Products that operate over a wide temperature range can take advantage of the Winsystems PPM-GX, a PC/104-Plus-compatible single-board computer (SBC) based on the AMD GX500 processor which runs x86-compatible software. This SBC works with PC/104 and PC/104-Plus I/O modules and operates between -40° to +85°C without the need for a fan. The board offers the CPU and video, LPT, mouse, audio and keyboard controllers
The small packages -- down to 6×6 mm -- Microchip Technology uses for its newest PIC24F 16-bit microcontroller family do not compromise memory or I/O capabilities. The chips, available in 28- and 44-pin QFN packages, include 16 Kbytes to 64 Kbytes of flash program memory and as many as 8 Kbytes of SRAM. The PIC24FJ64GA004 family lets developers use a pin-mapping function to connect I/O devices to specific MCU pins as needed.
Hi-Tech Software has announced a new compilation technology that generates object code based on call- and pointer-reference graphs derived from all the modules in an embedded program. The new technology, called Omniscient Code Generation (OCG), overcomes problems in conventional compilers that can miss inconsistent calling conventions, variable declarations and redundant code because they compile each module independently and separately. OCG results in more easily ported code that is nearly 50 percent more dense than code from competing compilers.
The XPedite 8070 high performance 3U VPX-REDI single board computer (SBC) from Extreme Engineering Solutions is appropriate for ruggedized systems requiring high bandwidth processing and low power consumption. With two P.A. Semi PA6T cores running at up to 2 GHz while dissipating <17W, the PA6T-1682 provides desirable performance-per-Watt. The P.A. Semi PA6T-1682 PWRficient integrated platform processor combines dual PA6T cores with high performance communication to two DDR2 SDRAM channels and a variety of network interfaces.
Maplesoft announced the release of its Maple 11 system that features enhancements to its document interface, computation engine and connectivity capabilities to provide users with the technology to reduce error and to increase analytical productivity. Its smart document environment automatically captures all technical knowledge in an electronic form that integrates calculations, explanatory text and math, graphics, images and sound.
Emerson Network Power has announced the availability of what is said to be the industry’s smallest front-end power converter to date for use on latest-generation telecom cards. The Artesyn dual-input ATC210 bus converter has a 2.3¨ × 1.8¨ footprint and a typical full load efficiency of 89 percent, yielding a power density in excess of 60W per cubic inch. The converter is expressly designed for use in ATCA systems, and appropriate for many other space-constrained systems that employ distributed power architectures.
WinSystems has introduced its LBC-GX500, an integrated, single board computer (SBC) that is designed for machine-to-machine (M2M) applications with a variety of wired and wireless connectivity options. Among them are 802.11 wireless Ethernet, GSM/GPRS cellular modem, CDMA cellular modem, ZigBee wireless RF module, 10/100 wired Ethernet port, global-compliant dial-up modem, six USB ports and six COM channels on a single board.
Semtech announced the SX1211, a UHF radio frequency (RF) transceiver with a low receiver (RX) current consumption >3mA) for increased battery life in wireless sensor network applications. The SX1211 is optimized for asynchronous sensor network designs in the unlicensed industrial, scientific and medical (ISM) frequency bands (868 MHz to 870 MHz and 902 MHz to 928 MHz) where low RX power consumption is critical to battery life
Ramtron International extended its family of high-density F-RAM devices with a 2-megabit (Mb) parallel memory device. The FM21L16 is a 2 Mb, 3-volt, parallel nonvolatile RAM in a 44-pin TSOP-II package that features fast access, NoDelay writes, virtually unlimited read/write cycles, and low power consumption. Pin-compatible with asynchronous static RAM (SRAM),
ITT Electronic Components tested their Chip on Flex (CoF) filter connector technology to 1,000 cycles of thermal shock from -55°C to +125°C per MIL-STD-1344. The connector design provides desirable reliability and protection in harsh environments. In MIL-DTL-38999 configurations, the Chip on Flex connector has passed MIL-STD-1344 and MIL-DTL-38999 Series III testing for mechanical shock, random vibration, humidity and high altitude. The connector features
Keithley Instruments, Inc. has introduced a new line of PXI products designed for high-speed automated production testing as part of a hybrid test system using precision instruments. The new KPXI product line consists of simultaneous data acquisition boards, multifunction analog I/O boards, high speed analog output boards, a 130 MS/sec digitizer module, digital I/O modules, PXI chassis, embedded PC controllers, MXI bridges
Anritsu Company has introduced its MS2717A Economy Spectrum Analyzer that offers general purpose spectrum analysis over the 100 kHz to 7.1 GHz frequency range. In addition to its performance and capabilities in analyzing RF components used in the wireless, aerospace/defense and university markets, it also offers optional WCDMA/HSDPA RF test and WCDMA detailed demodulation
HDK-America has announced its piezo-resistive three-axis acceleration sensor that measures 3 mm × 3 mm × 1 mm. The HAAM-325B is 1/5th the size of the previous generation product, and it offers a fully comparable performance. Based on a silicon substrate and fabricated by means of a micro-machining MEMS technology
The SimScroll interface from White Electronic Designs (WEDC) is a circular switch array using the company’s SimTouch switch technology. It is suitable for products requiring effective navigation of large menu lists. Typical applications include universal remote control, MP3 players and A/V media system control. Using WEDC’s conductive ink technology, designers can create user interfaces
American Bright Optoelectronics introduced an ambient light sensor that duplicates the spectral response of the human eye. This will allow for the accurate control of backlight devices by controlling the brightness in relation to the ambient light conditions. The sensor has a peak response of 55 nm compared to a typical industry standard response curve that peaks in the infrared closer to 900 nm, according to the company.