection devices.
QuickLogic announced an integrated programmable connectivity solution platform targeting mobile devices. The revolutionary ArcticLink platform embeds high performance controllers, a programmable fabric for implementing additional controllers and peripheral connectivity, as well as a selectable processor interface in a single, small form factor low power device.
SMSC announced the introduction of its new family of fan controllers, the EMC210x family, with four new devices (EMC2103, EMC2104, EMC2105 and EMC2106) featuring technologies that employ RPM closed-loop control and manage multiple temperatures. In addition, SMSC is launching three new SMBus temperature sensors (EMC1046, EMC1047 and EMC1428) for systems requiring a high level of temperature monitoring.
Gems Sensors & Controls introduced the 3100 Series Pressure Transducers which provide a full scale accuracy of 0.25 percent. Long term drift is limited to 0.1 percent over the full scale per year. This performance and stability is achieved using sputtered thin film sensing technology, and has less than 1" in diameter, weighing 32g