Mill-Max introduces SIP and STRIP male pin headers which feature sturdy .040" diameter leads and mate to the company’s standard SIP and STRIP female sockets. The double-row connector is offered standard in 8 (2 × 4) up to 100 (2 × 50) position configurations on .100" spacing. This pairing creates a high-current interconnect rated at 8A per position. When mated, these connectors create a high force, stiff and rugged interconnection between two boards or modules which resists separation and walkout
Luxtera, Inc. introduced a 40 Gigabit optical active cable (OAC), Blazar, which is said to be the world’s first CMOS Photonics product. The cable combines the characteristics optical modules and copper cables to provide a high bandwidth interconnect. The target markets are high performance computing InfiniBand and 40G proprietary rack to rack interconnect applications. With support for quad data rate (QDR), Blazar’s 40G bandwidth and extended reach of up to 300m overcomes the speed and range barriers that have limited InfiniBand applications to small computer clusters.
CML Microcircuits announced the RALCWI (Robust Advanced Low Complexity Waveform Interpolation) vocoder IC. The product is the result of a co-operation between CML Microcircuits and SPIRIT DSP. The CMX618 is a flexible, half-duplex, highly integrated RALCWI vocoder IC suited to both wireless and wireline voice applications such as voice scramblers, alarm systems, military field applications and digital professional/leisure two-way radios (DMR/dPMR).
Tech-Etch, Inc. introduced EMI shielded honeycomb vents, fan vents, quiet vents and air filters in all shapes and sizes. Honeycomb vents are offered in both standard and custom configurations. Nine different aluminum vent styles are offered, and additional shielding gaskets can be added to increase attenuation
Mill-Max introduces its family of SPDIP mating pin headers to compliment its line of SPDIP sockets. SPDIP (shrink plastic) packaging reduces device lead spacing between pins down to .070" pitch (1.778 mm) which is useful in memory, microcontrollers, video controllers and automotive design applications.
Texas Instruments introduced miniature 2.25 MHz, step-down DC/DC converters, which support low-power DSPs and microcontroller-based portable electronics. Said to extend battery life in Bluetooth headsets, cell phones and other Li-Ion battery-powered applications, the converters also save board space. These 300 mA, 600 mA and 1A synchronous, step-down DC/DC converters can efficiently regulate output voltages down to 0.6V with ±1.5 percent accuracy.
Xilinx added power efficient Spartan-3A DSP devices to its XtremeDSP portfolio for signal processing applications. The devices offer DSP capabilities in a low-power FPGA for applications such as tactical radios for military communications, wireless access points and portable medical equipment. The Spartan-3A DSP low power (LP) devices are said to deliver a 50 percent static power savings, and a 70 percent savings while in suspend mode, compared to the standard devices, and they are available in industrial rated grades.
Endicott Interconnect Technologies’ HyperBGA PTFE-based coreless semiconductor package enables silicon devices to run at high speeds. The combination of the low loss, low dielectric constant material and strip line cross sections enables signal speeds surpassing 12 Gb/s. The material compliance of the PTFE, combined with the dimensional stability of a copper-invar-copper center plane
Phoenix Contact releases its QC (Quick Connect) 1.5 plugs, an insulation displacement connection (IDC)-based plug for use in an expanded range of wire gauges. They offer flexibility in wire selections (24 AWG to 16 AWG), they are designed on a 5 mm pitch (centerline) spacing and they come with or without mounting flanges. The plugs mate with proprietary 5 mm headers, enabling vertical, horizontal or lengthwise PCB mounting for wider range flexibility.
Kinetic Systems introduces high-performance breadboards that provide a flat, stable surface for a variety of applications that include mounting or assembling lasers, small optical systems, prototyping and precise inspections. Available in four standard configurations, these breadboards feature high natural frequency, nominal broadband damping, and flatness of ±0.004" over a 24" × 24" area.
Elmo Motion Control introduced three miniature servo drives that support up to 2,400W. The new Whistle servo drives achieve high power density coupled with SimplIQ intelligence and are available in the following additional models: WHI-15/60 (15A, 60VDC), WHI-10/100 (10A, 100V), WHI-15/100 (15A, 100V). By integrating the company’s FASST (Fast And Soft Switching Technology) power management technology with thermal management technology, the miniature Whistle exhibits a power density of 35 W/cm3.
Laird Technologies announces that 31 fingerstock standard products made from Recyclable Clean Copper (RCC) that offer similar performance characteristics to beryllium copper (BeCu) products, and they will work in 80 percent of all applications where BeCu is now used. RCC products do not contain beryllium, giving customers who want to avoid the use of beryllium containing metals a choice in alloy selections
Haydon Switch & Instrument, Inc. announces its size 11 hybrid linear actuators with an integrated connector. Offered alone or with a harness assembly, this connector is RoHS compliant and features a positive latch in order for high connection integrity. The connector is rated up to 3A and the mating connector will handle a range of wire gauges from 22 to 28.
Texas Instruments Incorporated introduced what is said to be the industry’s lowest power zero-crossover operational amplifier (op amp). Featuring a unique single-input-stage architecture, the OPA369 achieves rail-to-rail performance without input crossover to solve the common design problem of input offset distortion due to the change in common mode voltage that is very prominent in low-voltage, rail-to-rail applications. Combined with 1µA quiescent current, SC70 package and operation down to
Anderson Power Products offers its multi-axial rotational connector (MARC). Suitable for medical and mobility applications, the MARC is designed to mate while traveling through an arc with a 3" minimum radius. It is rated to 30 while combining power, signal and ground circuitry into one package. Featuring eight Powerpole circuits integrated into a blind mate housing, the two-row horizontally oriented connector uses proprietary flat wiping contacts.