Thermal interface material exhibits thermal conductivity of 1.10 W/m°K
Sarcon 30QR from Fujipoly is a low hardness thermal interface material that exhibits a thermal conductivity of 1.10 W/m°K and a thermal resistance of .57 °Cin2/W.
This material is available in roll or sheet form and can easily be die-cut, molded or extruded to accommodate your unique application specifications.
The versatility of Sarcon 30QR is evident in its use a conductive insulator for semiconductors, compression joining material for thermistors & temperature sensors, as well as a gap filler material for all types of heaters. This is V-0 flame-retardant thin film is recommended for applications with operational temperatures that range from -60°C to +180°C.