QFP Test and Burn-In Socket Adds Moveable Ground Pin
Tue, 12/13/2011 - 11:37am
Yamaichi Electronics introduced the moveable ground pin for its popular Open Top socket series IC357 for QFP type IC packages with exposed pad in test & burn-in applications. With its gull-wing shaped lead feet surface mount, QFP is most tolerant towards vibration, flexing, warping and other stress applied to the PCB, making it an appropriate choice for industries that are operating in harsh conditions such as automotive. Yamaichi’s Open Top Socket Series IC357 features a reliable double lead foot contact, and a variety of ground pin and heat slug options is available. In particular the series offers no less than five different solutions to ground the QFP’s exposed pad either electrically or thermally or both in combination. The IC357’s unique design allows the center pin to actuate in conjunction with the movement of the push cover. While the push cover is being hold down, the center pin retracts completely to allow the package to be guided into its position. When the push cover is released, lead foot contacts are actuated first holding the package firmly in its plane before the center pin comes into action. This two step actuation ensures that the IC357 series remains auto load capable and reliable for all future test and burn-in applications.