BNC edgeboard RF interconnects target broadcast and telecom applications
Bomar Interconnect Products announced the addition of high density BNC connectors to its E-Snap Series of edgeboard RF connectors. These 75-Ohm high density BNC interconnects are 51 percent smaller than traditional BNC devices, permitting four times the density, and 40 percent smaller than the DIN 1.0/2.3, according to the company. Using the proprietary E-Snap technology, the high density BNCs are manufactured with small protrusions inside their PCB slots, allowing connectors to "snap" and lock securely into solder-pasted holes when they are mounted to the PC board. Since they are held securely in place prior to reflow soldering, strain on the solder joint is significantly reduced. End launch mounting allows for optimal return loss capabilities and VSWR. Rated for use in 3G applications, Bomar's HDBNC E-Snap interconnects are suitable for high bandwidth connections in broadcast and digital video-HDTV applications. They are also appropriate for connections in video network routing and switching, and in any application in which standard BNCs connectors may be used.
Bomar Interconnect Products